Tien-Teng Chang

Person

Taoyuan Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation device
- Patent number 12,158,308
- Issue date Dec 3, 2024
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device with implant and method of manufacturing same
- Patent number 12,100,738
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,984,322
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Shun Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Dual dopant source/drain regions and methods of forming same
- Patent number 11,935,793
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved reliability
- Patent number 11,854,924
- Issue date Dec 26, 2023
- Mediatek Inc.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional heat dissipating device
- Patent number 11,698,229
- Issue date Jul 11, 2023
- AURAS TECHNOLOGY CO., LTD.
- Chih-Wei Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device with implant and method of manufacturing same
- Patent number 11,670,683
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantation and annealing for semiconductor device
- Patent number 11,640,986
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and methods of forming
- Patent number 11,450,757
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,367,621
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with implant and method of manufacturing same
- Patent number 11,088,249
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantation and annealing for semiconductor device
- Patent number 11,056,573
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and methods of forming
- Patent number 10,770,570
- Issue date Sep 8, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask formation by selectively removing portions of a layer that hav...
- Patent number 10,714,344
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 10,510,619
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask formation by selectively removing portions of a layer that hav...
- Patent number 10,460,940
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
finFET device and methods of forming
- Patent number 10,115,808
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for fisheye camera automatic calibration
- Patent number 9,990,739
- Issue date Jun 5, 2018
- National Chiao Tung University
- Jen-Hui Chuang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device allowing metal layer routing formed directly u...
- Patent number 9,847,294
- Issue date Dec 19, 2017
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoding apparatus and method for decoding a serially transmitted s...
- Patent number 9,722,630
- Issue date Aug 1, 2017
- Andes Technology Corporation
- Zhong-Ho Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device allowing metal layer routing formed directly u...
- Patent number 9,627,336
- Issue date Apr 18, 2017
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device allowing metal layer routing formed directly u...
- Patent number 9,455,226
- Issue date Sep 27, 2016
- Mediatek Inc.
- Chun-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing apparatus for light emitting diodes
- Patent number 9,429,617
- Issue date Aug 30, 2016
- Chroma Ate Inc.
- I-Shih Tseng
- G01 - MEASURING TESTING
Information Patent Grant
Enhanced object detection method using image discontinuousness
- Patent number 9,152,855
- Issue date Oct 6, 2015
- Qnap Systems, Inc.
- Tien Lung Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit chip with reduced IR drop
- Patent number 8,766,417
- Issue date Jul 1, 2014
- MediaTek Inc.
- Chao-Chun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with multi-layer contact etch stop layer st...
- Patent number 8,669,619
- Issue date Mar 11, 2014
- MediaTek Inc.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die seal ring structure
- Patent number 8,587,090
- Issue date Nov 19, 2013
- Mediatek Inc.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relaxed silicon germanium substrate with low defect density
- Patent number 8,564,018
- Issue date Oct 22, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Chich Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with reduced IR drop
- Patent number 8,476,745
- Issue date Jul 2, 2013
- MediaTek Inc.
- Chao-Chun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple power supplies balance system
- Patent number 8,331,117
- Issue date Dec 11, 2012
- Zippy Technology Corp.
- Tsun-Te Shih
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
STACKED MULTI-GATE DEVICE WITH DIFFUSION STOPPING LAYER AND MANUFAC...
- Publication number 20240413155
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Dopant Source/Drain Regions and Methods of Forming Same
- Publication number 20240379446
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Complementary Field Effect Transistors and Methods of Forming the Same
- Publication number 20240258387
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Syuan Siao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258114
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240055300
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE PROFILE MODULATION FOR SEMICONDUCTOR DEVICE
- Publication number 20230387251
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Warm Wafer After Ion Cryo-Implantation
- Publication number 20230377913
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Forming the Same
- Publication number 20230268423
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Implant and Method of Manufacturing Same
- Publication number 20230261055
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE VAPOR CHAMBER
- Publication number 20230156968
- Publication date May 18, 2023
- AURAS Technology Co., Ltd.
- Chih-Wei CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20230065137
- Publication date Mar 2, 2023
- AURAS Technology Co., Ltd.
- Chih-Wei CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD FOR ION IMPLANTATION UNIFORMITY CONTROL
- Publication number 20230016619
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Dopant Source/Drain Regions and Methods of Forming Same
- Publication number 20220359301
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220262644
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR MODULATING IMMUNITY AND THE USE THEREOF
- Publication number 20220184152
- Publication date Jun 16, 2022
- Lytone Enterprise, Inc.
- Chia-Shin HO
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR PACKAGE WITH IMPROVED RELIABILITY
- Publication number 20220181228
- Publication date Jun 9, 2022
- MEDIATEK INC.
- Tien-Chang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN VAPOR CHAMBER
- Publication number 20220071060
- Publication date Mar 3, 2022
- AURAS Technology Co., Ltd.
- Chih-Wei CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WARM WAFER AFTER ION CRYO-IMPLANTATION
- Publication number 20220028707
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL HEAT DISSIPATING DEVICE
- Publication number 20220018608
- Publication date Jan 20, 2022
- AURAS Technology Co., Ltd.
- Chih-Wei CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THREE-DIMENSIONAL HEAT DISSIPATING DEVICE
- Publication number 20220018609
- Publication date Jan 20, 2022
- AURAS Technology Co., Ltd.
- Chih-Wei CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VAPOR CHAMBER
- Publication number 20220015265
- Publication date Jan 13, 2022
- AURAS Technology Co., Ltd.
- Chih-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210391182
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tien-Shun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL DOPANT SOURCE/DRAIN REGIONS AND METHODS OF FORMING SAME
- Publication number 20210375687
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Implant and Method of Manufacturing Same
- Publication number 20210367038
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION AND ANNEALING FOR SEMICONDUCTOR DEVICE
- Publication number 20210328044
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER
- Publication number 20210215435
- Publication date Jul 15, 2021
- AURAS Technology Co., Ltd.
- Chih-Wei CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Semiconductor Device with Implant and Method of Manufacturing Same
- Publication number 20210083056
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Device and Methods of Forming
- Publication number 20200411672
- Publication date Dec 31, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Implantation and Annealing for Semiconductor Device
- Publication number 20200395462
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER
- Publication number 20200355445
- Publication date Nov 12, 2020
- AURAS Technology Co., Ltd.
- CHIH-WEI CHEN
- F28 - HEAT EXCHANGE IN GENERAL

