Tu Anh Tran

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices with stepped bond pads
- Patent number 9,780,051
- Issue date Oct 3, 2017
- NXP USA, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad having a trench and method for forming
- Patent number 9,515,034
- Issue date Dec 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sohrab Safai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum clad copper structure of an electronic component package a...
- Patent number 9,437,459
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for forming same
- Patent number 9,437,574
- Issue date Sep 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Coated bonding wire and methods for bonding using same
- Patent number 9,368,470
- Issue date Jun 14, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with voltage distributor
- Patent number 9,331,046
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for reducing corrosion in wire bonds
- Patent number 9,324,675
- Issue date Apr 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond interface structure and formation
- Patent number 9,257,403
- Issue date Feb 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad and passivation layer having a gap and method for forming
- Patent number 9,111,755
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with voltage distributor
- Patent number 8,791,582
- Issue date Jul 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded electronic component
- Patent number 8,556,159
- Issue date Oct 15, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power lead-on-chip ball grid array package
- Patent number 8,129,226
- Issue date Mar 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- James P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having pads and input/output (I/O) cells
- Patent number 7,808,117
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die edge reconditioning
- Patent number 7,374,971
- Issue date May 20, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bond pad and method therefor
- Patent number 7,271,013
- Issue date Sep 18, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Lois E. Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having wire bonds and method therefor
- Patent number 7,015,585
- Issue date Mar 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive device including bond wires
- Patent number 6,998,952
- Issue date Feb 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with test pad structure and method of testing
- Patent number 6,937,047
- Issue date Aug 30, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having a bond pad and method therefor
- Patent number 6,921,979
- Issue date Jul 26, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bond pad and method therefor
- Patent number 6,844,631
- Issue date Jan 18, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Lois E. Yong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COATED BONDING WIRE AND METHODS FOR BONDING USING SAME
- Publication number 20160126208
- Publication date May 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH FOR WIREBONDING
- Publication number 20150380376
- Publication date Dec 31, 2015
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE
- Publication number 20150318240
- Publication date Nov 5, 2015
- FREESCALE SEMICONDUCTOR, INC.
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS
- Publication number 20150311173
- Publication date Oct 29, 2015
- BURTON J. CARPENTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES
- Publication number 20150303169
- Publication date Oct 22, 2015
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD HAVING A TRENCH AND METHOD FOR FORMING
- Publication number 20150194396
- Publication date Jul 9, 2015
- Sohrab Safai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD HAVING A TRENCH AND METHOD FOR FORMING
- Publication number 20150194395
- Publication date Jul 9, 2015
- Sohrab Safai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH STEPPED BOND PADS
- Publication number 20150171035
- Publication date Jun 18, 2015
- TU-ANH N. TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Interface Structure and Formation
- Publication number 20150145148
- Publication date May 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR FORMING SAME
- Publication number 20150090480
- Publication date Apr 2, 2015
- TU-ANH N. TRAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR
- Publication number 20140308779
- Publication date Oct 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Chu-Chung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ELECTRONIC COMPONENT
- Publication number 20130221076
- Publication date Aug 29, 2013
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR
- Publication number 20120025401
- Publication date Feb 2, 2012
- CHU-CHUNG LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Lead-on-Chip Ball Grid Array Package
- Publication number 20100270663
- Publication date Oct 28, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
- Publication number 20070267755
- Publication date Nov 22, 2007
- Nhat D. Vo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
- Publication number 20070267748
- Publication date Nov 22, 2007
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die having a protective periphery region and method f...
- Publication number 20070087067
- Publication date Apr 19, 2007
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die edge reconditioning
- Publication number 20060237850
- Publication date Oct 26, 2006
- Yuan Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive device including bond wires
- Publication number 20050122198
- Publication date Jun 9, 2005
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a bond pad and method therefor
- Publication number 20050098903
- Publication date May 12, 2005
- Loise E. Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with test pad structure and method of testing
- Publication number 20050030055
- Publication date Feb 10, 2005
- Tu-Anh Tran
- G01 - MEASURING TESTING
Information Patent Application
Packaged integrated circuit having wire bonds and method therefor
- Publication number 20040119168
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a bond pad and method therefor
- Publication number 20030173667
- Publication date Sep 18, 2003
- Lois E. Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a bond pad and method therefor
- Publication number 20030173668
- Publication date Sep 18, 2003
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS

Tu Anh Tran

Person

Patents Grantslast 30 patents

Surface finish for wirebonding

Methods for forming semiconductor devices with stepped bond pads

Bond pad having a trench and method for forming

Aluminum clad copper structure of an electronic component package a...

Electronic component package and method for forming same

Coated bonding wire and methods for bonding using same

Integrated circuit package with voltage distributor

Structures for reducing corrosion in wire bonds

Copper ball bond interface structure and formation

Bond pad and passivation layer having a gap and method for forming

Integrated circuit package with voltage distributor

Embedded electronic component

Power lead-on-chip ball grid array package

Integrated circuit having pads and input/output (I/O) cells

Semiconductor die edge reconditioning

Semiconductor device having a bond pad and method therefor

Packaged integrated circuit having wire bonds and method therefor

Inductive device including bond wires

Integrated circuit with test pad structure and method of testing

Semiconductor device having a bond pad and method therefor

Semiconductor device having a bond pad and method therefor

Patents Applicationslast 30 patents

COATED BONDING WIRE AND METHODS FOR BONDING USING SAME

SURFACE FINISH FOR WIREBONDING

ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE

STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS

SYSTEMS AND METHODS FOR MULTIPLE BALL BOND STRUCTURES

BOND PAD HAVING A TRENCH AND METHOD FOR FORMING

BOND PAD HAVING A TRENCH AND METHOD FOR FORMING

METHODS FOR FORMING SEMICONDUCTOR DEVICES WITH STEPPED BOND PADS

Copper Ball Bond Interface Structure and Formation

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR FORMING SAME

TIN-BASED WIREBOND STRUCTURES

INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR

EMBEDDED ELECTRONIC COMPONENT

INTEGRATED CIRCUIT PACKAGE WITH VOLTAGE DISTRIBUTOR

Power Lead-on-Chip Ball Grid Array Package

INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS

INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS

Semiconductor die having a protective periphery region and method f...

Semiconductor die edge reconditioning

Inductive device including bond wires

Semiconductor device having a bond pad and method therefor

Integrated circuit with test pad structure and method of testing

Packaged integrated circuit having wire bonds and method therefor

Semiconductor device having a bond pad and method therefor

Semiconductor device having a bond pad and method therefor