Tong-Hong Wang

Person

Selangor D. E., MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using an active type heat-spreading element
- Patent number 8,022,534
- Issue date Sep 20, 2011
- Advanced Semiconductor Engineering, Inc.
- Tong Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging process
- Patent number 7,482,204
- Issue date Jan 27, 2009
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and chip packaging process
- Patent number 7,335,982
- Issue date Feb 26, 2008
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation apparatus for package device
- Patent number 7,259,456
- Issue date Aug 21, 2007
- Advanced Semiconductor Engineering Inc.
- Tong-Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE USING AN ACTIVE TYPE HEAT-SPREADING ELEMENT
- Publication number 20090250806
- Publication date Oct 8, 2009
- Advanced Semiconductor Engineering, Inc.
- Tong Hong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE AS WELL AS METHOD FOR...
- Publication number 20090230544
- Publication date Sep 17, 2009
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Tong Hong WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20080272486
- Publication date Nov 6, 2008
- Advanced Semiconductor Engineering, Inc.
- Wei-Chung Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGING PROCESS
- Publication number 20080096325
- Publication date Apr 24, 2008
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS
- Publication number 20070145604
- Publication date Jun 28, 2007
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK AND PACKAGE STRUCTURE
- Publication number 20060197219
- Publication date Sep 7, 2006
- Chang-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Asymmetric bump structure
- Publication number 20050263883
- Publication date Dec 1, 2005
- Advance Semiconductor Engineering Inc.
- Tong-Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND CHIP PACKAGING PROCESS
- Publication number 20050224956
- Publication date Oct 13, 2005
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipation apparatus for package device
- Publication number 20050040520
- Publication date Feb 24, 2005
- Tong-Hong Wang
- H01 - BASIC ELECTRIC ELEMENTS

Tong-Hong Wang

Person

Patents Grantslast 30 patents

Semiconductor package using an active type heat-spreading element

Chip packaging process

Chip package structure and chip packaging process

Heat dissipation apparatus for package device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE USING AN ACTIVE TYPE HEAT-SPREADING ELEMENT

HEAT SINK STRUCTURE AND SEMICONDUCTOR PACKAGE AS WELL AS METHOD FOR...

CHIP PACKAGE STRUCTURE

CHIP PACKAGING PROCESS

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

HEAT SINK AND PACKAGE STRUCTURE

Asymmetric bump structure

CHIP PACKAGE STRUCTURE AND CHIP PACKAGING PROCESS

Heat dissipation apparatus for package device