Tomoyuki KIKUCHI

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Triazine ring-containing polymer, and thermoplastic article and opt...
- Patent number 11,851,529
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Yoshiyuki Oishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,830,845
- Issue date Nov 28, 2023
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 11,424,211
- Issue date Aug 23, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic-inorganic hybrid composition, and article and optical compo...
- Patent number 11,312,840
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Tomoyuki Kikuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Triazine ring-containing polymer, and thermoplastic article and opt...
- Patent number 11,180,612
- Issue date Nov 23, 2021
- Samsung Electronics Co., Ltd.
- Yoshiyuki Oishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,833,044
- Issue date Nov 10, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic-inorganic hybrid composition, and article and optical compo...
- Patent number 10,717,866
- Issue date Jul 21, 2020
- Samsung Electronics Co., Ltd.
- Yoshiyuki Oishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,593,643
- Issue date Mar 17, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 10,062,661
- Issue date Aug 28, 2018
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,691,731
- Issue date Jun 27, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,224,717
- Issue date Dec 29, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 9,093,435
- Issue date Jul 28, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,969,133
- Issue date Mar 3, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
- Patent number 8,618,659
- Issue date Dec 31, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,598,045
- Issue date Dec 3, 2013
- Fujitsu Semiconductor Limited
- Hideaki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20240203930
- Publication date Jun 20, 2024
- Adeia Semiconductor Solutions LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT INK COMPOSITION, AND QUANTUM DOT ELECTROLUMINESCENT DEVICE
- Publication number 20230287231
- Publication date Sep 14, 2023
- Samsung Electronics Co., Ltd.
- Hiroko ENDO
- B82 - NANO-TECHNOLOGY
Information Patent Application
QUANTUM DOT INK COMPOSITION, AND QUANTUM DOT ELECTROLUMINESCENT DEVICE
- Publication number 20230257607
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Keigo FURUTA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20220375891
- Publication date Nov 24, 2022
- TESSERA LLC
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUNDS, LIQUID COMPOSITIONS INCLUDING COMPOUNDS, AND ELECTROLUMI...
- Publication number 20220213022
- Publication date Jul 7, 2022
- Fumiaki KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPOLYMER, ELECTROLUMINESCENT DEVICE MATERIAL INCLUDING COPOLYMER,...
- Publication number 20220204673
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Takahiro FUJIYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Package-On-Package Assembly With Wire Bonds To Encapsulation Surface
- Publication number 20210050322
- Publication date Feb 18, 2021
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIAZINE RING-CONTAINING POLYMER, AND THERMOPLASTIC ARTICLE AND OPT...
- Publication number 20200362112
- Publication date Nov 19, 2020
- Samsung Electronics Co., Ltd.
- Yoshiyuki OISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20200168579
- Publication date May 28, 2020
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIAZINE RING-CONTAINING POLYMER, AND THERMOPLASTIC ARTICLE AND OPT...
- Publication number 20200062907
- Publication date Feb 27, 2020
- Samsung Electronics Co., Ltd.
- Yoshiyuki OISHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ORGANIC-INORGANIC HYBRID COMPOSITION, AND ARTICLE AND OPTICAL COMPO...
- Publication number 20200062927
- Publication date Feb 27, 2020
- Samsung Electronics Co., Ltd.
- Tomoyuki KIKUCHI
- G02 - OPTICS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20180350766
- Publication date Dec 6, 2018
- Tessera, Inc.
- Hiroaki SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC-INORGANIC HYBRID COMPOSITION, AND ARTICLE AND OPTICAL COMPO...
- Publication number 20180244915
- Publication date Aug 30, 2018
- Samsung Electronics Co., Ltd.
- Yoshiyuki OISHI
- G02 - OPTICS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20170287733
- Publication date Oct 5, 2017
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20160211237
- Publication date Jul 21, 2016
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated Structure, Method of Preparing Same, and Method of Fabric...
- Publication number 20150151514
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- Tomoyuki KIKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20150091118
- Publication date Apr 2, 2015
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FILM AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140154518
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Tomoyuki KIKUCHI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20130203216
- Publication date Aug 8, 2013
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING GAS BARRIER LAMINATE
- Publication number 20120301633
- Publication date Nov 29, 2012
- FUJIFILM CORPORATION
- Tomoyuki KIKUCHI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
- Publication number 20120280386
- Publication date Nov 8, 2012
- Tessera, Inc.
- Hiroaki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS BARRIER LAMINATE FILM AND METHOD OF PRODUCING GAS BARRIER LAMIN...
- Publication number 20100304106
- Publication date Dec 2, 2010
- FUJIFILM CORPORATION
- NOBUHIKO TAKANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PRODUCING GAS BARRIER LAMINATE AND GAS BARRIER LAMINATE O...
- Publication number 20100261017
- Publication date Oct 14, 2010
- FUJIFILM Corporation
- Tomoyuki KIKUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
GAS BARRIER FILM AND METHOD OF PRODUCING THE SAME
- Publication number 20100261008
- Publication date Oct 14, 2010
- FUJIFILM CORPORATION
- Tomoyuki KIKUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100255675
- Publication date Oct 7, 2010
- FUJITSU MICROELECTRONICS LIMITED
- Hideaki Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20080203576
- Publication date Aug 28, 2008
- Fujitsu Limited
- Hideaki KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS

Tomoyuki KIKUCHI

Person

Patents Grantslast 30 patents

Triazine ring-containing polymer, and thermoplastic article and opt...

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Organic-inorganic hybrid composition, and article and optical compo...

Triazine ring-containing polymer, and thermoplastic article and opt...

Package-on-package assembly with wire bonds to encapsulation surface

Organic-inorganic hybrid composition, and article and optical compo...

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Package-on-package assembly with wire bonds to encapsulation surface

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

QUANTUM DOT INK COMPOSITION, AND QUANTUM DOT ELECTROLUMINESCENT DEVICE

QUANTUM DOT INK COMPOSITION, AND QUANTUM DOT ELECTROLUMINESCENT DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

COMPOUNDS, LIQUID COMPOSITIONS INCLUDING COMPOUNDS, AND ELECTROLUMI...

COPOLYMER, ELECTROLUMINESCENT DEVICE MATERIAL INCLUDING COPOLYMER,...

Package-On-Package Assembly With Wire Bonds To Encapsulation Surface

TRIAZINE RING-CONTAINING POLYMER, AND THERMOPLASTIC ARTICLE AND OPT...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

TRIAZINE RING-CONTAINING POLYMER, AND THERMOPLASTIC ARTICLE AND OPT...

ORGANIC-INORGANIC HYBRID COMPOSITION, AND ARTICLE AND OPTICAL COMPO...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

ORGANIC-INORGANIC HYBRID COMPOSITION, AND ARTICLE AND OPTICAL COMPO...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

Laminated Structure, Method of Preparing Same, and Method of Fabric...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

BARRIER FILM AND METHOD OF MANUFACTURING THE SAME

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

METHOD OF PRODUCING GAS BARRIER LAMINATE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE

GAS BARRIER LAMINATE FILM AND METHOD OF PRODUCING GAS BARRIER LAMIN...

METHOD OF PRODUCING GAS BARRIER LAMINATE AND GAS BARRIER LAMINATE O...

GAS BARRIER FILM AND METHOD OF PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME