Toshio Hamano

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a heat spreader exposed from a seal resin
- Patent number 7,193,320
- Issue date Mar 20, 2007
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including a plurality of semiconductor devices...
- Patent number 6,696,754
- Issue date Feb 24, 2004
- Fujitsu Limited
- Mitsutaka Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module including a plurality of semiconductor devices...
- Patent number 6,472,744
- Issue date Oct 29, 2002
- Fujitsu Limited
- Mitsutaka Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of producing semiconductor device and...
- Patent number 6,462,424
- Issue date Oct 8, 2002
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for a vertically accumulable semiconductor device with ex...
- Patent number 6,433,418
- Issue date Aug 13, 2002
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 6,347,037
- Issue date Feb 12, 2002
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount type semiconductor device and method of producing the...
- Patent number 6,333,564
- Issue date Dec 25, 2001
- Fujitsu Limited
- Yoshitsugu Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic package for semiconductor device
- Patent number 6,307,259
- Issue date Oct 23, 2001
- Fujitsu Limited
- Kenji Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,288,444
- Issue date Sep 11, 2001
- Fujitsu Limited
- Mitsuo Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LSI package with equal length transmission Lines
- Patent number 6,235,997
- Issue date May 22, 2001
- Fujitsu Limited
- Kenji Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an assembly board with insulator filled through h...
- Patent number 6,184,133
- Issue date Feb 6, 2001
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of producing semiconductor device and...
- Patent number 6,165,819
- Issue date Dec 26, 2000
- Fujitsu Limited
- Masaaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device module
- Patent number 6,094,356
- Issue date Jul 25, 2000
- Fujitsu Limited
- Tetsuya Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 6,088,233
- Issue date Jul 11, 2000
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,978,222
- Issue date Nov 2, 1999
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor unit having semiconductor device and multilayer subst...
- Patent number 5,923,540
- Issue date Jul 13, 1999
- Fujitsu Limited
- Kenji Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a packaged semiconductor having a divided...
- Patent number 5,804,468
- Issue date Sep 8, 1998
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and assembly board having through-holes filled...
- Patent number 5,729,435
- Issue date Mar 17, 1998
- Fujitsu Limited
- Makoto Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and lead frame therefore
- Patent number 5,497,032
- Issue date Mar 5, 1996
- Fujitsu Limited
- Kazuto Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor device having an improved adhe...
- Patent number 5,407,502
- Issue date Apr 18, 1995
- Fujitsu Limited
- Takeshi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having improved adhesive structure and method...
- Patent number 5,278,429
- Issue date Jan 11, 1994
- Fujitsu Limited
- Takeshi Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having package structure
- Patent number 4,999,319
- Issue date Mar 12, 1991
- Fujitsu Limited
- Toshio Hamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having soldered bond between base and cap thereof
- Patent number 4,626,960
- Issue date Dec 2, 1986
- Fujitsu Limited
- Toshio Hamano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device having a heat spreader exposed from a seal resin
- Publication number 20070114642
- Publication date May 24, 2007
- Fujitsu Limited
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a heat spreader exposed from a seal resin
- Publication number 20030222344
- Publication date Dec 4, 2003
- FUJITSU LIMITED
- Sumikazu Hosoyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module including a plurality of semiconductor devices...
- Publication number 20030164544
- Publication date Sep 4, 2003
- FUJITSU LIMITED
- Mitsutaka Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.
- Publication number 20020001178
- Publication date Jan 3, 2002
- MAKOTO IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF SEMICONDUCTOR DEVICES...
- Publication number 20020000645
- Publication date Jan 3, 2002
- MITSUTAKA SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20010052653
- Publication date Dec 20, 2001
- Mitsuo Abe
- H01 - BASIC ELECTRIC ELEMENTS

Toshio Hamano

Person

Patents Grantslast 30 patents

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor module including a plurality of semiconductor devices...

Semiconductor module including a plurality of semiconductor devices...

Semiconductor device, method of producing semiconductor device and...

Apparatus for a vertically accumulable semiconductor device with ex...

Semiconductor device and method of forming the same

Surface mount type semiconductor device and method of producing the...

Plastic package for semiconductor device

Semiconductor device and method of producing the same

LSI package with equal length transmission Lines

Method of forming an assembly board with insulator filled through h...

Semiconductor device, method of producing semiconductor device and...

Semiconductor device and semiconductor device module

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and assembly board having through-holes filled...

Semiconductor unit having semiconductor device and multilayer subst...

Process for manufacturing a packaged semiconductor having a divided...

Semiconductor device and assembly board having through-holes filled...

Semiconductor device and lead frame therefore

Method for producing a semiconductor device having an improved adhe...

Semiconductor device having improved adhesive structure and method...

Method of manufacturing semiconductor device having package structure

Semiconductor device having soldered bond between base and cap thereof

Patents Applicationslast 30 patents

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor device having a heat spreader exposed from a seal resin

Semiconductor module including a plurality of semiconductor devices...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME.

SEMICONDUCTOR MODULE INCLUDING A PLURALITY OF SEMICONDUCTOR DEVICES...

Semiconductor device and method of producing the same