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Toshiki Furutani

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  • Ogaki, JP
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240306299
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240306296
    • Publication date Sep 12, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240284606
    • Publication date Aug 22, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240243049
    • Publication date Jul 18, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240203891
    • Publication date Jun 20, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240196526
    • Publication date Jun 13, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20240049398
    • Publication date Feb 8, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240030144
    • Publication date Jan 25, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240021532
    • Publication date Jan 18, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240023250
    • Publication date Jan 18, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240008191
    • Publication date Jan 4, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20240008176
    • Publication date Jan 4, 2024
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230397335
    • Publication date Dec 7, 2023
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    • Publication number 20230171884
    • Publication date Jun 1, 2023
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230171889
    • Publication date Jun 1, 2023
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230145004
    • Publication date May 11, 2023
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20230144361
    • Publication date May 11, 2023
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20190200462
    • Publication date Jun 27, 2019
    • IBIDEN CO., LTD.
    • Toshiki Furutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20190104615
    • Publication date Apr 4, 2019
    • IBIDEN CO., LTD.
    • Toshiki Furutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20180270951
    • Publication date Sep 20, 2018
    • IBIDEN CO., LTD.
    • Toshiki Furutani
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACT...
    • Publication number 20180237934
    • Publication date Aug 23, 2018
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20180110163
    • Publication date Apr 19, 2018
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20180110159
    • Publication date Apr 19, 2018
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20180110161
    • Publication date Apr 19, 2018
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SHIELD CAP AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20180110164
    • Publication date Apr 19, 2018
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD AND SEMICONDUCTOR PACKAGE
    • Publication number 20160336261
    • Publication date Nov 17, 2016
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANU...
    • Publication number 20160316566
    • Publication date Oct 27, 2016
    • IBIDEN CO., LTD.
    • Kenji SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20160316558
    • Publication date Oct 27, 2016
    • IBIDEN CO., LTD.
    • Shunsuke SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER WIRING BOARD
    • Publication number 20160255717
    • Publication date Sep 1, 2016
    • IBIDEN CO., LTD.
    • Toshiki FURUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED WIRING BOARD
    • Publication number 20160174372
    • Publication date Jun 16, 2016
    • IBIDEN CO., LTD.
    • Yasushi INAGAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR