Timothy L. Wells

Person

Apalachin, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective shield/material flow mechanism
- Patent number 7,425,256
- Issue date Sep 16, 2008
- International Business Machines Corporation
- Ralph A. Barrese
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Selective shield/material flow mechanism
- Patent number 7,288,177
- Issue date Oct 30, 2007
- International Business Machines Corporation
- Ralph A. Barrese
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Plating method for circuitized substrates
- Patent number 7,169,313
- Issue date Jan 30, 2007
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,163,847
- Issue date Jan 16, 2007
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,091,066
- Issue date Aug 15, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate
- Patent number 7,084,014
- Issue date Aug 1, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for manufacturing a printed wiring board
- Patent number 7,007,378
- Issue date Mar 7, 2006
- International Business Machines Corporation
- John G. Gaudiello
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating printed circuit board with mixed metallurgy pads
- Patent number 6,931,722
- Issue date Aug 23, 2005
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective shield/material flow mechanism
- Patent number 6,746,578
- Issue date Jun 8, 2004
- International Business Machines Corporation
- Ralph A. Barrese
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Printed circuit board with mixed metallurgy pads and method of fabr...
- Patent number 6,586,683
- Issue date Jul 1, 2003
- International Business Machines Corporation
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for masking a hole in a substrate during plating
- Patent number 6,485,892
- Issue date Nov 26, 2002
- International Business Machines Corporation
- Lawrence Robert Blumberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for reducing extraneous metal plating
- Patent number 6,455,139
- Issue date Sep 24, 2002
- International Business Machines Corporation
- John Joseph Konrad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and method for forming the same of a printed wiring board...
- Patent number 6,429,390
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Michael J. Cummings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for reducing extraneous metal plating
- Patent number 6,296,897
- Issue date Oct 2, 2001
- International Business Machines Corporation
- John Joseph Konrad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuitized semiconductor structure and method for producing such
- Patent number 6,265,075
- Issue date Jul 24, 2001
- International Business Machines Corporation
- David Anton Klueppel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Technique for removing defects from a layer of metal
- Patent number 5,893,983
- Issue date Apr 13, 1999
- International Business Machines Corporation
- John Joseph Konrad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrolytic method of depositing gold connectors on a printed circ...
- Patent number 5,733,466
- Issue date Mar 31, 1998
- International Business Machines Corporation
- Biebele Opubo Benebo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE SHIELD/MATERIAL FLOW MECHANISM
- Publication number 20080000777
- Publication date Jan 3, 2008
- International Business Machines Corporation
- Ralph A. Barrese
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating method for circuitized substrates
- Publication number 20060255009
- Publication date Nov 16, 2006
- Endicott Interconnect Technologies, Inc.
- Norman A. Card
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20060046462
- Publication date Mar 2, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20060040426
- Publication date Feb 23, 2006
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selective shield/material flow mechanism
- Publication number 20050218002
- Publication date Oct 6, 2005
- International Business Machines Corporation
- Ralph A. Barrese
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Circuitized substrate, method of making same and information handli...
- Publication number 20050074924
- Publication date Apr 7, 2005
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20030177635
- Publication date Sep 25, 2003
- Edward L. Arrington
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Alternate metallurgy for land grid array connectors
- Publication number 20030102160
- Publication date Jun 5, 2003
- International Business Machines Corporation
- John G. Gaudiello
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Selective shield/material flow mechanism
- Publication number 20020179450
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Ralph A. Barrese
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Printed circuit board with mixed metallurgy pads and method of fabr...
- Publication number 20020157861
- Publication date Oct 31, 2002
- International Business Machines Corporation
- Edward L. Arrington
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Process for reducing extraneous metal plating
- Publication number 20010040047
- Publication date Nov 15, 2001
- John Joseph Konrad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Timothy L. Wells

Person

Patents Grantslast 30 patents

Selective shield/material flow mechanism

Selective shield/material flow mechanism

Plating method for circuitized substrates

Method of making circuitized substrate

Method of making circuitized substrate

Method of making circuitized substrate

Process for manufacturing a printed wiring board

Method of fabricating printed circuit board with mixed metallurgy pads

Selective shield/material flow mechanism

Printed circuit board with mixed metallurgy pads and method of fabr...

Method for masking a hole in a substrate during plating

Process for reducing extraneous metal plating

Structure and method for forming the same of a printed wiring board...

Process for reducing extraneous metal plating

Circuitized semiconductor structure and method for producing such

Technique for removing defects from a layer of metal

Electrolytic method of depositing gold connectors on a printed circ...

Patents Applicationslast 30 patents

SELECTIVE SHIELD/MATERIAL FLOW MECHANISM

Plating method for circuitized substrates

Circuitized substrate, method of making same and information handli...

Circuitized substrate, method of making same and information handli...

Selective shield/material flow mechanism

Circuitized substrate, method of making same and information handli...

Printed circuit board with mixed metallurgy pads and method of fabr...

Alternate metallurgy for land grid array connectors

Selective shield/material flow mechanism

Printed circuit board with mixed metallurgy pads and method of fabr...

Process for reducing extraneous metal plating