Tsang-Jiuh Wu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Singulation and bonding methods and structures formed thereby
- Patent number 12,159,860
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,485
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for component electrode connection
- Patent number 12,142,524
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structure and method forming same
- Patent number 12,074,064
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 12,015,008
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer bonding method
- Patent number 11,973,055
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,961,800
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, and sem...
- Patent number 11,948,920
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with through substrate vias and manufacturi...
- Patent number 11,855,021
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device having backside interconnect...
- Patent number 11,823,979
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,774,675
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kuang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure and method
- Patent number 11,756,883
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 11,728,296
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,594,420
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having through-silicon vias
- Patent number 11,545,392
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV structure and method forming same
- Patent number 11,527,439
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with nanostructures aligned with grating coupl...
- Patent number 11,487,060
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Kuang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for coupling attached component upper electrode to substrate
- Patent number 11,469,138
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via for semiconductor device connection and methods of forming the...
- Patent number 11,444,020
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 11,437,344
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Singulation and bonding methods and structures formed thereby
- Patent number 11,355,475
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,063,008
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having backside interconnect structure on thro...
- Patent number 11,056,419
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation and bonding methods and structures formed thereby
- Patent number 11,037,904
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile of through via protrusion in 3DIC interconnect
- Patent number 11,004,741
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die structure, die stack structure and method of fabricating the same
- Patent number 10,867,943
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and method of fabricating the same
- Patent number 10,867,963
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming same
- Patent number 10,811,374
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiao Yun Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor component having through-silicon vias
- Patent number 10,784,162
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via structure and method
- Patent number 10,714,423
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY
- Publication number 20240395775
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Component Electrode Connection
- Publication number 20240387263
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379374
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV STRUCTURE AND METHOD FORMING SAME
- Publication number 20240363411
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...
- Publication number 20240274461
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA FOR SEMICONDUCTOR DEVICE CONNECTION
- Publication number 20240250020
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD
- Publication number 20240250061
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Sigulating Semiconductor Devices and Package Device Incl...
- Publication number 20240222292
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE D...
- Publication number 20240178015
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF
- Publication number 20240136199
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411326
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Backside Interconnect Structure on Thr...
- Publication number 20230386976
- Publication date Nov 30, 2023
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230375783
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kuang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230317648
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260940
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230197464
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND SEM...
- Publication number 20230063851
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230069214
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230035735
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kuang Liao
- G02 - OPTICS
Information Patent Application
Wafer Bonding Method
- Publication number 20220367407
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Via for Component Electrode Connection
- Publication number 20220359284
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via for Semiconductor Device Connection and Methods of Forming the...
- Publication number 20220359377
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Structure and Method Forming Same
- Publication number 20220359292
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Singulation and Bonding Methods and Structures Formed Thereby
- Publication number 20220310565
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH NANOSTRUCTURES ALIGNED WITH GRATING COUPL...
- Publication number 20220308284
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Kuang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV Structure and Method Forming Same
- Publication number 20220093461
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device Having Backside Interconnect...
- Publication number 20210335694
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210327836
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Bonding Method
- Publication number 20210305200
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210082846
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Tsang-Jiuh Wu

Person

Patents Grantslast 30 patents

Singulation and bonding methods and structures formed thereby

Semiconductor structure and manufacturing method thereof

Via for component electrode connection

TSV structure and method forming same

Wafer bonding method

Wafer bonding method

Via for semiconductor device connection and methods of forming the...

Semiconductor device and method for manufacturing the same, and sem...

Semiconductor structure with through substrate vias and manufacturi...

Method of forming semiconductor device having backside interconnect...

Semiconductor device and manufacturing method thereof

Through via structure and method

Interconnect structure and method of forming same

Semiconductor structure and manufacturing method thereof

Semiconductor component having through-silicon vias

TSV structure and method forming same

Semiconductor device with nanostructures aligned with grating coupl...

Via for coupling attached component upper electrode to substrate

Via for semiconductor device connection and methods of forming the...

Wafer bonding method

Singulation and bonding methods and structures formed thereby

Semiconductor structure and manufacturing method thereof

Semiconductor device having backside interconnect structure on thro...

Singulation and bonding methods and structures formed thereby

Profile of through via protrusion in 3DIC interconnect

Die structure, die stack structure and method of fabricating the same

Die stack structure and method of fabricating the same

Interconnect structure and method of forming same

Method of making a semiconductor component having through-silicon vias

Through via structure and method

Patents Applicationslast 30 patents

SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY

Via for Component Electrode Connection

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

TSV STRUCTURE AND METHOD FORMING SAME

BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...

VIA FOR SEMICONDUCTOR DEVICE CONNECTION

WAFER BONDING METHOD

Method for Sigulating Semiconductor Devices and Package Device Incl...

MANUFACTURING METHOD OF THE SEMICONDUCTOR PACKAGE, PICK AND PLACE D...

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Having Backside Interconnect Structure on Thr...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor Devices and Methods of Manufacture

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND SEM...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Wafer Bonding Method

Via for Component Electrode Connection

Via for Semiconductor Device Connection and Methods of Forming the...

TSV Structure and Method Forming Same

Singulation and Bonding Methods and Structures Formed Thereby

SEMICONDUCTOR DEVICE WITH NANOSTRUCTURES ALIGNED WITH GRATING COUPL...

TSV Structure and Method Forming Same

Method of Forming Semiconductor Device Having Backside Interconnect...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Wafer Bonding Method

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF