Tom CHOI

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Selective removal of silicon-containing materials
- Patent number 11,437,242
- Issue date Sep 6, 2022
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for reducing particles in semiconductor proce...
- Patent number 10,770,269
- Issue date Sep 8, 2020
- Applied Materials, Inc.
- Andrew Nguyen
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Footing removal for nitride spacer
- Patent number 10,629,473
- Issue date Apr 21, 2020
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiN spacer profile patterning
- Patent number 10,600,639
- Issue date Mar 24, 2020
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for material breakthrough
- Patent number 10,490,406
- Issue date Nov 26, 2019
- Appled Materials, Inc.
- Mandar B. Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching processes
- Patent number 10,424,487
- Issue date Sep 24, 2019
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped etch profile with oxidation
- Patent number 10,403,507
- Issue date Sep 3, 2019
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-halogen etching of silicon-containing materials
- Patent number 10,354,889
- Issue date Jul 16, 2019
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Poly directional etch by oxidation
- Patent number 10,062,575
- Issue date Aug 28, 2018
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SiN spacer profile patterning
- Patent number 10,026,621
- Issue date Jul 17, 2018
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic oxide spacer etch process
- Patent number 9,818,621
- Issue date Nov 14, 2017
- Applied Materials, Inc.
- Aurelien Tavernier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,721,807
- Issue date Aug 1, 2017
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,478,433
- Issue date Oct 25, 2016
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ photoresist strip during plasma etching of active hard mask
- Patent number 8,912,633
- Issue date Dec 16, 2014
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Pulsed dielectric etch process for in-situ metal hard mask shape co...
- Patent number 8,906,810
- Issue date Dec 9, 2014
- Lam Research Corporation
- Ananth Indrakanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing damage to low-K materials during photoresist stripping
- Patent number 8,815,745
- Issue date Aug 26, 2014
- Lam Research Corporation
- Sean S. Kang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
In-situ photoresist strip during plasma etching of active hard mask
- Patent number 8,283,255
- Issue date Oct 9, 2012
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Trilayer resist organic layer etch
- Patent number 8,124,516
- Issue date Feb 28, 2012
- Lam Research Corporation
- Sean S. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of and apparatus for reducing amounts of particles on a waf...
- Patent number 7,782,591
- Issue date Aug 24, 2010
- Lam Research Corporation
- Sangjun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing uniform removal of organic material
- Patent number 7,534,363
- Issue date May 19, 2009
- Lam Research Corporation
- Rao V. Annapragada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas mixture for removing photoresist and post etch residue from low...
- Patent number 7,479,457
- Issue date Jan 20, 2009
- Lam Research Corporation
- Cristian Paduraru
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Preventing damage to low-k materials during resist stripping
- Patent number 7,385,287
- Issue date Jun 10, 2008
- Lam Research Corporation
- Siyi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plasma stripping using periodic modulation of gas chemis...
- Patent number 7,294,580
- Issue date Nov 13, 2007
- Lam Research Corporation
- Seokmin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing damage to low-k materials during resist stripping
- Patent number 7,226,852
- Issue date Jun 5, 2007
- Lam Research Corporation
- Siyi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum plasma processor method
- Patent number 6,897,156
- Issue date May 24, 2005
- Lam Research Corporation
- Tuqiang Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum plasma processor apparatus and method
- Patent number 6,531,029
- Issue date Mar 11, 2003
- Lam Research Corporation
- Tuqiang Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving uniformity and reducing etch rate variation of...
- Patent number 6,514,378
- Issue date Feb 4, 2003
- Lam Research Corporation
- Tuqiang Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High temperature tungsten etching process
- Patent number 6,461,974
- Issue date Oct 8, 2002
- Lam Research Corporation
- Tuqiang Ni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of preventing post-etch corrosion of an aluminum neodymium-...
- Patent number 6,197,388
- Issue date Mar 6, 2001
- Lam Research Corporation
- Thomas S. Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR REMOVING ETCH STOP LAYERS
- Publication number 20230035288
- Publication date Feb 2, 2023
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR REMOVING ETCH STOP LAYERS
