TREA

Tianhua Yu

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  • San Jose, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Tungsten deposition
    • Patent number 12,077,858
    • Issue date Sep 3, 2024
    • Lam Research Corporation
    • Pragna Nannapaneni
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Rapid flush purging during atomic layer deposition
    • Patent number 12,060,639
    • Issue date Aug 13, 2024
    • Lam Research Corporation
    • Pragna Nannapaneni
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Atomic layer deposition on 3D NAND structures
    • Patent number 11,972,952
    • Issue date Apr 30, 2024
    • Lam Research Corporation
    • Ruopeng Deng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for void-free cobalt gap fill
    • Patent number 9,349,637
    • Issue date May 24, 2016
    • Lam Research Corporation
    • Jeong-Seok Na
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES
    • Publication number 20240266177
    • Publication date Aug 8, 2024
    • LAM RESEARCH CORPORATION
    • Ruopeng Deng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TUNGSTEN DEPOSITION
    • Publication number 20220364232
    • Publication date Nov 17, 2022
    • LAM RESEARCH CORPORATION
    • Pragna NANNAPANENI
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    RAPID FLUSH PURGING DURING ATOMIC LAYER DEPOSITION
    • Publication number 20220186370
    • Publication date Jun 16, 2022
    • LAM RESEARCH CORPORATION
    • Pragna Nannapaneni
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    ATOMIC LAYER DEPOSITION ON 3D NAND STRUCTURES
    • Publication number 20210335617
    • Publication date Oct 28, 2021
    • LAM RESEARCH CORPORATION
    • Ruopeng Deng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR VOID-FREE COBALT GAP FILL
    • Publication number 20160056074
    • Publication date Feb 25, 2016
    • LAM RESEARCH CORPORATION
    • Jeong-Seok Na
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...