Tomohei Sugiyama

Person

Aichi-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Austenitic cast iron, austenitic-cast-iron cast product and manufac...
- Patent number 9,567,657
- Issue date Feb 14, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Tomohei Sugiyama
- C21 - METALLURGY OF IRON
Information Patent Grant
Radiator member for electronic appliances and processes for produci...
- Patent number 7,364,632
- Issue date Apr 29, 2008
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of producing base plate circuit board, base plate for circui...
- Patent number 7,323,255
- Issue date Jan 29, 2008
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a low expansion material and semiconductor...
- Patent number 7,196,417
- Issue date Mar 27, 2007
- Kabushiki Kaisha Toyota Jidoshokki
- Tomohei Sugiyama
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite structural material, and method of producing the same
- Patent number 7,097,914
- Issue date Aug 29, 2006
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-expansion unit, method of manufacturing the same and semiconduc...
- Patent number 7,087,316
- Issue date Aug 8, 2006
- Kabushiki Kaisha Toyota Jidoshokki
- Takashi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite material and method for manufacturing the same
- Patent number 6,994,917
- Issue date Feb 7, 2006
- Kabushiki Kaisha Toyota Jidoshokki
- Kyoichi Kinoshita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating material and manufacturing method thereof
- Patent number 6,753,093
- Issue date Jun 22, 2004
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Process for filling powder, apparatus therefor and process for prod...
- Patent number 6,698,465
- Issue date Mar 2, 2004
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
VEHICLE COMPRESSOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230374996
- Publication date Nov 23, 2023
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Masato NOGUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COMPRESSOR COMPONENT FOR TRANSPORT AND METHOD FOR MANUFACTURING SAME
- Publication number 20200238385
- Publication date Jul 30, 2020
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Yasuo KOTETSU
- B22 - CASTING POWDER METALLURGY
Information Patent Application
AUSTENITIC CAST IRON, AUSTENITIC-CAST-IRON CAST PRODUCT AND MANUFAC...
- Publication number 20130045127
- Publication date Feb 21, 2013
- KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
- Tomohei Sugiyama
- C21 - METALLURGY OF IRON
Information Patent Application
AUSTENITIC CAST IRON AND MANUFACTURING PROCESS FOR THE SAME, AUSTEN...
- Publication number 20100284849
- Publication date Nov 11, 2010
- Kabushiki Kaisha Toyota Jidoshokki
- Tomohei Sugiyama
- C21 - METALLURGY OF IRON
Information Patent Application
METHOD OF PRODUCING BASE PLATE FOR CIRCUIT BOARD, BASE PLATE FOR CI...
- Publication number 20080087400
- Publication date Apr 17, 2008
- Kabushiki Kaisha Toyota Jidoshokki
- Katsufumi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20070045801
- Publication date Mar 1, 2007
- Tomohei Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing base plate circuit board, base plate for circui...
- Publication number 20060046035
- Publication date Mar 2, 2006
- Katsufumi Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and semiconductor device using the same
- Publication number 20050029658
- Publication date Feb 10, 2005
- Tomohei Sugiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low-expansion unit, method of manufacturing the same and semiconduc...
- Publication number 20050031889
- Publication date Feb 10, 2005
- Takashi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite material and method for manufacturing the same
- Publication number 20040142202
- Publication date Jul 22, 2004
- Kyoichi Kinoshita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a low expansion material and semiconductor...
- Publication number 20040130018
- Publication date Jul 8, 2004
- Tomohei Sugiyama
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Composite structural material, and method of producing the same
- Publication number 20040101707
- Publication date May 27, 2004
- Katsufumi Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat dissipation member for electronic apparatus and method for pro...
- Publication number 20040094537
- Publication date May 20, 2004
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Semiconductor module and plate-shaped lead
- Publication number 20040065947
- Publication date Apr 8, 2004
- Tomohei Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low expansion plate, method of manufacturing the same, and semicond...
- Publication number 20040041244
- Publication date Mar 4, 2004
- Tomohei Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiator system, radiating method, thermal buffer, semiconductor mo...
- Publication number 20040016748
- Publication date Jan 29, 2004
- Kyoichi Kinoshita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat dissipating material and manufacturing method thereof
- Publication number 20030066621
- Publication date Apr 10, 2003
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Process for filling powder, apparatus therefor and process for prod...
- Publication number 20030041915
- Publication date Mar 6, 2003
- Katsufumi Tanaka
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Tomohei Sugiyama

Person

Patents Grantslast 30 patents

Austenitic cast iron, austenitic-cast-iron cast product and manufac...

Radiator member for electronic appliances and processes for produci...

Method of producing base plate circuit board, base plate for circui...

Method of manufacturing a low expansion material and semiconductor...

Composite structural material, and method of producing the same

Low-expansion unit, method of manufacturing the same and semiconduc...

Composite material and method for manufacturing the same

Heat dissipating material and manufacturing method thereof

Process for filling powder, apparatus therefor and process for prod...

Patents Applicationslast 30 patents

VEHICLE COMPRESSOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME

COMPRESSOR COMPONENT FOR TRANSPORT AND METHOD FOR MANUFACTURING SAME

AUSTENITIC CAST IRON, AUSTENITIC-CAST-IRON CAST PRODUCT AND MANUFAC...

AUSTENITIC CAST IRON AND MANUFACTURING PROCESS FOR THE SAME, AUSTEN...

METHOD OF PRODUCING BASE PLATE FOR CIRCUIT BOARD, BASE PLATE FOR CI...

Circuit board

Method of producing base plate circuit board, base plate for circui...

Circuit board and semiconductor device using the same

Low-expansion unit, method of manufacturing the same and semiconduc...

Composite material and method for manufacturing the same

Method of manufacturing a low expansion material and semiconductor...

Composite structural material, and method of producing the same

Heat dissipation member for electronic apparatus and method for pro...

Semiconductor module and plate-shaped lead

Low expansion plate, method of manufacturing the same, and semicond...

Radiator system, radiating method, thermal buffer, semiconductor mo...

Heat dissipating material and manufacturing method thereof

Process for filling powder, apparatus therefor and process for prod...