Todd Edward TAKKEN

Person

Brewster, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heterogeneous integrated multi-chip cooler module
- Patent number 12,300,577
- Issue date May 13, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sinks with beyond-board fins
- Patent number 12,262,514
- Issue date Mar 25, 2025
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer to reduce magnetic coupling
- Patent number 12,230,436
- Issue date Feb 18, 2025
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separable interface cable structure for high voltage under-module p...
- Patent number 12,183,999
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadside coupled coplanar inductors
- Patent number 11,817,250
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Todd E. Takken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical power delivery packaging structure
- Patent number 11,799,374
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Xin Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Power converter with co-packaged secondary field effect transistors...
- Patent number 11,799,384
- Issue date Oct 24, 2023
- International Business Machines Corporation
- Todd Edward Takken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dedicated airflow channels for cooling server drawers
- Patent number 11,792,954
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Todd Edward Takken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible cold plate for contacting varied and variable chip heights
- Patent number 11,792,911
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Daughter card plug detection
- Patent number 11,765,849
- Issue date Sep 19, 2023
- Stanley Eckert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked, reconfigurable co-regulation of processing units for ultra...
- Patent number 11,687,148
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Robert K. Montoye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flex prevention mechanical structure such as a ring for large integ...
- Patent number 11,631,635
- Issue date Apr 18, 2023
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backing plate with manufactured features on top surface
- Patent number 11,621,212
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic cores with high reluctance differences in flux paths
- Patent number 11,532,421
- Issue date Dec 20, 2022
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically flexible cold plates for low power components
- Patent number 11,497,143
- Issue date Nov 8, 2022
- International Business Machines Corporation
- Paul W. Coteus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-device cooling structure having assembly alignment features
- Patent number 11,439,043
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Shurong Tian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip having one or more on-chip metal winding and enc...
- Patent number 11,367,557
- Issue date Jun 21, 2022
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated power amplifier
- Patent number 11,362,109
- Issue date Jun 14, 2022
- International Business Machines Corporation
- Ko-Tao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible cold plate with parallel fluid flow paths
- Patent number 11,350,544
- Issue date May 31, 2022
- International Business Machines Corporation
- Shurong Tian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Injection-molded flexible cold plate
- Patent number 11,243,034
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Todd E. Takken
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Smart controller with phantom inductor current sensing for switched...
- Patent number 11,150,712
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Xin Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Burst resistant thin wall heat sink
- Patent number 11,131,506
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Paul W. Coteus
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fully integrated multi-phase buck converter with coupled air core i...
- Patent number 11,114,944
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Xin Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Combined inductor and heat transfer device
- Patent number 11,056,413
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plate with flex regions between fin areas
- Patent number 11,058,030
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Shurong Tian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Peripheral end face attachment of exposed copper layers of a first...
- Patent number 11,026,326
- Issue date Jun 1, 2021
- International Business Machines Corporation
- Todd E. Takken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra low parasitic inductance integrated cascode GaN devices
- Patent number 10,991,722
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Ko-Tao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supply voltage decoupling circuits for voltage droop mitigation
- Patent number 10,972,083
- Issue date Apr 6, 2021
- International Business Machines Corporation
- Xin Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High switching frequency, low loss and small form factor fully inte...
- Patent number 10,943,898
- Issue date Mar 9, 2021
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unified conductor to lower the resistance between a planar transfor...
- Patent number 10,939,543
- Issue date Mar 2, 2021
- International Business Machines Corporation
- Paul W Coteus
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RACK HEAT EXCHANGER TO REDUCE ROOM-LEVEL DATACENTER HEAT LOAD
- Publication number 20250176146
- Publication date May 29, 2025
- International Business Machines Corporation
