Tung-Chuan Wang

Person

Yangmei Town, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level package with good CTE performance
- Patent number 7,655,501
- Issue date Feb 2, 2010
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having multi-chips with side-by-side c...
- Patent number 7,525,185
- Issue date Apr 28, 2009
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module having build-in package cavity and the method o...
- Patent number 7,498,556
- Issue date Mar 3, 2009
- Adavanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor image device package with die receiving through-hole...
- Patent number 7,459,729
- Issue date Dec 2, 2008
- Advanced Chip Engineering Technology, Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer level image sensor package with die receiving cavity and meth...
- Publication number 20080274579
- Publication date Nov 6, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR IMAGE DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE...
- Publication number 20080261346
- Publication date Oct 23, 2008
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE
- Publication number 20080248614
- Publication date Oct 9, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device package having multi-chips with side-by-side c...
- Publication number 20080230884
- Publication date Sep 25, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module having build-in package cavity and the method o...
- Publication number 20080224248
- Publication date Sep 18, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer level image sensor package with die receiving cavity and meth...
- Publication number 20080197435
- Publication date Aug 21, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CO...
- Publication number 20080197478
- Publication date Aug 21, 2008
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package with die receiving opening and method of the same
- Publication number 20080191333
- Publication date Aug 14, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module and the method of the same
- Publication number 20080173792
- Publication date Jul 24, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor image device package with die receiving through-hole...
- Publication number 20080157312
- Publication date Jul 3, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE
- Publication number 20080142946
- Publication date Jun 19, 2008
- Advanced Chip Engineering Technology Inc.
- Wen-Kun Yang
- H01 - BASIC ELECTRIC ELEMENTS

Tung-Chuan Wang

Person

Patents Grantslast 30 patents

Wafer level package with good CTE performance

Semiconductor device package having multi-chips with side-by-side c...

Image sensor module having build-in package cavity and the method o...

Semiconductor image device package with die receiving through-hole...

Patents Applicationslast 30 patents

Wafer level image sensor package with die receiving cavity and meth...

SEMICONDUCTOR IMAGE DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE...

WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE

Semiconductor device package having multi-chips with side-by-side c...

Image sensor module having build-in package cavity and the method o...

Wafer level image sensor package with die receiving cavity and meth...

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CO...

Image sensor package with die receiving opening and method of the same

Image sensor module and the method of the same

Semiconductor image device package with die receiving through-hole...

WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE