Tomoyuki Abe

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method for loop heat pipe
- Patent number 11,536,518
- Issue date Dec 27, 2022
- Fujitsu Limited
- Takeshi Shioga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Loop heat pipe and manufacturing method for loop heat pipe and elec...
- Patent number 10,624,238
- Issue date Apr 14, 2020
- Fujitsu Limited
- Takeshi Shioga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Loop heat pipe, manufacturing method thereof, and electronic device
- Patent number 10,420,253
- Issue date Sep 17, 2019
- Fujitsu Limited
- Takeshi Shioga
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Circuit board, method of manufacturing the same, and resistance ele...
- Patent number 8,642,894
- Issue date Feb 4, 2014
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilevel interconnection board and method of fabricating the same
- Patent number 8,257,542
- Issue date Sep 4, 2012
- Fujitsu Limited
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of producing substrate
- Patent number 8,186,052
- Issue date May 29, 2012
- Fujitsu Limited
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate including conductive core substrate, and manufactu...
- Patent number 8,178,791
- Issue date May 15, 2012
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection substrate and method of manufacturing th...
- Patent number 8,158,503
- Issue date Apr 17, 2012
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of producing the same
- Patent number 8,153,908
- Issue date Apr 10, 2012
- Fujitsu Limited
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing substrate
- Patent number 8,151,456
- Issue date Apr 10, 2012
- Fujitsu Limited
- Yasutomo Maehara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 8,119,923
- Issue date Feb 21, 2012
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core substrate and printed wiring board
- Patent number 8,119,925
- Issue date Feb 21, 2012
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 8,110,749
- Issue date Feb 7, 2012
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core substrate and method of producing the same
- Patent number 8,035,037
- Issue date Oct 11, 2011
- Fujitsu Limited
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer interconnection substrate and manufacturing method therefor
- Patent number 7,915,541
- Issue date Mar 29, 2011
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Node apparatus and maintenance and operation supporting device
- Patent number 7,835,266
- Issue date Nov 16, 2010
- Fujitsu Limited
- Satoshi Kumano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device having multilayer printed wiring board and man...
- Patent number 7,799,604
- Issue date Sep 21, 2010
- Fujitsu Limited
- Tomoyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication process thereof
- Patent number 7,754,536
- Issue date Jul 13, 2010
- Fujitsu Limited
- Tomoyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer wiring board incorporating carb...
- Patent number 7,640,660
- Issue date Jan 5, 2010
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilevel interconnection board and method of fabricating the same
- Patent number 7,622,184
- Issue date Nov 24, 2009
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronic component-mounted board
- Patent number 7,595,228
- Issue date Sep 29, 2009
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio-frequency module for communication
- Patent number 7,436,679
- Issue date Oct 14, 2008
- Fujitsu Limited
- Shinya Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and fabrication process thereof
- Patent number 7,429,796
- Issue date Sep 30, 2008
- Fujitsu Limited
- Tomoyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for fabricating the same
- Patent number 7,420,130
- Issue date Sep 2, 2008
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having multilayer printed wiring board
- Patent number 7,400,035
- Issue date Jul 15, 2008
- Fujitsu Limited
- Tomoyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 7,388,157
- Issue date Jun 17, 2008
- Fujitsu Limited
- Tomoyuki Abe
- G01 - MEASURING TESTING
Information Patent Grant
Transport channel selecting apparatus and the selecting method
- Patent number 7,382,746
- Issue date Jun 3, 2008
- Fujitsu Limited
- Tomoyuki Abe
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring board and method for fabricating the same
- Patent number 7,246,435
- Issue date Jul 24, 2007
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module
- Patent number 7,248,222
- Issue date Jul 24, 2007
- Fujitsu Limited
- Shinya Iijima
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer wiring board incorporating carbon fibers and glass fibers
- Patent number 7,224,046
- Issue date May 29, 2007
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOOP HEAT PIPE AND MANUFACTURING METHOD FOR LOOP HEAT PIPE AND ELEC...
- Publication number 20190090386
- Publication date Mar 21, 2019
- Fujitsu Limited
- Takeshi Shioga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOOP HEAT PIPE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20190075682
- Publication date Mar 7, 2019
- Fujitsu Limited
- Takeshi SHIOGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOOP HEAT PIPE AND FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE
- Publication number 20180177077
- Publication date Jun 21, 2018
- Fujitsu Limited
- Takeshi SHIOGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE STATION AND SCHEDULING METHOD
- Publication number 20170245269
- Publication date Aug 24, 2017
- Fujitsu Limited
- Takato Ezaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COOLING SYSTEM
- Publication number 20140367081
- Publication date Dec 18, 2014
- FUJITSU LIMITED
- YOICHI TAKASU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110220396
- Publication date Sep 15, 2011
- Fujitsu Limited
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND RESISTANCE ELE...
- Publication number 20100193225
- Publication date Aug 5, 2010
- FUJITSU LIMITED
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILEVEL INTERCONNECTION BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20100024963
- Publication date Feb 4, 2010
- Fujitsu Limited
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
BUILDUP PRINTED CIRCUIT BOARD
- Publication number 20100018762
- Publication date Jan 28, 2010
- FUJITSU LIMITED
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20100018758
- Publication date Jan 28, 2010
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSMISSION DEVICE AND RECEPTION DEVICE FOR CIPHERING PROCESS
- Publication number 20100020973
- Publication date Jan 28, 2010
- Fujitsu Limited
- Tomoyuki ABE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING SUBSTRATE INCLUDING CONDUCTIVE CORE SUBSTRATE, AND MANUFACTU...
- Publication number 20090308651
- Publication date Dec 17, 2009
- FUJITSU LIMITED
- Tomoyuki ABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE SUBSTRATE AND PRINTED WIRING BOARD
- Publication number 20090294161
- Publication date Dec 3, 2009
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20090294166
- Publication date Dec 3, 2009
- Fujitsu Limited
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING SUBSTRATE
- Publication number 20090094824
- Publication date Apr 16, 2009
- FUJITSU LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090095524
- Publication date Apr 16, 2009
- FUJITSU LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20090095511
- Publication date Apr 16, 2009
- FUJITSU LIMITED
- Kenji Iida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20090095509
- Publication date Apr 16, 2009
- FUJITSU LIMITED
- Shin Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING SUBSTRATE
- Publication number 20090094825
- Publication date Apr 16, 2009
- FUJITSU LIMITED
- Yasutomo Maehara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE MEMBER AND METHOD OF PRODUCING THE SAME
- Publication number 20090098391
- Publication date Apr 16, 2009
- FUJITSU LIMITED
- Takashi NAKAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20090084590
- Publication date Apr 2, 2009
- FUJITSU LIMITED
- Hideaki YOSHIMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and fabrication process thereof
- Publication number 20080213945
- Publication date Sep 4, 2008
- FUJITSU LIMITED
- Tomoyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER INTERCONNECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20080192453
- Publication date Aug 14, 2008
- Fujitsu Limited
- Masateru Koide
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having multilayer printed wiring board and man...
- Publication number 20070257356
- Publication date Nov 8, 2007
- FUJITSU LIMITED
- Tomoyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and method for fabricating the same
- Publication number 20070240901
- Publication date Oct 18, 2007
- Fujitsu Limited
- Keishiro Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer interconnection substrate and method of manufacturing th...
- Publication number 20070232059
- Publication date Oct 4, 2007
- FUJITSU LIMITED
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and fabrication process thereof
- Publication number 20070222085
- Publication date Sep 27, 2007
- FUJITSU LIMITED
- Tomoyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD INCORPORATING CARBON FIBERS AND GLASS FIBERS
- Publication number 20070186414
- Publication date Aug 16, 2007
- FUJITSU LIMITED
- Tomoyuki Abe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilevel interconnection board and method of fabricating the same
- Publication number 20070077391
- Publication date Apr 5, 2007
- FUJITSU LIMITED
- Keishiro Okamoto
- B32 - LAYERED PRODUCTS
Information Patent Application
High-frequency module
- Publication number 20070013581
- Publication date Jan 18, 2007
- FUJITSU LIMITED
- Shinya Iijima
- G01 - MEASURING TESTING

Tomoyuki Abe

Person

Patents Grantslast 30 patents

Fabrication method for loop heat pipe

Loop heat pipe and manufacturing method for loop heat pipe and elec...

Loop heat pipe, manufacturing method thereof, and electronic device

Circuit board, method of manufacturing the same, and resistance ele...

Multilevel interconnection board and method of fabricating the same

Method of producing substrate

Wiring substrate including conductive core substrate, and manufactu...

Multilayer interconnection substrate and method of manufacturing th...

Circuit board and method of producing the same

Method of producing substrate

Circuit board

Core substrate and printed wiring board

Printed wiring board

Core substrate and method of producing the same

Multilayer interconnection substrate and manufacturing method therefor

Node apparatus and maintenance and operation supporting device

Semiconductor device having multilayer printed wiring board and man...

Semiconductor device and fabrication process thereof

Method for manufacturing multilayer wiring board incorporating carb...

Multilevel interconnection board and method of fabricating the same

Method for manufacturing electronic component-mounted board

Radio-frequency module for communication

Semiconductor device and fabrication process thereof

Wiring board and method for fabricating the same

Semiconductor device having multilayer printed wiring board

Printed wiring board

Transport channel selecting apparatus and the selecting method

Wiring board and method for fabricating the same

High-frequency module

Multilayer wiring board incorporating carbon fibers and glass fibers

Patents Applicationslast 30 patents

LOOP HEAT PIPE AND MANUFACTURING METHOD FOR LOOP HEAT PIPE AND ELEC...

LOOP HEAT PIPE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE

LOOP HEAT PIPE AND FABRICATION METHOD THEREFOR, AND ELECTRONIC DEVICE

BASE STATION AND SCHEDULING METHOD

COOLING SYSTEM

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND RESISTANCE ELE...

MULTILEVEL INTERCONNECTION BOARD AND METHOD OF FABRICATING THE SAME

BUILDUP PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

TRANSMISSION DEVICE AND RECEPTION DEVICE FOR CIPHERING PROCESS

WIRING SUBSTRATE INCLUDING CONDUCTIVE CORE SUBSTRATE, AND MANUFACTU...

CORE SUBSTRATE AND PRINTED WIRING BOARD

PRINTED WIRING BOARD

METHOD OF PRODUCING SUBSTRATE

CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME

CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME

CORE SUBSTRATE AND METHOD OF PRODUCING THE SAME

METHOD OF PRODUCING SUBSTRATE

CORE MEMBER AND METHOD OF PRODUCING THE SAME

CIRCUIT BOARD

Semiconductor device and fabrication process thereof

MULTILAYER INTERCONNECTION SUBSTRATE AND MANUFACTURING METHOD THEREFOR

Semiconductor device having multilayer printed wiring board and man...

Wiring board and method for fabricating the same

Multilayer interconnection substrate and method of manufacturing th...

Semiconductor device and fabrication process thereof

MULTILAYER WIRING BOARD INCORPORATING CARBON FIBERS AND GLASS FIBERS

Multilevel interconnection board and method of fabricating the same

High-frequency module