Toshio Shintani

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate-less pressure-sensitive adhesive sheet for protection of...
- Patent number 8,388,786
- Issue date Mar 5, 2013
- Nitto Denko Corporation
- Takashi Habu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive sheet for processing semiconductor substrates
- Patent number 7,943,235
- Issue date May 17, 2011
- Nitto Denko Corporation
- Akiyoshi Yamamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Pressure-sensitive adhesive sheet for processing semiconductor wafe...
- Patent number 7,727,811
- Issue date Jun 1, 2010
- Nitto Denko Corporation
- Toshio Shintani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wired circuit board
- Patent number 6,841,737
- Issue date Jan 11, 2005
- Nitto Denko Corporation
- Makoto Komatsubara
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit board and connection structure of terminal portion of the same
- Patent number 6,717,059
- Issue date Apr 6, 2004
- Nitto Denko Corporation
- Toshio Shintani
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE TAPE OR SHEET
- Publication number 20140154450
- Publication date Jun 5, 2014
- NITTO EUROPE N.V.
- Takumi Yutou
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LAMINATE
- Publication number 20130251985
- Publication date Sep 26, 2013
- NITTO DENKO CORPORATION
- Tadatoshi Nakanishi
- B32 - LAYERED PRODUCTS
Information Patent Application
TACKINESS ADHESIVE SHEET FOR THIN-FILM SUBSTRATE FIXING
- Publication number 20120222805
- Publication date Sep 6, 2012
- Nitto Denko Corporation
- Toshio SHINTANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING THIN-FILM SUBSTRATE
- Publication number 20120223455
- Publication date Sep 6, 2012
- Nitto Denko Corporation
- Toshio SHINTANI
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATE FOR NONAQUEOUS BATTERY
- Publication number 20120196171
- Publication date Aug 2, 2012
- Nitto Denko Corporation
- Shinsuke IKISHIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR PROCESSING OF SEMICONDUCTOR WAFTER
- Publication number 20120114938
- Publication date May 10, 2012
- NITTO DENKO CORPORATION
- Michihito Ooishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE TAPE FOR BATTERY
- Publication number 20120107573
- Publication date May 3, 2012
- Nitto Denko Corporation
- Jun Iwata
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE...
- Publication number 20110300709
- Publication date Dec 8, 2011
- Nitto Denko Corporation
- Toshio Shintani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE TAPE OR SHEET
- Publication number 20110151252
- Publication date Jun 23, 2011
- NITTO DENKO CORPORATION
- Toshio Shintani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RE-PEELABLE ADHESIVE SHEET
- Publication number 20110097576
- Publication date Apr 28, 2011
- Nitto Denko Corporation
- Takashi HABU
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE-LESS PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTION OF...
- Publication number 20100230036
- Publication date Sep 16, 2010
- Nitto Denko Corporation
- Takashi HABU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20100028662
- Publication date Feb 4, 2010
- Nitto Denko Corporation
- Toshio Shintani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER AND ADHESIVE SH...
- Publication number 20090314417
- Publication date Dec 24, 2009
- Nitto Denko Corporation
- Takatoshi SASAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR WATER JET LASER DICING
- Publication number 20090311474
- Publication date Dec 17, 2009
- Tomokazu Takahashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20080261038
- Publication date Oct 23, 2008
- Nitto Denko Corporation
- Akiyoshi Yamamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROCESSING
- Publication number 20080248296
- Publication date Oct 9, 2008
- Nitto Denko Corporation
- Toshio SHINTANI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR WATER JET LASER DICING
- Publication number 20080182095
- Publication date Jul 31, 2008
- Nitto Denko Corporation
- Fumiteru Asai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENS...
- Publication number 20080138618
- Publication date Jun 12, 2008
- Nitto Denko Corporation
- Takatoshi Sasaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES
- Publication number 20080118764
- Publication date May 22, 2008
- Nitto Denko Corporation
- Toshio SHINTANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET FOR WATER JET LASER DICING
- Publication number 20080108262
- Publication date May 8, 2008
- Nitto Denko Corporation
- Fumiteru Asai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive sheet for laser processing
- Publication number 20080085397
- Publication date Apr 10, 2008
- Nitto Denko Corporation
- Fumiteru Asai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive sheet for laser processing
- Publication number 20080057306
- Publication date Mar 6, 2008
- Nitto Denko Corporation
- Takatoshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive sheet for water jet laser dicing
- Publication number 20080057253
- Publication date Mar 6, 2008
- Nitto Denko Corporation
- Takatoshi Sasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE...
- Publication number 20080057216
- Publication date Mar 6, 2008
- Nitto Denko Corporation
- Toshio SHINTANI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive sheet for water jet laser dicing
- Publication number 20080057270
- Publication date Mar 6, 2008
- Nitto Denko Corporation
- Tsubasa Miki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WARPAGE-INHIBITIVE PRESSURE-SENSITIVE ADHESIVE SHEETS FOR WAFER GRI...
- Publication number 20080038551
- Publication date Feb 14, 2008
- Nitto Denko Corporation
- Toshio SHINTANI
- B32 - LAYERED PRODUCTS
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFE...
- Publication number 20070264498
- Publication date Nov 15, 2007
- Nitto Denko Corporation
- Toshio Shintani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Pressure-sensitive adhesive tape or sheet for application to active...
- Publication number 20070190318
- Publication date Aug 16, 2007
- Nitto Denko Corporation
- Fumiteru Asai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Pressure-sensitive adhesive sheet, production method thereof and me...
- Publication number 20070036930
- Publication date Feb 15, 2007
- Nitto Denko Corporation
- Tomohiro Kontani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET FOR USE IN DICING AND METHOD OF P...
- Publication number 20060257651
- Publication date Nov 16, 2006
- Toshio Shintani
- B32 - LAYERED PRODUCTS

Toshio Shintani

Person

Patents Grantslast 30 patents

Substrate-less pressure-sensitive adhesive sheet for protection of...

Adhesive sheet for processing semiconductor substrates

Pressure-sensitive adhesive sheet for processing semiconductor wafe...

Wired circuit board

Circuit board and connection structure of terminal portion of the same

Patents Applicationslast 30 patents

ADHESIVE TAPE OR SHEET

LAMINATE

TACKINESS ADHESIVE SHEET FOR THIN-FILM SUBSTRATE FIXING

METHOD FOR MANUFACTURING THIN-FILM SUBSTRATE

LAMINATE FOR NONAQUEOUS BATTERY

ADHESIVE SHEET FOR PROCESSING OF SEMICONDUCTOR WAFTER

PRESSURE-SENSITIVE ADHESIVE TAPE FOR BATTERY

METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE...

ADHESIVE TAPE OR SHEET

RE-PEELABLE ADHESIVE SHEET

SUBSTRATE-LESS PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTION OF...

ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES

METHOD OF GRINDING BACK SIDE OF SEMICONDUCTOR WAFER AND ADHESIVE SH...

ADHESIVE SHEET FOR WATER JET LASER DICING

ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR SUBSTRATES

PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROCESSING

ADHESIVE SHEET FOR WATER JET LASER DICING

REMOVABLE PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENS...

ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFERS AND/OR SUBSTRATES

ADHESIVE SHEET FOR WATER JET LASER DICING

Adhesive sheet for laser processing

Adhesive sheet for laser processing

Adhesive sheet for water jet laser dicing

METHOD OF SEMICONDUCTOR WAFER BACK PROCESSING, METHOD OF SUBSTRATE...

Adhesive sheet for water jet laser dicing

WARPAGE-INHIBITIVE PRESSURE-SENSITIVE ADHESIVE SHEETS FOR WAFER GRI...

PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROCESSING SEMICONDUCTOR WAFE...

Pressure-sensitive adhesive tape or sheet for application to active...

Pressure-sensitive adhesive sheet, production method thereof and me...

PRESSURE-SENSITIVE ADHESIVE SHEET FOR USE IN DICING AND METHOD OF P...