Ting Yiu Tsui

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods that selectively modify liner induced stress
- Patent number 7,939,400
- Issue date May 10, 2011
- Texas Instruments Incorporated
- Ting Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy beam treatment to improve packaging reliability
- Patent number 7,678,713
- Issue date Mar 16, 2010
- Texas Instruments Incorporated
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods that selectively modify liner induced stress
- Patent number 7,442,597
- Issue date Oct 28, 2008
- Texas Instruments Incorporated
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to facilitate etch uniformity and selectivity
- Patent number 7,341,941
- Issue date Mar 11, 2008
- Texas Instruments Incorporated
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to increase mechanical fracture robustness of porous low k d...
- Patent number 7,342,315
- Issue date Mar 11, 2008
- Texas Instruments Incorporated
- Ting Yiu Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment for silicon-based dielectrics
- Patent number 7,282,436
- Issue date Oct 16, 2007
- Texas Instruments Incorporated
- Ping Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-polish treatment for inhibiting copper corrosion
- Patent number 7,268,073
- Issue date Sep 11, 2007
- Texas Instruments Incorporated
- Deepak A. Ramappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of passivating and/or removing contaminants on a low-k diele...
- Patent number 7,087,518
- Issue date Aug 8, 2006
- Texas Instruments Incorporated
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for improving thermal stability of copper damascene structure
- Patent number 6,903,000
- Issue date Jun 7, 2005
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depth of focus (DOF) for trench-first-via-last (TFVL) damascene pro...
- Patent number 6,881,665
- Issue date Apr 19, 2005
- Advanced Micro Devices, Inc.
- Ting Yiu Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor devices that uses efficient pl...
- Patent number 6,806,103
- Issue date Oct 19, 2004
- Texas Instruments Incorporated
- Ting Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch back of interconnect dielectrics
- Patent number 6,780,756
- Issue date Aug 24, 2004
- Texas Instruments Incorporated
- David G. Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-assisted silicide fuse programming
- Patent number 6,607,945
- Issue date Aug 19, 2003
- Advanced Micro Devices, Inc.
- Ting Yiu Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a low dielectric constant material
- Patent number 6,583,070
- Issue date Jun 24, 2003
- Advanced Micro Devices, Inc.
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graded oxide caps on low dielectric constant (low K) chemical vapor...
- Patent number 6,498,112
- Issue date Dec 24, 2002
- Advanced Micro Devices, Inc.
- Jeremy I. Martin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to reduce photoresist contamination from silicon carbide films
- Patent number 6,489,238
- Issue date Dec 3, 2002
- Texas Instruments Incorporated
- Ting Yiu Tsui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of determining the doping concentration across a surface of...
- Patent number 6,407,558
- Issue date Jun 18, 2002
- Advanced Micro Devices, Inc.
- Sunil N. Shabde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion strength testing using a depth-sensing indentation technique
- Patent number 6,339,958
- Issue date Jan 22, 2002
- Advanced Micro Devices, Inc.
- Ting Y. Tsui
- G01 - MEASURING TESTING
Information Patent Grant
Method of determining the doping concentration and defect profile a...
- Patent number 6,320,403
- Issue date Nov 20, 2001
- Advanced Micro Devices, Inc.
- Sunil N. Shabde
- G01 - MEASURING TESTING
Information Patent Grant
STI punch-through defects and stress reduction by high temperature...
- Patent number 6,309,942
- Issue date Oct 30, 2001
- Advanced Micro Devices, Inc.
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using polysilicon fuse for IC programming
- Patent number 6,242,790
- Issue date Jun 5, 2001
- Advanced Micro Devices, Inc.
- Ting Y. Tsui
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having a low dielectric constant material
- Patent number 6,208,030
- Issue date Mar 27, 2001
- Advanced Micro Devices, Inc.
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining the doping concentration across a surface of...
- Patent number 6,208,154
- Issue date Mar 27, 2001
- Advanced Micro Devices, Inc.
- Sunil N. Shabde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for detecting defects in an interlayer dielectric...
- Patent number 6,177,802
- Issue date Jan 23, 2001
- Advanced Micro Devices, Inc.
- Sunil N. Shabde
- G01 - MEASURING TESTING
Information Patent Grant
System and method of mapping leakage current and a defect profile o...
- Patent number 6,147,507
- Issue date Nov 14, 2000
- Advanced Micro Devices, Inc.
- Sunil N. Shabde
- G01 - MEASURING TESTING
Information Patent Grant
Method for measuring fracture toughness of thin films
- Patent number 6,053,034
- Issue date Apr 25, 2000
- Advanced Micro Devices, Inc.
- Ting Y. Tsui
- B82 - NANO-TECHNOLOGY
Information Patent Grant
System and method for detecting defects in an interlayer dielectric...
- Patent number 6,023,327
- Issue date Feb 8, 2000
- Advanced Micro Devices, Inc.
- Sunil N. Shabde
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS THAT SELECTIVELY MODIFY LINER INDUCED STRESS
- Publication number 20090017588
- Publication date Jan 15, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF A SILICON OXIDE INTERFACE LAYER DURING SILICON CARBIDE...
- Publication number 20080283975
- Publication date Nov 20, 2008
- Laura M. Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device fabricated using a carbon-containing film as a...
- Publication number 20070210421
- Publication date Sep 13, 2007
- Texas Instruments Inc.
- Haowen Bu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a microelectronic device using electron beam...
- Publication number 20070105368
- Publication date May 10, 2007
- Texas Instruments Inc.
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods to facilitate etch uniformity and selectivity
- Publication number 20070042599
- Publication date Feb 22, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Energy beam treatment to improve packaging reliability
- Publication number 20070032094
- Publication date Feb 8, 2007
- Texas Instruments, Incorporated
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structure including a silicon oxycarbonitride layer
- Publication number 20060264042
- Publication date Nov 23, 2006
- Texas Instruments, Incorporated
- Laura M. Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Energy beam treatment to improve the hermeticity of a hermetic layer
- Publication number 20060264028
- Publication date Nov 23, 2006
- Texas Instruments, Incorporated
- Laura M. Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and methods that selectively modify liner induced stress
- Publication number 20060172481
- Publication date Aug 3, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-polish treatment for inhibiting copper corrosion
- Publication number 20060099804
- Publication date May 11, 2006
- Texas Instruments Inc.
- Deepak A. Ramappa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma treatment for silicon-based dielectrics
- Publication number 20050255687
- Publication date Nov 17, 2005
- Ping Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to increase mechanical fracture robustness of porous low k d...
- Publication number 20050196955
- Publication date Sep 8, 2005
- TEXAS INSTRUMENTS INCORPORATED
- Ting Yiu Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for improving thermal stability of copper damascene structure
- Publication number 20050186788
- Publication date Aug 25, 2005
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etch back of interconnect dielectrics
- Publication number 20040169279
- Publication date Sep 2, 2004
- David G. Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH BACK OF INTERCONNECT DIELECTRICS
- Publication number 20040169280
- Publication date Sep 2, 2004
- David G. Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of passivating and/or removing contaminants on a low-k diele...
- Publication number 20030224585
- Publication date Dec 4, 2003
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-assisted silicide fuse programming
- Publication number 20030219929
- Publication date Nov 27, 2003
- Advanced Micro Devices, Inc.
- Ting Yiu Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of passivating and/or removing contaminants on a low-k diele...
- Publication number 20030170992
- Publication date Sep 11, 2003
- David Gerald Farber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for improving thermal stability of copper damascene structure
- Publication number 20030124828
- Publication date Jul 3, 2003
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to improve the adhesion of dielectric layers to copper
- Publication number 20030027413
- Publication date Feb 6, 2003
- Ting Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-assisted silicide fuse programming
- Publication number 20020192879
- Publication date Dec 19, 2002
- Ting Yiu Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of determining the doping concentration across a surface of...
- Publication number 20010011895
- Publication date Aug 9, 2001
- Sunil N. Shabde
- H01 - BASIC ELECTRIC ELEMENTS

Ting Yiu Tsui

Person

Patents Grantslast 30 patents

Systems and methods that selectively modify liner induced stress

Energy beam treatment to improve packaging reliability

Systems and methods that selectively modify liner induced stress

Methods to facilitate etch uniformity and selectivity

Method to increase mechanical fracture robustness of porous low k d...

Plasma treatment for silicon-based dielectrics

Post-polish treatment for inhibiting copper corrosion

Method of passivating and/or removing contaminants on a low-k diele...

System for improving thermal stability of copper damascene structure

Depth of focus (DOF) for trench-first-via-last (TFVL) damascene pro...

Method for fabricating semiconductor devices that uses efficient pl...

Etch back of interconnect dielectrics

Laser-assisted silicide fuse programming

Semiconductor device having a low dielectric constant material

Graded oxide caps on low dielectric constant (low K) chemical vapor...

Method to reduce photoresist contamination from silicon carbide films

Method of determining the doping concentration across a surface of...

Adhesion strength testing using a depth-sensing indentation technique

Method of determining the doping concentration and defect profile a...

STI punch-through defects and stress reduction by high temperature...

Using polysilicon fuse for IC programming

Semiconductor device having a low dielectric constant material

Method of determining the doping concentration across a surface of...

System and method for detecting defects in an interlayer dielectric...

System and method of mapping leakage current and a defect profile o...

Method for measuring fracture toughness of thin films

System and method for detecting defects in an interlayer dielectric...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS THAT SELECTIVELY MODIFY LINER INDUCED STRESS

FORMATION OF A SILICON OXIDE INTERFACE LAYER DURING SILICON CARBIDE...

Semiconductor device fabricated using a carbon-containing film as a...

Method of fabricating a microelectronic device using electron beam...

Methods to facilitate etch uniformity and selectivity

Energy beam treatment to improve packaging reliability

Interconnect structure including a silicon oxycarbonitride layer

Energy beam treatment to improve the hermeticity of a hermetic layer

Systems and methods that selectively modify liner induced stress

Post-polish treatment for inhibiting copper corrosion

Plasma treatment for silicon-based dielectrics

Method to increase mechanical fracture robustness of porous low k d...

System for improving thermal stability of copper damascene structure

Etch back of interconnect dielectrics

ETCH BACK OF INTERCONNECT DIELECTRICS

Method of passivating and/or removing contaminants on a low-k diele...

Laser-assisted silicide fuse programming

Method of passivating and/or removing contaminants on a low-k diele...

System for improving thermal stability of copper damascene structure

Method to improve the adhesion of dielectric layers to copper

Laser-assisted silicide fuse programming

Method of determining the doping concentration across a surface of...