Tien-Teng Chang

Person

Patents Grantslast 30 patents

Heat dissipation device

Semiconductor device with implant and method of manufacturing same

Semiconductor device and manufacturing method thereof

Dual dopant source/drain regions and methods of forming same

Semiconductor package with improved reliability

Three-dimensional heat dissipating device

Semiconductor device with implant and method of manufacturing same

Implantation and annealing for semiconductor device

FinFET device and methods of forming

Semiconductor device and manufacturing method thereof

Semiconductor device with implant and method of manufacturing same

Implantation and annealing for semiconductor device

FinFET device and methods of forming

Mask formation by selectively removing portions of a layer that hav...

Semiconductor structure and method for manufacturing the same

Mask formation by selectively removing portions of a layer that hav...

finFET device and methods of forming

Method and device for fisheye camera automatic calibration

Semiconductor device allowing metal layer routing formed directly u...

Decoding apparatus and method for decoding a serially transmitted s...

Semiconductor device allowing metal layer routing formed directly u...

Semiconductor device allowing metal layer routing formed directly u...

Testing apparatus for light emitting diodes

Enhanced object detection method using image discontinuousness

Integrated circuit chip with reduced IR drop

Semiconductor structure with multi-layer contact etch stop layer st...

Die seal ring structure

Relaxed silicon germanium substrate with low defect density

Integrated circuit chip with reduced IR drop

Multiple power supplies balance system

Patents Applicationslast 30 patents

STACKED MULTI-GATE DEVICE WITH DIFFUSION STOPPING LAYER AND MANUFAC...

Dual Dopant Source/Drain Regions and Methods of Forming Same

Complementary Field Effect Transistors and Methods of Forming the Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

GATE PROFILE MODULATION FOR SEMICONDUCTOR DEVICE

Warm Wafer After Ion Cryo-Implantation

Semiconductor Device and Methods of Forming the Same

Semiconductor Device with Implant and Method of Manufacturing Same

FLEXIBLE VAPOR CHAMBER

HEAT DISSIPATION DEVICE

METHOD FOR ION IMPLANTATION UNIFORMITY CONTROL

Dual Dopant Source/Drain Regions and Methods of Forming Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COMPOSITION FOR MODULATING IMMUNITY AND THE USE THEREOF

SEMICONDUCTOR PACKAGE WITH IMPROVED RELIABILITY

THIN VAPOR CHAMBER

WARM WAFER AFTER ION CRYO-IMPLANTATION

THREE-DIMENSIONAL HEAT DISSIPATING DEVICE

THREE-DIMENSIONAL HEAT DISSIPATING DEVICE

VAPOR CHAMBER

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DUAL DOPANT SOURCE/DRAIN REGIONS AND METHODS OF FORMING SAME

Semiconductor Device with Implant and Method of Manufacturing Same

IMPLANTATION AND ANNEALING FOR SEMICONDUCTOR DEVICE

VAPOR CHAMBER

Semiconductor Device with Implant and Method of Manufacturing Same

FinFET Device and Methods of Forming

Implantation and Annealing for Semiconductor Device

VAPOR CHAMBER