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Tomoo Iijima
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Multilayer wiring board for an electronic device
Patent number
10,104,785
Issue date
Oct 16, 2018
Invensas Corporation
Tomoo Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer wiring board for an electronic device
Patent number
9,521,755
Issue date
Dec 13, 2016
Invensas Corporation
Tomoo Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structure and method of making interconnect element having metal tr...
Patent number
8,736,064
Issue date
May 27, 2014
Invensas Corporation
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing multilayer wiring board
Patent number
8,112,881
Issue date
Feb 14, 2012
Tessera Interconnect Materials, Inc.
Kazuhiro Shimizu
B32 - LAYERED PRODUCTS
Information
Patent Grant
Methods of making microelectronic assemblies
Patent number
7,721,422
Issue date
May 25, 2010
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for wiring circuit substrate
Patent number
7,546,681
Issue date
Jun 16, 2009
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer wiring board for an electronic device
Patent number
7,505,281
Issue date
Mar 17, 2009
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer wiring board for an electronic device
Patent number
7,342,802
Issue date
Mar 11, 2008
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connecting member between wiring films, manufacturing method thereo...
Patent number
7,238,603
Issue date
Jul 3, 2007
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for wiring circuit substrate
Patent number
7,096,578
Issue date
Aug 29, 2006
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connecting member between wiring films, manufacturing method thereo...
Patent number
6,884,709
Issue date
Apr 26, 2005
North Corporation
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for wiring circuit substrates
Patent number
6,828,221
Issue date
Dec 7, 2004
North Corporation
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating a wiring substrate by electroplating a wirin...
Patent number
6,782,610
Issue date
Aug 31, 2004
North Corporation
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring circuit substrate and manufacturing method therefor
Patent number
6,646,337
Issue date
Nov 11, 2003
North Corporation
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fabrication method of wiring substrate for mounting semiconductor e...
Patent number
6,617,236
Issue date
Sep 9, 2003
Sony Corporation
Kenji Oosawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wiring circuit substrate and manufacturing method thereof
Patent number
6,528,874
Issue date
Mar 4, 2003
North Corporation
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Fabrication method of wiring substrate for mounting semiconductor e...
Patent number
6,372,620
Issue date
Apr 16, 2002
Sony Corporation
Kenji Oosawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Waste disposing system and apparatus
Patent number
5,613,345
Issue date
Mar 25, 1997
Cattleya Music Co., Ltd.
Yoshiko Saito
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Patents Applications
last 30 patents
Information
Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
Publication number
20170171986
Publication date
Jun 15, 2017
Invensas Corporation
Tomoo Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
Publication number
20140240934
Publication date
Aug 28, 2014
Invensas Corporation
Tomoo Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
Publication number
20130247372
Publication date
Sep 26, 2013
Invensas Corporation
Tomoo Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Structure And Method Of Making Interconnect Element Having Metal Tr...
Publication number
20110057324
Publication date
Mar 10, 2011
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring circuit board, manufacturing method for the wiring circuit b...
Publication number
20100242270
Publication date
Sep 30, 2010
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer wiring board for an electronic device
Publication number
20080296254
Publication date
Dec 4, 2008
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure and method of making interconnect element having metal tr...
Publication number
20080169568
Publication date
Jul 17, 2008
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Structure and method of making interconnect element having metal tr...
Publication number
20080136041
Publication date
Jun 12, 2008
Tessera Interconnect Materials, Inc.
Hideki Kotake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method For Manufacturing Multilayer Wiring Board
Publication number
20080110018
Publication date
May 15, 2008
SONY CHEMICAL & INFORMATION DEVICE CORPORATION
Kazuhiro Shimizu
B32 - LAYERED PRODUCTS
Information
Patent Application
Methods of making microelectronic assemblies
Publication number
20070209199
Publication date
Sep 13, 2007
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
FLEXIBLE CIRCUIT BOARD, METHOD FOR MAKING THE SAME, FLEXIBLE MULTI-...
Publication number
20070170598
Publication date
Jul 26, 2007
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer wiring board for an electronic device
Publication number
20070121305
Publication date
May 31, 2007
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Manufacturing method for wiring circuit substrate
Publication number
20060258139
Publication date
Nov 16, 2006
Tessera Interconnect Materials, Inc.
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Interlayer member used for producing multilayer wiring board and me...
Publication number
20050224256
Publication date
Oct 13, 2005
NORTH CORPORATION
Kenji Osawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Connecting member between wiring films, manufacturing method thereo...
Publication number
20050161804
Publication date
Jul 28, 2005
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-layer wiring board, method for producing multi-layer wiring b...
Publication number
20050097727
Publication date
May 12, 2005
Tomoo Iijima
B24 - GRINDING POLISHING
Information
Patent Application
Wiring circuit board, manufacturing method for the wiring circuit b...
Publication number
20040201096
Publication date
Oct 14, 2004
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Manufacturing method for wiring circuit substrate
Publication number
20040197962
Publication date
Oct 7, 2004
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Connecting member between wiring films, manufacturing method thereo...
Publication number
20030155653
Publication date
Aug 21, 2003
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring circuit substrate and manufacturing method therefor
Publication number
20030151067
Publication date
Aug 14, 2003
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring circuit substrate and manufacturing method therefor
Publication number
20030143833
Publication date
Jul 31, 2003
NORTH CORPORATION
Tomoo Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Fabrication method of wiring substrate for mounting semiconductor e...
Publication number
20020086514
Publication date
Jul 4, 2002
Kenji Oosawa
H01 - BASIC ELECTRIC ELEMENTS