Timothy H. Daubenspeck

Person

Colchester, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 10,699,972
- Issue date Jun 30, 2020
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 10,049,897
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 9,899,279
- Issue date Feb 20, 2018
- International Business Machines Corporation
- William E. Bernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug via formation with grid features in the passivation layer
- Patent number 9,633,962
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to prevent solder extrusion
- Patent number 9,613,921
- Issue date Apr 4, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-resistant solder interconnect structures and methods of f...
- Patent number 9,607,862
- Issue date Mar 28, 2017
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an interconnect level having a conduct...
- Patent number 9,397,054
- Issue date Jul 19, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing misshaped solder balls
- Patent number 9,331,037
- Issue date May 3, 2016
- GLOBALFOUNDRIES, INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with pyramid or cone-shaped conductive pads...
- Patent number 9,269,683
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor test wafer and methods for use thereof
- Patent number 9,257,352
- Issue date Feb 9, 2016
- GLOBALFOUNDRIES, INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor using barrier layer metallurgy
- Patent number 9,231,046
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods of manufacture
- Patent number 9,230,929
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated crackstop
- Patent number 9,190,318
- Issue date Nov 17, 2015
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensating for warpage of a flip chip package by varying heights...
- Patent number 9,165,850
- Issue date Oct 20, 2015
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dice before grind with backside metal
- Patent number 9,165,831
- Issue date Oct 20, 2015
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plug via formation by patterned plating and polishing
- Patent number 9,159,696
- Issue date Oct 13, 2015
- GLOBALFOUNDRIES, INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer edge conditioning for thinned wafers
- Patent number 9,105,465
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Timothy Harrison Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for improving solder bump connections in sem...
- Patent number 9,087,754
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensating for warpage of a flip chip package by varying heights...
- Patent number 9,059,106
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable buried layer for 3-D fabrication and methods of manufact...
- Patent number 9,040,390
- Issue date May 26, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structures for improving current carrying capability of interconnec...
- Patent number 9,035,459
- Issue date May 19, 2015
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Solder interconnect with non-wettable sidewall pillars and methods...
- Patent number 9,018,760
- Issue date Apr 28, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, semiconductor structure and method of manufacturing a se...
- Patent number 9,000,585
- Issue date Apr 7, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump connection and method of making
- Patent number 8,994,173
- Issue date Mar 31, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat laminate, symmetrical test structures and method of use to gau...
- Patent number 8,957,531
- Issue date Feb 17, 2015
- International Business Machines Corporation
- William E. Bernier
- G01 - MEASURING TESTING
Information Patent Grant
Far back end of the line metallization method and structures
- Patent number 8,937,009
- Issue date Jan 20, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal via for 3D integrated circuits structures
- Patent number 8,933,540
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for forming an aluminum fuse for compatibility wi...
- Patent number 8,927,411
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overcoming chip warping to enhance wetting of solder bumps and flip...
- Patent number 8,927,334
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures and methods of manufacture
- Patent number 8,927,869
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...
- Publication number 20180082912
- Publication date Mar 22, 2018
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...
- Publication number 20170148754
- Publication date May 25, 2017
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTING MISSHAPED SOLDER BALLS
- Publication number 20160043048
- Publication date Feb 11, 2016
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTEGRATED CRACKSTOP
- Publication number 20160027744
- Publication date Jan 28, 2016
- GLOBALFOUNDRIES INC.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING
- Publication number 20150325540
- Publication date Nov 12, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO PREVENT SOLDER EXTRUSION
- Publication number 20150108642
- Publication date Apr 23, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CRACKSTOP
- Publication number 20150108645
- Publication date Apr 23, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG VIA FORMATION WITH GRID FEATURES IN THE PASSIVATION LAYER
- Publication number 20150097283
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING
- Publication number 20150076688
- Publication date Mar 19, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTING MISSHAPED SOLDER BALLS
- Publication number 20150048502
- Publication date Feb 19, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATING FOR WARPAGE OF A FLIP CHIP PACKAGE BY VARYING HEIGHTS...
- Publication number 20150044864
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...
- Publication number 20150041977
- Publication date Feb 12, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CONNECTION STRUCTURE AND METHOD OF FORMING
- Publication number 20150037971
- Publication date Feb 5, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...
- Publication number 20150036716
- Publication date Feb 5, 2015
- International Business Machines Corporation
- William E. Bernier
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHODS OF MANUFACTURE
- Publication number 20150021793
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Timothy H. DAUBENSPECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP CONNECTION AND METHOD OF MAKING
- Publication number 20150001712
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICE BEFORE GRIND WITH BACKSIDE METAL
- Publication number 20150001683
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES
- Publication number 20140319522
- Publication date Oct 30, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TEST WAFER AND METHODS FOR USE THEREOF
- Publication number 20140266292
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR USING BARRIER LAYER METALLURGY
- Publication number 20140264741
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL VIA FOR 3D INTEGRATED CIRCUITS STRUCTURES
- Publication number 20140239457
- Publication date Aug 28, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...
- Publication number 20140187034
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPENSATING FOR WARPAGE OF A FLIP CHIP PACKAGE BY VARYING HEIGHTS...
- Publication number 20140117535
- Publication date May 1, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FORMING AN ALUMINUM FUSE FOR COMPATIBILITY WI...
- Publication number 20140106559
- Publication date Apr 17, 2014
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPLANAR WAVEGUIDE FOR STACKED MULTI-CHIP SYSTEMS
- Publication number 20140097524
- Publication date Apr 10, 2014
- International Business Machines Corporation
- Timothy H. DAUBENSPECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERCOMING CHIP WARPING TO ENHANCE WETTING OF SOLDER BUMPS AND FLIP...
- Publication number 20140084453
- Publication date Mar 27, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...
- Publication number 20140077367
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF MAKING AN OFFSET-TRENCH CRACKSTOP THAT FORM...
- Publication number 20140077383
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...
- Publication number 20140070401
- Publication date Mar 13, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND SPLASH CONTAINMENT
- Publication number 20140061933
- Publication date Mar 6, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS

Timothy H. Daubenspeck

Person

Patents Grantslast 30 patents

Flat laminate, symmetrical test structures and method of use to gau...

Extrusion-resistant solder interconnect structures and methods of f...

Flat laminate, symmetrical test structures and method of use to gau...

Plug via formation with grid features in the passivation layer

Structure to prevent solder extrusion

Extrusion-resistant solder interconnect structures and methods of f...

Semiconductor structure with an interconnect level having a conduct...

Preventing misshaped solder balls

Integrated circuit chip with pyramid or cone-shaped conductive pads...

Semiconductor test wafer and methods for use thereof

Capacitor using barrier layer metallurgy

Semiconductor structures and methods of manufacture

Method of forming an integrated crackstop

Compensating for warpage of a flip chip package by varying heights...

Dice before grind with backside metal

Plug via formation by patterned plating and polishing

Wafer edge conditioning for thinned wafers

Structures and methods for improving solder bump connections in sem...

Compensating for warpage of a flip chip package by varying heights...

Releasable buried layer for 3-D fabrication and methods of manufact...

Structures for improving current carrying capability of interconnec...

Solder interconnect with non-wettable sidewall pillars and methods...

Structure, semiconductor structure and method of manufacturing a se...

Solder bump connection and method of making

Flat laminate, symmetrical test structures and method of use to gau...

Far back end of the line metallization method and structures

Thermal via for 3D integrated circuits structures

System and method for forming an aluminum fuse for compatibility wi...

Overcoming chip warping to enhance wetting of solder bumps and flip...

Semiconductor structures and methods of manufacture

Patents Applicationslast 30 patents

FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...

EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...

PREVENTING MISSHAPED SOLDER BALLS

METHOD OF FORMING AN INTEGRATED CRACKSTOP

PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING

STRUCTURE TO PREVENT SOLDER EXTRUSION

INTEGRATED CRACKSTOP

PLUG VIA FORMATION WITH GRID FEATURES IN THE PASSIVATION LAYER

PLUG VIA FORMATION BY PATTERNED PLATING AND POLISHING

PREVENTING MISSHAPED SOLDER BALLS

COMPENSATING FOR WARPAGE OF A FLIP CHIP PACKAGE BY VARYING HEIGHTS...

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEM...

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

FLAT LAMINATE, SYMMETRICAL TEST STRUCTURES AND METHOD OF USE TO GAU...

SEMICONDUCTOR STRUCTURES AND METHODS OF MANUFACTURE

SOLDER BUMP CONNECTION AND METHOD OF MAKING

DICE BEFORE GRIND WITH BACKSIDE METAL

FAR BACK END OF THE LINE METALLIZATION METHOD AND STRUCTURES

SEMICONDUCTOR TEST WAFER AND METHODS FOR USE THEREOF

CAPACITOR USING BARRIER LAYER METALLURGY

THERMAL VIA FOR 3D INTEGRATED CIRCUITS STRUCTURES

INTEGRATED CIRCUIT CHIP WITH PYRAMID OR CONE-SHAPED CONDUCTIVE PADS...

COMPENSATING FOR WARPAGE OF A FLIP CHIP PACKAGE BY VARYING HEIGHTS...

SYSTEM AND METHOD FOR FORMING AN ALUMINUM FUSE FOR COMPATIBILITY WI...

COPLANAR WAVEGUIDE FOR STACKED MULTI-CHIP SYSTEMS

OVERCOMING CHIP WARPING TO ENHANCE WETTING OF SOLDER BUMPS AND FLIP...

SOLDER INTERCONNECT WITH NON-WETTABLE SIDEWALL PILLARS AND METHODS...

STRUCTURE AND METHOD OF MAKING AN OFFSET-TRENCH CRACKSTOP THAT FORM...

EXTRUSION-RESISTANT SOLDER INTERCONNECT STRUCTURES AND METHODS OF F...

WIRE BOND SPLASH CONTAINMENT