Tse Min Chu

Person

Taoyuan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wide range power mechanism for over-speed memory design
- Patent number 11,755,094
- Issue date Sep 12, 2023
- Dell Products L.P.
- Chunge-Wei Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Managing a dynamic total power level for an information handling sy...
- Patent number 11,669,143
- Issue date Jun 6, 2023
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wide range power mechanism for over-speed memory design
- Patent number 11,320,885
- Issue date May 3, 2022
- Dell Products L.P.
- Chunge-Wei Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for thermal management using different customi...
- Patent number 11,188,130
- Issue date Nov 30, 2021
- Dell Products L.P.
- Johnny Tc Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for controlling a dynamic voltage regulator slew...
- Patent number 11,137,782
- Issue date Oct 5, 2021
- Dell Products L.P.
- Johnny Tc Huang
- G05 - CONTROLLING REGULATING
Information Patent Grant
Electronic device having a deformation sensor on a fan module of a...
- Patent number 10,936,028
- Issue date Mar 2, 2021
- Compal Electronics, Inc.
- Chih-Chin Chien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fin stack for processor cooling
- Patent number 10,859,326
- Issue date Dec 8, 2020
- Dell Products L.P.
- Ting-Chiang Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Chip package structure with ENIG plating
- Patent number 8,937,386
- Issue date Jan 20, 2015
- AFlash Technology Co., Ltd
- Tse-Ming Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit card
- Patent number 8,416,576
- Issue date Apr 9, 2013
- Aflash Technology Co., Ltd.
- Tse Min Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-dissipating module
- Patent number 8,305,758
- Issue date Nov 6, 2012
- Compal Electronics, Inc.
- Tse-An Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-bump structure
- Patent number 8,299,629
- Issue date Oct 30, 2012
- Aflash Technology Co., Ltd.
- Kuei-Wu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making an aperture in a carrier and electrically connect...
- Patent number 8,129,274
- Issue date Mar 6, 2012
- Aflash Technology Co., Ltd.
- Tse Min Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR AN EMBEDDED CONTROLLER (EC) USED TO IDENTI...
- Publication number 20250004511
- Publication date Jan 2, 2025
- DELL PRODUCTS, L.P.
- Shao-Ku Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANAGING A DYNAMIC TOTAL POWER LEVEL FOR AN INFORMATION HANDLING SY...
- Publication number 20230126809
- Publication date Apr 27, 2023
- Dell Products L.P.
- Qinghong He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIDE RANGE POWER MECHANISM FOR OVER-SPEED MEMORY DESIGN
- Publication number 20220253123
- Publication date Aug 11, 2022
- Dell Products L.P.
- Chunge-Wei Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIDE RANGE POWER MECHANISM FOR OVER-SPEED MEMORY DESIGN
- Publication number 20210373642
- Publication date Dec 2, 2021
- Dell Products L.P.
- Chunge-Wei Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR CONTROLLING A DYNAMIC VOLTAGE REGULATOR SLEW...
- Publication number 20210149425
- Publication date May 20, 2021
- DELL PRODUCTS, L.P.
- Johnny Tc Huang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD AND APPARATUS FOR THERMAL MANAGEMENT USING DIFFERENT CUSTOMI...
- Publication number 20210149464
- Publication date May 20, 2021
- DELL PRODUCTS, L.P.
- Johnny Tc Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIN STACK FOR PROCESSOR COOLING
- Publication number 20200217598
- Publication date Jul 9, 2020
- Dell Products L.P.
- Ting-Chiang Huang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE
- Publication number 20190059177
- Publication date Feb 21, 2019
- Compal Electronics, Inc.
- Tse-An Chu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR CONTROLLING FAN OPERATION
- Publication number 20180228050
- Publication date Aug 9, 2018
- Compal Electronics, Inc.
- Chih-Chin Chien
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION STRUCTURE
- Publication number 20170034901
- Publication date Feb 2, 2017
- Compal Electronics, Inc.
- Jia-Yu Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION STRUCTURE
- Publication number 20140076529
- Publication date Mar 20, 2014
- Compal Electronics, Inc.
- Jia-Yu Hung
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20120196438
- Publication date Aug 2, 2012
- Tse-Ming CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Packaged with Die through Surface Mount Technology
- Publication number 20120074558
- Publication date Mar 29, 2012
- MAO BANG ELECTRONIC CO., LTD.
- Hsuan Yu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Chip Having Penetrative Connection Holes
- Publication number 20110291291
- Publication date Dec 1, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Tung-Sheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Bump Structure
- Publication number 20110260300
- Publication date Oct 27, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Kuei-Wu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Card
- Publication number 20110228487
- Publication date Sep 22, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Tse Min Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image-Processing Integrated Circuit
- Publication number 20110176021
- Publication date Jul 21, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Tse Ming Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making an Aperture in a Carrier and Electrically Connect...
- Publication number 20110143536
- Publication date Jun 16, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Tse Ming Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Package
- Publication number 20110057318
- Publication date Mar 10, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Sung Chuan MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING MODULE
- Publication number 20110043998
- Publication date Feb 24, 2011
- Compal Electronics, Inc.
- Tse-An Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuit Device
- Publication number 20110031635
- Publication date Feb 10, 2011
- MAO BANG ELECTRONIC CO., LTD.
- Tse Ming Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit connecting structure having flexible layout
- Publication number 20100244200
- Publication date Sep 30, 2010
- Chu, Tse Ming
- Tse Ming Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20100133686
- Publication date Jun 3, 2010
- Tse-Ming CHU
- H01 - BASIC ELECTRIC ELEMENTS

Tse Min Chu

Person

Patents Grantslast 30 patents

Wide range power mechanism for over-speed memory design

Managing a dynamic total power level for an information handling sy...

Wide range power mechanism for over-speed memory design

Method and apparatus for thermal management using different customi...

System and method for controlling a dynamic voltage regulator slew...

Electronic device having a deformation sensor on a fan module of a...

Fin stack for processor cooling

Chip package structure with ENIG plating

Integrated circuit card

Heat-dissipating module

Wafer-bump structure

Method for making an aperture in a carrier and electrically connect...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR AN EMBEDDED CONTROLLER (EC) USED TO IDENTI...

MANAGING A DYNAMIC TOTAL POWER LEVEL FOR AN INFORMATION HANDLING SY...

WIDE RANGE POWER MECHANISM FOR OVER-SPEED MEMORY DESIGN

WIDE RANGE POWER MECHANISM FOR OVER-SPEED MEMORY DESIGN

SYSTEM AND METHOD FOR CONTROLLING A DYNAMIC VOLTAGE REGULATOR SLEW...

METHOD AND APPARATUS FOR THERMAL MANAGEMENT USING DIFFERENT CUSTOMI...

FIN STACK FOR PROCESSOR COOLING

HEAT DISSIPATION MODULE AND ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD FOR CONTROLLING FAN OPERATION

HEAT DISSIPATION STRUCTURE

HEAT DISSIPATION STRUCTURE

CHIP PACKAGE STRUCTURE

Circuit Board Packaged with Die through Surface Mount Technology

Silicon Chip Having Penetrative Connection Holes

Wafer-Bump Structure

Integrated Circuit Card

Image-Processing Integrated Circuit

Method for Making an Aperture in a Carrier and Electrically Connect...

Die Package

HEAT-DISSIPATING MODULE

Stacked Integrated Circuit Device

Integrated circuit connecting structure having flexible layout

CHIP PACKAGE STRUCTURE