- Publication number 20230031381
- Publication date Feb 2, 2023
- Suketu PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI COLOR STACK FOR SELF ALIGNED DUAL PATTERN FORMATION FOR MULTI...
- Publication number 20220130722
- Publication date Apr 28, 2022
- Applied Materials, Inc.
- Suketu Arun PARIKH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE REMOVAL OF SILICON-CONTAINING MATERIALS
- Publication number 20200168463
- Publication date May 28, 2020
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MATERIAL BREAKTHROUGH
- Publication number 20200043734
- Publication date Feb 6, 2020
- Applied Materials, Inc.
- Mandar B. Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MATERIAL BREAKTHROUGH
- Publication number 20190311900
- Publication date Oct 10, 2019
- Applied Materials, Inc.
- Mandar B. Pandit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING PROCESSES
- Publication number 20190122902
- Publication date Apr 25, 2019
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-HALOGEN ETCHING OF SILICON-CONTAINING MATERIALS
- Publication number 20190019690
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiN SPACER PROFILE PATTERNING
- Publication number 20180323075
- Publication date Nov 8, 2018
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shaped Etch Profile with Oxidation
- Publication number 20180226259
- Publication date Aug 9, 2018
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiN SPACER PROFILE PATTERNING
- Publication number 20180138049
- Publication date May 17, 2018
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOOTING REMOVAL FOR NITRIDE SPACER
- Publication number 20180076083
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLY DIRECTIONAL ETCH BY OXIDATION
- Publication number 20180076044
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR REDUCING PARTICLES IN SEMICONDUCTOR PROCE...
- Publication number 20170345623
- Publication date Nov 30, 2017
- Applied Materials, Inc.
- Andrew NGUYEN
- B32 - LAYERED PRODUCTS
Information Patent Application
CYCLIC OXIDE SPACER ETCH PROCESS
- Publication number 20170243754
- Publication date Aug 24, 2017
- Applied Materials, Inc.
- Aurelien TAVERNIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER FORMATION PROCESS WITH FLAT TOP PROFILE
- Publication number 20160307772
- Publication date Oct 20, 2016
- Applied Materials, Inc.
- Tom CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293437
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293438
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PULSED DIELECTRIC ETCH PROCESS FOR IN-SITU METAL HARD MASK SHAPE CO...
- Publication number 20140335697
- Publication date Nov 13, 2014
- LAM RESEARCH CORPORATION
- Ananth Indrakanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU PHOTORESIST STRIP DURING PLASMA ETCHING OF ACTIVE HARD MASK
- Publication number 20130001754
- Publication date Jan 3, 2013
- LAM RESEARCH CORPORATION
- Sangjun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING DAMAGE TO LOW-K MATERIALS DURING PHOTORESIST STRIPPING
- Publication number 20090197422
- Publication date Aug 6, 2009
- LAM RESEARCH CORPORATION
- Sean S. KANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Methods of and apparatus for reducing amounts of particles on a waf...
- Publication number 20080314733
- Publication date Dec 25, 2008
- LAM RESEARCH CORPORATION
- Sangjun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-situ photoresist strip during plasma etching of active hard mask
- Publication number 20080293249
- Publication date Nov 27, 2008
- Lam Research Corporation
- Sangjun Cho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PROCESSING INCLUDING ETCHED LAYER PASSIVATION USING S...
- Publication number 20080064214
- Publication date Mar 13, 2008
- LAM RESEARCH CORPORATION
- Taejoon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trilayer resist organic layer etch
- Publication number 20080044995
- Publication date Feb 21, 2008
- Lam Research Corporation
- Sean S. Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTING DAMAGE TO LOW-K MATERIALS DURING RESIST STRIPPING
- Publication number 20070287292
- Publication date Dec 13, 2007
- LAM RESEARCH CORPORATION
- Siyi LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gas mixture for removing photoresist and post etch residue from low...
- Publication number 20070054496
- Publication date Mar 8, 2007
- Cristian Paduraru
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for providing uniform removal of organic material
- Publication number 20050006346
- Publication date Jan 13, 2005
- Rao V. Annapragada
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for plasma stripping using periodic modulation of gas chemis...
- Publication number 20040224520
- Publication date Nov 11, 2004
- Lam Research Corporation
- Seokmin Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vacuum plasma processor apparatus and method
- Publication number 20030106645
- Publication date Jun 12, 2003
- Lam Research Corporation
- Tuqiang Ni
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Selective removal of silicon-containing materials

Apparatus and methods for reducing particles in semiconductor proce...

Footing removal for nitride spacer

SiN spacer profile patterning

Systems and methods for material breakthrough

Atomic layer etching processes

Shaped etch profile with oxidation

Non-halogen etching of silicon-containing materials

Poly directional etch by oxidation

SiN spacer profile patterning

Cyclic oxide spacer etch process

Cyclic spacer etching process with improved profile control

Cyclic spacer etching process with improved profile control

In-situ photoresist strip during plasma etching of active hard mask

Pulsed dielectric etch process for in-situ metal hard mask shape co...

Reducing damage to low-K materials during photoresist stripping

In-situ photoresist strip during plasma etching of active hard mask

Trilayer resist organic layer etch

Methods of and apparatus for reducing amounts of particles on a waf...

Method for providing uniform removal of organic material

Gas mixture for removing photoresist and post etch residue from low...

Preventing damage to low-k materials during resist stripping

Method for plasma stripping using periodic modulation of gas chemis...

Preventing damage to low-k materials during resist stripping

Vacuum plasma processor method

Vacuum plasma processor apparatus and method

Method for improving uniformity and reducing etch rate variation of...

High temperature tungsten etching process

Methods of preventing post-etch corrosion of an aluminum neodymium-...

Patents Applicationslast 30 patents

METHODS FOR REMOVING ETCH STOP LAYERS

APPARATUS FOR REMOVING ETCH STOP LAYERS

MULTI COLOR STACK FOR SELF ALIGNED DUAL PATTERN FORMATION FOR MULTI...

SELECTIVE REMOVAL OF SILICON-CONTAINING MATERIALS

SYSTEMS AND METHODS FOR MATERIAL BREAKTHROUGH

SYSTEMS AND METHODS FOR MATERIAL BREAKTHROUGH

ATOMIC LAYER ETCHING PROCESSES

NON-HALOGEN ETCHING OF SILICON-CONTAINING MATERIALS

SiN SPACER PROFILE PATTERNING

Shaped Etch Profile with Oxidation

SiN SPACER PROFILE PATTERNING

FOOTING REMOVAL FOR NITRIDE SPACER

POLY DIRECTIONAL ETCH BY OXIDATION

APPARATUS AND METHODS FOR REDUCING PARTICLES IN SEMICONDUCTOR PROCE...

CYCLIC OXIDE SPACER ETCH PROCESS

SPACER FORMATION PROCESS WITH FLAT TOP PROFILE

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

PULSED DIELECTRIC ETCH PROCESS FOR IN-SITU METAL HARD MASK SHAPE CO...

IN-SITU PHOTORESIST STRIP DURING PLASMA ETCHING OF ACTIVE HARD MASK

REDUCING DAMAGE TO LOW-K MATERIALS DURING PHOTORESIST STRIPPING

Methods of and apparatus for reducing amounts of particles on a waf...

In-situ photoresist strip during plasma etching of active hard mask

SEMICONDUCTOR PROCESSING INCLUDING ETCHED LAYER PASSIVATION USING S...

Trilayer resist organic layer etch

PREVENTING DAMAGE TO LOW-K MATERIALS DURING RESIST STRIPPING

Gas mixture for removing photoresist and post etch residue from low...

Method for providing uniform removal of organic material

Method for plasma stripping using periodic modulation of gas chemis...

Vacuum plasma processor apparatus and method