- Shurong Tian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...
- Publication number 20250167191
- Publication date May 22, 2025
- International Business Machines Corporation
- Robert K. Montoye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP OR WAFER STACK
- Publication number 20250022800
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE
- Publication number 20240222223
- Publication date Jul 4, 2024
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL PLATING OF CIRCUIT BOARDS FOR LAYER TRANSITION CONNECTIONS
- Publication number 20230371177
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SOLDER PAD TRIMMING
- Publication number 20230292447
- Publication date Sep 14, 2023
- International Business Machines Corporation
- Stanley Eckert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEDICATED AIRFLOW CHANNELS FOR COOLING SERVER DRAWERS
- Publication number 20230269899
- Publication date Aug 24, 2023
- International Business Machines Corporation
- Todd Edward TAKKEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DAUGHTER CARD PLUG DETECTION
- Publication number 20230262919
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Stanley Eckert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER TO WAFER HIGH DENSITY INTERCONNECTS
- Publication number 20230207523
- Publication date Jun 29, 2023
- International Business Machines Corporation
- Timothy J. Chainer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARABLE INTERFACE CABLE STRUCTURE FOR HIGH VOLTAGE UNDER-MODULE P...
- Publication number 20230198177
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL POWER DELIVERY PACKAGING STRUCTURE
- Publication number 20230078561
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Xin Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXIBLE COLD PLATE FOR CONTACTING VARIED AND VARIABLE CHIP HEIGHTS
- Publication number 20220408544
- Publication date Dec 22, 2022
- International Business Machines Corporation
- Shurong Tian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINKS WITH BEYOND-BOARD FINS
- Publication number 20220330414
- Publication date Oct 13, 2022
- International Business Machines Corporation
- Shurong Tian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC CORES WITH HIGH RELUCTANCE DIFFERENCES IN FLUX PATHS
- Publication number 20220270807
- Publication date Aug 25, 2022
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER TO REDUCE MAGNETIC COUPLING
- Publication number 20220165488
- Publication date May 26, 2022
- International Business Machines Corporation
- Yuan Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE COLD PLATE WITH PARALLEL FLUID FLOW PATHS
- Publication number 20210307195
- Publication date Sep 30, 2021
- International Business Machines Corporation
- Shurong Tian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POWER CONVERTER WITH CO-PACKAGED SECONDARY FIELD EFFECT TRANSISTORS...
- Publication number 20210234465
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Todd Edward Takken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flex Prevention Mechanical Structure Such as a Ring for Large Integ...
- Publication number 20210217690
- Publication date Jul 15, 2021
- International Business Machines Corporation
- Shurong Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE MAGNETIC SHIELDING SHEET
- Publication number 20210202400
- Publication date Jul 1, 2021
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKING PLATE WITH MANUFACTURED FEATURES ON TOP SURFACE
- Publication number 20210193557
- Publication date Jun 24, 2021
- International Business Machines Corporation
- Yuan Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WITH CHIP-EXTERNAL MAGNETIC CORES
- Publication number 20210183560
- Publication date Jun 17, 2021
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED POWER AMPLIFIER
- Publication number 20210111192
- Publication date Apr 15, 2021
- International Business Machines Corporation
- Ko-Tao Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DEVICE COOLING STRUCTURE HAVING ASSEMBLY ALIGNMENT FEATURES
- Publication number 20200375066
- Publication date Nov 26, 2020
- International Business Machines Corporation
- Shurong Tian
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Combined Inductor And Heat Transfer Device
- Publication number 20200373217
- Publication date Nov 26, 2020
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BROADSIDE COUPLED COPLANAR INDUCTORS
- Publication number 20200357563
- Publication date Nov 12, 2020
- International Business Machines Corporation
- Todd E. Takken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMART CONTROLLER WITH PHANTOM INDUCTOR CURRENT SENSING FOR SWITCHED...
- Publication number 20200348740
- Publication date Nov 5, 2020
- International Business Machines Corporation
- Xin Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INJECTION-MOLDED FLEXIBLE COLD PLATE
- Publication number 20200340762
- Publication date Oct 29, 2020
- International Business Machines Corporation
- Todd E. Takken
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COLD PLATE WITH FLEX REGIONS BETWEEN FIN AREAS
- Publication number 20200337181
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Shurong Tian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SUPPLY VOLTAGE DECOUPLING CIRCUITS FOR VOLTAGE DROOP MITIGATION
- Publication number 20200304112
- Publication date Sep 24, 2020
- International Business Machines Corporation
- Xin Zhang
- H03 - BASIC ELECTRONIC CIRCUITRY

Todd Edward TAKKEN

Person

Patents Grantslast 30 patents

Heterogeneous integrated multi-chip cooler module

Heat sinks with beyond-board fins

Spacer to reduce magnetic coupling

Separable interface cable structure for high voltage under-module p...

Broadside coupled coplanar inductors

Vertical power delivery packaging structure

Power converter with co-packaged secondary field effect transistors...

Dedicated airflow channels for cooling server drawers

Flexible cold plate for contacting varied and variable chip heights

Daughter card plug detection

Stacked, reconfigurable co-regulation of processing units for ultra...

Flex prevention mechanical structure such as a ring for large integ...

Backing plate with manufactured features on top surface

Magnetic cores with high reluctance differences in flux paths

Mechanically flexible cold plates for low power components

Multi-device cooling structure having assembly alignment features

Semiconductor chip having one or more on-chip metal winding and enc...

Integrated power amplifier

Flexible cold plate with parallel fluid flow paths

Injection-molded flexible cold plate

Smart controller with phantom inductor current sensing for switched...

Burst resistant thin wall heat sink

Fully integrated multi-phase buck converter with coupled air core i...

Combined inductor and heat transfer device

Cold plate with flex regions between fin areas

Peripheral end face attachment of exposed copper layers of a first...

Ultra low parasitic inductance integrated cascode GaN devices

Supply voltage decoupling circuits for voltage droop mitigation

High switching frequency, low loss and small form factor fully inte...

Unified conductor to lower the resistance between a planar transfor...

Patents Applicationslast 30 patents

RACK HEAT EXCHANGER TO REDUCE ROOM-LEVEL DATACENTER HEAT LOAD

UTILIZING MEMORY CHIP THROUGH-SILICON VIAS FOR CONNECTING LOGIC CHI...

THREE-DIMENSIONAL CHIP OR WAFER STACK

HETEROGENEOUS INTEGRATED MULTI-CHIP COOLER MODULE

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

SIDEWALL PLATING OF CIRCUIT BOARDS FOR LAYER TRANSITION CONNECTIONS

BALL GRID ARRAY SOLDER PAD TRIMMING

DEDICATED AIRFLOW CHANNELS FOR COOLING SERVER DRAWERS

DAUGHTER CARD PLUG DETECTION

WAFER TO WAFER HIGH DENSITY INTERCONNECTS

SEPARABLE INTERFACE CABLE STRUCTURE FOR HIGH VOLTAGE UNDER-MODULE P...

VERTICAL POWER DELIVERY PACKAGING STRUCTURE

FLEXIBLE COLD PLATE FOR CONTACTING VARIED AND VARIABLE CHIP HEIGHTS

HEAT SINKS WITH BEYOND-BOARD FINS

MAGNETIC CORES WITH HIGH RELUCTANCE DIFFERENCES IN FLUX PATHS

SPACER TO REDUCE MAGNETIC COUPLING

FLEXIBLE COLD PLATE WITH PARALLEL FLUID FLOW PATHS

POWER CONVERTER WITH CO-PACKAGED SECONDARY FIELD EFFECT TRANSISTORS...

Flex Prevention Mechanical Structure Such as a Ring for Large Integ...

DISCRETE MAGNETIC SHIELDING SHEET

BACKING PLATE WITH MANUFACTURED FEATURES ON TOP SURFACE

SEMICONDUCTOR WITH CHIP-EXTERNAL MAGNETIC CORES

INTEGRATED POWER AMPLIFIER

MULTI-DEVICE COOLING STRUCTURE HAVING ASSEMBLY ALIGNMENT FEATURES

Combined Inductor And Heat Transfer Device

BROADSIDE COUPLED COPLANAR INDUCTORS

SMART CONTROLLER WITH PHANTOM INDUCTOR CURRENT SENSING FOR SWITCHED...

INJECTION-MOLDED FLEXIBLE COLD PLATE

COLD PLATE WITH FLEX REGIONS BETWEEN FIN AREAS

SUPPLY VOLTAGE DECOUPLING CIRCUITS FOR VOLTAGE DROOP MITIGATION