Timothy W. Budell

Person

Westford, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 9,245,854
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES Inc.
- William L. Brodsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic module EMI shielding structures and methods
- Patent number 8,952,503
- Issue date Feb 10, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level method for reducing power supply noise in an electroni...
- Patent number 8,429,590
- Issue date Apr 23, 2013
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-segments modeling bond wire interconnects with 2D simulations...
- Patent number 8,312,404
- Issue date Nov 13, 2012
- International Business Machines Corporation
- Haitian Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Validation of electrical performance of an electronic package prior...
- Patent number 8,108,811
- Issue date Jan 31, 2012
- International Business Machines Corporation
- Timothy W. Budell
- G01 - MEASURING TESTING
Information Patent Grant
Automatic verification of adequate conductive return-current paths
- Patent number 7,882,469
- Issue date Feb 1, 2011
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Auto connection assignment system and method
- Patent number 7,765,509
- Issue date Jul 27, 2010
- International Business Machines Corporation
- Adam Matthew Bittner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Validation of electrical performance of an electronic package prior...
- Patent number 7,454,723
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vents with signal image for signal return path
- Patent number 7,351,917
- Issue date Apr 1, 2008
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Auto connection assignment system and method
- Patent number 7,275,229
- Issue date Sep 25, 2007
- International Business Machines Corporation
- Adam Matthew Bittner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hierarchical method of power supply noise and signal integrity anal...
- Patent number 7,197,446
- Issue date Mar 27, 2007
- International Business Machines Corporation
- Erik Breiland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual pitch contact pad footprint for flip-chip chips and modules
- Patent number 7,196,908
- Issue date Mar 27, 2007
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit chip having a ringed wiring layer interposed bet...
- Patent number 7,146,596
- Issue date Dec 5, 2006
- International Business Machines Corporation
- Thomas R. Bednar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Concurrent electrical signal wiring optimization for an electronic...
- Patent number 7,017,128
- Issue date Mar 21, 2006
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Validation of electrical performance of an electronic package prior...
- Patent number 6,978,214
- Issue date Dec 20, 2005
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Vents with signal image for signal return path
- Patent number 6,977,345
- Issue date Dec 20, 2005
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit redistribution package
- Patent number 6,945,791
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Timothy W. Budell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radial contact pad footprint and wiring for electrical components
- Patent number 6,793,500
- Issue date Sep 21, 2004
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package having high density signal wires with low resist...
- Patent number 6,762,367
- Issue date Jul 13, 2004
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Concurrent electrical signal wiring optimization for an electronic...
- Patent number 6,703,706
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20150033554
- Publication date Feb 5, 2015
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS
- Publication number 20140210059
- Publication date Jul 31, 2014
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL METHOD FOR REDUCING POWER SUPPLY NOISE IN AN ELECTRONI...
- Publication number 20130024831
- Publication date Jan 24, 2013
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGE USING THROUGH SUBSTRATE VIAS TO GROUND LID
- Publication number 20120074559
- Publication date Mar 29, 2012
- International Business Machines Corporation
- Timothy W. Budell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Multi-segments Modeling Bond Wire Interconnects with 2D S...
- Publication number 20100332193
- Publication date Dec 30, 2010
- International Business Machines Corporation
- Haitian Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
AUTOMATIC VERIFICATION OF ADEQUATE CONDUCTIVE RETURN-CURRENT PATHS
- Publication number 20090138836
- Publication date May 28, 2009
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR RAPID RETURN PATH TRACING
- Publication number 20090094564
- Publication date Apr 9, 2009
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VALIDATION OF ELECTRICAL PERFORMANCE OF AN ELECTRONIC PACKAGE PRIOR...
- Publication number 20080320424
- Publication date Dec 25, 2008
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VENTS WITH SIGNAL IMAGE FOR SIGNAL RETURN PATH
- Publication number 20080127485
- Publication date Jun 5, 2008
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTO CONNECTION ASSIGNMENT SYSTEM AND METHOD
- Publication number 20080010625
- Publication date Jan 10, 2008
- Adam Matthew Bittner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Auto connection assignment system and method
- Publication number 20060294487
- Publication date Dec 28, 2006
- International Business Machines Corporation
- Adam Matthew Bittner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Vents with signal image for signal return path
- Publication number 20060108142
- Publication date May 25, 2006
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIERARCHICAL METHOD OF POWER SUPPLY NOISE AND SIGNAL INTEGRITY ANAL...
- Publication number 20060047490
- Publication date Mar 2, 2006
- International Business Machines Corporation
- Erik Breiland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Validation of electrical performance of an electronic package prior...
- Publication number 20060036981
- Publication date Feb 16, 2006
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT REDISTRIBUTION PACKAGE
- Publication number 20050176273
- Publication date Aug 11, 2005
- International Business Machines Corporation
- Timothy W. Budell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Validation of electrical performance of an electronic package prior...
- Publication number 20050114050
- Publication date May 26, 2005
- International Business Machines Corporation
- Timothy W. Budell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Chip Having A Ringed Wiring Layer Interposed Bet...
- Publication number 20050050505
- Publication date Mar 3, 2005
- International Business Machines Corporation
- Thomas R. Bednar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual pitch contact pad footprint for flip-chip chips and modules
- Publication number 20040246691
- Publication date Dec 9, 2004
- International Business Machines Corporation
- Timothy W. Budell
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Concurrent electrical signal wiring optimization for an electronic...
- Publication number 20040132229
- Publication date Jul 8, 2004
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD TO OBTAIN HIGH DENSITY SIGNAL WIRES WITH LOW RESISTANCE IN A...
- Publication number 20040050585
- Publication date Mar 18, 2004
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vents with signal image for signal return path
- Publication number 20030127249
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Timothy W. Budell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concurrent electrical signal wiring optimization for an electronic...
- Publication number 20030127728
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING

Timothy W. Budell

Person

Patents Grantslast 30 patents

Organic module EMI shielding structures and methods

Organic module EMI shielding structures and methods

System-level method for reducing power supply noise in an electroni...

Multi-segments modeling bond wire interconnects with 2D simulations...

Validation of electrical performance of an electronic package prior...

Automatic verification of adequate conductive return-current paths

Auto connection assignment system and method

Validation of electrical performance of an electronic package prior...

Vents with signal image for signal return path

Auto connection assignment system and method

Hierarchical method of power supply noise and signal integrity anal...

Dual pitch contact pad footprint for flip-chip chips and modules

Integrated circuit chip having a ringed wiring layer interposed bet...

Concurrent electrical signal wiring optimization for an electronic...

Validation of electrical performance of an electronic package prior...

Vents with signal image for signal return path

Integrated circuit redistribution package

Radial contact pad footprint and wiring for electrical components

Electronic package having high density signal wires with low resist...

Concurrent electrical signal wiring optimization for an electronic...

Patents Applicationslast 30 patents

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

ORGANIC MODULE EMI SHIELDING STRUCTURES AND METHODS

SYSTEM-LEVEL METHOD FOR REDUCING POWER SUPPLY NOISE IN AN ELECTRONI...

INTEGRATED CIRCUIT PACKAGE USING THROUGH SUBSTRATE VIAS TO GROUND LID

Method of Multi-segments Modeling Bond Wire Interconnects with 2D S...

AUTOMATIC VERIFICATION OF ADEQUATE CONDUCTIVE RETURN-CURRENT PATHS

METHOD FOR RAPID RETURN PATH TRACING

VALIDATION OF ELECTRICAL PERFORMANCE OF AN ELECTRONIC PACKAGE PRIOR...

VENTS WITH SIGNAL IMAGE FOR SIGNAL RETURN PATH

AUTO CONNECTION ASSIGNMENT SYSTEM AND METHOD

Auto connection assignment system and method

Vents with signal image for signal return path

HIERARCHICAL METHOD OF POWER SUPPLY NOISE AND SIGNAL INTEGRITY ANAL...

Validation of electrical performance of an electronic package prior...

INTEGRATED CIRCUIT REDISTRIBUTION PACKAGE

Validation of electrical performance of an electronic package prior...

Integrated Circuit Chip Having A Ringed Wiring Layer Interposed Bet...

Dual pitch contact pad footprint for flip-chip chips and modules

Concurrent electrical signal wiring optimization for an electronic...

METHOD TO OBTAIN HIGH DENSITY SIGNAL WIRES WITH LOW RESISTANCE IN A...

Vents with signal image for signal return path

Concurrent electrical signal wiring optimization for an electronic...