Pressure-sensitive adhesive tape or sheet for application to active surface in dicing and method of picking up chips of work

Abstract

The present invention relates to a pressure-sensitive adhesive tape or sheet for dicing which is to be applied to an active surface in the state of being not wholly covered with a native oxide film. The adhesive tape or sheet includes a substrate, and a radiation-curable pressure-sensitive adhesive layer disposed on at least one side of the substrate, in which the pressure-sensitive adhesive layer contains an acrylic polymer (A) having a weight-average molecular weight of 500,000 or higher and at least one radiation-polymerizable compound (B) selected from cyanurate compounds having one or more groups containing a carbon-carbon double bond and isocyanurate compounds having one or more groups containing a carbon-carbon double bond, and the ratio of the radiation-polymerizable compound (B) with respect to 100 parts by weight of the acrylic polymer (A) is 5 to 150 parts by weight.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagrammatic sectional view illustrating one embodiment of the pressure-sensitive adhesive tape or sheet for application to an active surface in dicing of the invention.

FIG. 2 is a diagrammatic sectional view illustrating a method of measuring the adhesive force of a pressure-sensitive adhesive tape or sheet for application to an active surface in dicing.

Claims

1. A pressure-sensitive adhesive tape or sheet for dicing, which comprises: a substrate, anda radiation-curable pressure-sensitive adhesive layer disposed on at least one side of the substrate,said pressure-sensitive adhesive layer containing an acrylic polymer (A) having a weight-average molecular weight of 500,000 or higher and at least one radiation-polymerizable compound (B) selected from cyanurate compounds having one or more groups containing a carbon-carbon double bond and isocyanurate compounds having one or more groups containing a carbon-carbon double bond, wherein the ratio of the radiation-polymerizable compound (B) with respect to 100 parts by weight of the acrylic polymer (A) is 5 to 150 parts by weight, andwherein said pressure-sensitive adhesive tape or sheet is to be applied to an active surface in the state of being not wholly covered with a native oxide film.

2. The pressure-sensitive adhesive tape or sheet according to claim 1, wherein the radiation-polymerizable compound (B) has, in the molecule thereof, 2 to 12 groups containing a carbon-carbon double bond.

3. The pressure-sensitive adhesive tape or sheet according to claim 2, wherein the radiation-polymerizable compound (B) has, in the molecule thereof, 3 to 10 groups containing a carbon-carbon double bond.

4. The pressure-sensitive adhesive tape or sheet according to claim 1, wherein said one or more groups containing a carbon-carbon double bond in the radiation-polymerizable compound (B) each independently are a group of at least one kind selected from vinyl, allyl, acryloxy, and methacryloxy.

5. The pressure-sensitive adhesive tape or sheet according to claim 1, wherein the acrylic polymer (A) has a weight-average molecular weight of 800,000 or higher.

6. The pressure-sensitive adhesive tape or sheet according to claim 1, wherein the acrylic polymer (A) has one or more carbon-carbon double bonds in the side chain or main chain thereof or at the ends of the main chain thereof.

7. The pressure-sensitive adhesive tape or sheet according to claim 1, wherein the ratio of the radiation-polymerizable compound (B) with respect to 100 parts by weight of the acrylic polymer (A) is 20 to 120 parts by weight.

8. A method of picking up chips of a work, which comprises: applying the pressure-sensitive adhesive tape or sheet according to claim 1 to an active surface of a work, followed by dicing the work to prepare chips; andpicking up the chips.