Todd O. Bolken

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 11,456,286
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with through-package interconnect and...
- Patent number 10,615,154
- Issue date Apr 7, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly semiconductor device with through-package interc...
- Patent number 9,978,730
- Issue date May 22, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for packaging multiple device components
- Patent number 9,559,087
- Issue date Jan 31, 2017
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with package interconnect extending i...
- Patent number 9,508,686
- Issue date Nov 29, 2016
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with molded casing and package interconnect ex...
- Patent number 8,906,743
- Issue date Dec 9, 2014
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging imager devices and optics modules, and resulti...
- Patent number 8,709,878
- Issue date Apr 29, 2014
- Micron Technology, Inc.
- Todd Bolken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Techniques for packaging multiple device components
- Patent number 8,629,558
- Issue date Jan 14, 2014
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication of package assemblies for optically interact...
- Patent number 8,624,371
- Issue date Jan 7, 2014
- Round Rock Research, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices
- Patent number 8,508,034
- Issue date Aug 13, 2013
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabrication of package assemblies for optically interact...
- Patent number 8,426,954
- Issue date Apr 23, 2013
- Round Rock Research, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for packaging multiple device components
- Patent number 8,212,348
- Issue date Jul 3, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package
- Patent number 8,115,296
- Issue date Feb 14, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging imager devices and optics modules, and resulti...
- Patent number 8,110,884
- Issue date Feb 7, 2012
- Micron Technology, Inc.
- Todd Bolken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of fabrication of package assemblies for optically interact...
- Patent number 8,008,762
- Issue date Aug 30, 2011
- Round Rock Research, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for packaging a multiple device component
- Patent number 7,804,171
- Issue date Sep 28, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers for semiconductor die packages with standard ball grill...
- Patent number 7,791,205
- Issue date Sep 7, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for packaging multiple device components
- Patent number 7,781,875
- Issue date Aug 24, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolding encapsulation process and encapsulated article made the...
- Patent number 7,655,508
- Issue date Feb 2, 2010
- Micron Technology, Inc.
- Mark S. Johnson
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Apparatus for molding a semiconductor die package with enhanced the...
- Patent number 7,642,643
- Issue date Jan 5, 2010
- Micron Technology, Inc.
- Frank L. Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assemblies with bond pads of two or more semiconductor devices elec...
- Patent number 7,557,454
- Issue date Jul 7, 2009
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging image sensitive electronic devices
- Patent number 7,553,688
- Issue date Jun 30, 2009
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable ball grid array
- Patent number 7,459,773
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Todd O. Bolken
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for packaging image sensitive electronic devices
- Patent number 7,419,854
- Issue date Sep 2, 2008
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array packages with thermally conductive containers
- Patent number 7,399,657
- Issue date Jul 15, 2008
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging image sensitive electronic devices
- Patent number 7,387,902
- Issue date Jun 17, 2008
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for two-stage transfer molding device to encapsulate MMC module
- Patent number 7,288,441
- Issue date Oct 30, 2007
- Micron Technology, Inc.
- Todd O. Bolken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Two-stage transfer molding device to encapsulate MMC module
- Patent number 7,279,781
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- Todd O. Bolken
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for assembling semiconductor die packages with standard ball...
- Patent number 7,279,366
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assembly encapsulation mold and method for forming same
- Patent number 7,247,521
- Issue date Jul 24, 2007
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20230020689
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20200243493
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20180226387
- Publication date Aug 9, 2018
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20170040303
- Publication date Feb 9, 2017
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20150137365
- Publication date May 21, 2015
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...
- Publication number 20140197526
- Publication date Jul 17, 2014
- Micron Technology, Inc.
- Chan Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
- Publication number 20140099753
- Publication date Apr 10, 2014
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACT...
- Publication number 20130234275
- Publication date Sep 12, 2013
- ROUND ROCK RESEARCH, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
- Publication number 20120241956
- Publication date Sep 27, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PACKAGING IMAGER DEVICES AND OPTICS MODULES, AND RESULTI...
- Publication number 20120135560
- Publication date May 31, 2012
- Micron Technology, Inc.
- Todd BOLKEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICES
- Publication number 20120126386
- Publication date May 24, 2012
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACT...
- Publication number 20110298077
- Publication date Dec 8, 2011
- ROUND ROCK RESEARCH, LLC
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS
- Publication number 20100283151
- Publication date Nov 11, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE
- Publication number 20100264532
- Publication date Oct 21, 2010
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Imager wafer level module and method of fabrication and use
- Publication number 20090206431
- Publication date Aug 20, 2009
- Micron Technology, Inc.
- Todd O. Bolken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS OF PACKAGING IMAGER DEVICES AND OPTICS MODULES, AND RESULTI...
- Publication number 20090152658
- Publication date Jun 18, 2009
- Todd Bolken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Spacers for separating components of semiconductor device assemblie...
- Publication number 20080054429
- Publication date Mar 6, 2008
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for packaging multiple device components
- Publication number 20070145556
- Publication date Jun 28, 2007
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabrication of package assemblies for optically interact...
- Publication number 20070108579
- Publication date May 17, 2007
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensitive electronic device packages
- Publication number 20060267169
- Publication date Nov 30, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding tool and a method of forming an electronic device package
- Publication number 20060169490
- Publication date Aug 3, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multimedia card and transfer molding method
- Publication number 20060157838
- Publication date Jul 20, 2006
- Todd O. Bolken
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for two-stage transfer molding device to encapsulate MMC module
- Publication number 20060110850
- Publication date May 25, 2006
- Todd O. Bolken
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Stackable ball grid array
- Publication number 20060055020
- Publication date Mar 16, 2006
- Todd O. Bolken
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Methods for packaging image sensitive electronic devices
- Publication number 20060051891
- Publication date Mar 9, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for packaging image sensitive electronic devices
- Publication number 20060051892
- Publication date Mar 9, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for packaging image sensitive electronic devices
- Publication number 20060051890
- Publication date Mar 9, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for packaging image sensitive electronic devices
- Publication number 20060046351
- Publication date Mar 2, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imagers with optics supports having threadless inte...
- Publication number 20060023107
- Publication date Feb 2, 2006
- Todd O. Bolken
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor component having stacked, encapsulated dice and metho...
- Publication number 20060006518
- Publication date Jan 12, 2006
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS

Todd O. Bolken

Person

Patents Grantslast 30 patents

Semiconductor device assembly with through-package interconnect and...

Semiconductor device assembly with through-package interconnect and...

Method of assembly semiconductor device with through-package interc...

Techniques for packaging multiple device components

Semiconductor device assembly with package interconnect extending i...

Semiconductor device with molded casing and package interconnect ex...

Methods of packaging imager devices and optics modules, and resulti...

Techniques for packaging multiple device components

Methods of fabrication of package assemblies for optically interact...

Electronic devices

Methods of fabrication of package assemblies for optically interact...

Techniques for packaging multiple device components

Electronic device package

Methods of packaging imager devices and optics modules, and resulti...

Methods of fabrication of package assemblies for optically interact...

Techniques for packaging a multiple device component

Interposers for semiconductor die packages with standard ball grill...

Techniques for packaging multiple device components

Overmolding encapsulation process and encapsulated article made the...

Apparatus for molding a semiconductor die package with enhanced the...

Assemblies with bond pads of two or more semiconductor devices elec...

Methods for packaging image sensitive electronic devices

Stackable ball grid array

Methods for packaging image sensitive electronic devices

Ball grid array packages with thermally conductive containers

Methods for packaging image sensitive electronic devices

Method for two-stage transfer molding device to encapsulate MMC module

Two-stage transfer molding device to encapsulate MMC module

Method for assembling semiconductor die packages with standard ball...

Semiconductor assembly encapsulation mold and method for forming same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND...

TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS

METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACT...

TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS

METHODS OF PACKAGING IMAGER DEVICES AND OPTICS MODULES, AND RESULTI...

ELECTRONIC DEVICES

METHODS OF FABRICATION OF PACKAGE ASSEMBLIES FOR OPTICALLY INTERACT...

TECHNIQUES FOR PACKAGING MULTIPLE DEVICE COMPONENTS

ELECTRONIC DEVICE PACKAGE

Imager wafer level module and method of fabrication and use

METHODS OF PACKAGING IMAGER DEVICES AND OPTICS MODULES, AND RESULTI...

Spacers for separating components of semiconductor device assemblie...

Techniques for packaging multiple device components

Methods of fabrication of package assemblies for optically interact...

Image sensitive electronic device packages

Molding tool and a method of forming an electronic device package

Multimedia card and transfer molding method

Method for two-stage transfer molding device to encapsulate MMC module

Stackable ball grid array

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Microelectronic imagers with optics supports having threadless inte...

Semiconductor component having stacked, encapsulated dice and metho...