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Toshihide MAKINO

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  • Ogaki, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Wiring substrate
    • Patent number 11,406,016
    • Issue date Aug 2, 2022
    • Ibiden Co., Ltd.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board and method for manufacturing the same
    • Patent number 11,277,925
    • Issue date Mar 15, 2022
    • Ibiden Co., Ltd.
    • Toshihide Makino
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate
    • Patent number 11,160,164
    • Issue date Oct 26, 2021
    • Ibiden Co., Ltd.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate
    • Patent number 11,116,080
    • Issue date Sep 7, 2021
    • Ibiden Co., Ltd.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate
    • Patent number 10,986,729
    • Issue date Apr 20, 2021
    • Ibiden Co., Ltd.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring substrate
    • Patent number 10,945,334
    • Issue date Mar 9, 2021
    • Ibiden Co., Ltd.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wiring board and method for manufacturing the same
    • Patent number 10,813,232
    • Issue date Oct 20, 2020
    • Ibiden Co., Ltd.
    • Toshihide Makino
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 10,645,819
    • Issue date May 5, 2020
    • Ibiden Co., Ltd.
    • Toshiki Furutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 10,440,823
    • Issue date Oct 8, 2019
    • Ibiden Co., Ltd.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 10,405,426
    • Issue date Sep 3, 2019
    • Ibiden Co., Ltd.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 10,375,828
    • Issue date Aug 6, 2019
    • Ibiden Co., Ltd.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 10,368,440
    • Issue date Jul 30, 2019
    • Ibiden Co., Ltd.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board
    • Patent number 10,314,168
    • Issue date Jun 4, 2019
    • Ibiden Co., Ltd.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Printed wiring board for mounting electronic component
    • Patent number 10,231,336
    • Issue date Mar 12, 2019
    • Ibiden Co., Ltd.
    • Toshiki Furutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for manufacturing wiring board
    • Patent number 9,743,528
    • Issue date Aug 22, 2017
    • Ibiden Co., Ltd.
    • Toshihide Makino
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20200315009
    • Publication date Oct 1, 2020
    • IBIDEN CO., LTD.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20200315013
    • Publication date Oct 1, 2020
    • IBIDEN CO., LTD.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20200315002
    • Publication date Oct 1, 2020
    • IBIDEN CO., LTD.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20200315011
    • Publication date Oct 1, 2020
    • IBIDEN CO., LTD.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20200315012
    • Publication date Oct 1, 2020
    • IBIDEN CO., LTD.
    • Takenobu Nakamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20200296841
    • Publication date Sep 17, 2020
    • IBIDEN CO., LTD.
    • Toshihide MAKINO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20190215959
    • Publication date Jul 11, 2019
    • IBIDEN CO., LTD.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20190200462
    • Publication date Jun 27, 2019
    • IBIDEN CO., LTD.
    • Toshiki Furutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER WIRING BOARD
    • Publication number 20190200465
    • Publication date Jun 27, 2019
    • IBIDEN CO., LTD.
    • Yoji Mori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20190124765
    • Publication date Apr 25, 2019
    • IBIDEN CO., LTD.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20190124768
    • Publication date Apr 25, 2019
    • IBIDEN CO., LTD.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20190124766
    • Publication date Apr 25, 2019
    • IBIDEN CO., LTD.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20190124767
    • Publication date Apr 25, 2019
    • IBIDEN CO., LTD.
    • Takema Adachi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20180270951
    • Publication date Sep 20, 2018
    • IBIDEN CO., LTD.
    • Toshiki Furutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20180042124
    • Publication date Feb 8, 2018
    • IBIDEN CO., LTD.
    • Toshihide MAKINO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR MANUFACTURING WIRING BOARD
    • Publication number 20150257276
    • Publication date Sep 10, 2015
    • IBIDEN CO., LTD.
    • Toshihide MAKINO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR