Timothy J. Allen

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Assembly method for semiconductor die and lead frame
- Patent number 7,112,252
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for securing bussing leads
- Patent number 6,737,734
- Issue date May 18, 2004
- Micron Technology, Inc.
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for coupling a semiconductor die to die terminals
- Patent number 6,699,734
- Issue date Mar 2, 2004
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction feature for LOC lead frame
- Patent number 6,635,954
- Issue date Oct 21, 2003
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for stress reduction feature for LOC lead frame
- Patent number 6,610,162
- Issue date Aug 26, 2003
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for coupling a semiconductor die to die terminals
- Patent number 6,600,215
- Issue date Jul 29, 2003
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for coupling a semiconductor die to die terminals
- Patent number 6,579,746
- Issue date Jun 17, 2003
- Micron Technology, Inc.
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a single-deposition-layer-metal dynamic random acc...
- Patent number 6,569,727
- Issue date May 27, 2003
- Micron Technology, Inc.
- Stephen L. Casper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid frame with lead-lock tape
- Patent number 6,545,343
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction feature for LOC lead frame
- Patent number 6,396,131
- Issue date May 28, 2002
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single deposition layer metal dynamic random access memory
- Patent number 6,388,314
- Issue date May 14, 2002
- Micron Technology, Inc.
- Stephen L. Casper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable heat sink bumpers on a quad flat package
- Patent number 6,349,034
- Issue date Feb 19, 2002
- Micron Technology, Inc.
- Timothy J. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress reduction feature for LOC lead frame
- Patent number 6,277,225
- Issue date Aug 21, 2001
- Micron Technology, Inc.
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single deposition layer metal dynamic random access memory
- Patent number 6,274,928
- Issue date Aug 14, 2001
- Micron Technology, Inc.
- Stephen L. Casper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable heat sink bumpers on a quad flat package
- Patent number 6,252,772
- Issue date Jun 26, 2001
- Micron Technology, Inc.
- Timothy J. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid frame with lead-lock tape
- Patent number 6,251,708
- Issue date Jun 26, 2001
- Micron Technology, Inc.
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid frame with lead-lock tape
- Patent number 6,146,922
- Issue date Nov 14, 2000
- Micron Technology, Inc.
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid frame with lead-lock tape
- Patent number 6,008,531
- Issue date Dec 28, 1999
- Micron Technology, Inc.
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single deposition layer metal dynamic random access memory
- Patent number 5,907,166
- Issue date May 25, 1999
- Micron Technology, Inc.
- Stephen L. Casper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid frame with lead-lock tape
- Patent number 5,897,340
- Issue date Apr 27, 1999
- Micron Technology, Inc.
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid frame with lead-lock tape
- Patent number 5,717,246
- Issue date Feb 10, 1998
- Micron Technology, Inc.
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-mounting paddle for mechanical stress reduction in plastic IC p...
- Patent number 5,021,864
- Issue date Jun 4, 1991
- Micron Technology, Inc.
- Douglas M. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigitized leadframe strip
- Patent number 4,949,161
- Issue date Aug 14, 1990
- Micron Technology, Inc.
- Timothy J. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a series of leadframe strip carriers having...
- Patent number 4,910,866
- Issue date Mar 27, 1990
- Micron Technology, Inc.
- Timothy J. Allen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Assembly method for semiconductor die and lead frame
- Publication number 20070000599
- Publication date Jan 4, 2007
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for stress reduction feature for LOC lead frame
- Publication number 20040056336
- Publication date Mar 25, 2004
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method for securing bussing leads
- Publication number 20030205789
- Publication date Nov 6, 2003
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for coupling a semiconductor die to die terminals
- Publication number 20030113953
- Publication date Jun 19, 2003
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress reduction feature for LOC lead frame
- Publication number 20020113299
- Publication date Aug 22, 2002
- Larry D. Kinsman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for coupling a semiconductor die to die terminals
- Publication number 20010052638
- Publication date Dec 20, 2001
- Aaron Schoenfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removable heat sink bumpers on a quad flat package
- Publication number 20010028553
- Publication date Oct 11, 2001
- Timothy J. Allen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid frame with lead-lock tape
- Publication number 20010016373
- Publication date Aug 23, 2001
- Jerry M. Brooks
- H01 - BASIC ELECTRIC ELEMENTS

Timothy J. Allen

Person

Patents Grantslast 30 patents

Assembly method for semiconductor die and lead frame

Structure and method for securing bussing leads

Method and apparatus for coupling a semiconductor die to die terminals

Stress reduction feature for LOC lead frame

Methods for stress reduction feature for LOC lead frame

Method and apparatus for coupling a semiconductor die to die terminals

Method and apparatus for coupling a semiconductor die to die terminals

Method of making a single-deposition-layer-metal dynamic random acc...

Hybrid frame with lead-lock tape

Stress reduction feature for LOC lead frame

Single deposition layer metal dynamic random access memory

Removable heat sink bumpers on a quad flat package

Stress reduction feature for LOC lead frame

Single deposition layer metal dynamic random access memory

Removable heat sink bumpers on a quad flat package

Hybrid frame with lead-lock tape

Hybrid frame with lead-lock tape

Hybrid frame with lead-lock tape

Single deposition layer metal dynamic random access memory

Hybrid frame with lead-lock tape

Hybrid frame with lead-lock tape

Die-mounting paddle for mechanical stress reduction in plastic IC p...

Interdigitized leadframe strip

Method of manufacturing a series of leadframe strip carriers having...

Patents Applicationslast 30 patents

Assembly method for semiconductor die and lead frame

Methods for stress reduction feature for LOC lead frame

Structure and method for securing bussing leads

Method and apparatus for coupling a semiconductor die to die terminals

Stress reduction feature for LOC lead frame

Method and apparatus for coupling a semiconductor die to die terminals

Removable heat sink bumpers on a quad flat package

Hybrid frame with lead-lock tape