TYLER JAMES SHERWOOD

Person

Fonda, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method of bi-layer pixel isolation in advanced LCOS b...
- Patent number 12,055,821
- Issue date Aug 6, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for copper dishing control
- Patent number 12,033,964
- Issue date Jul 9, 2024
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of CMP integration for improved optical uniformity in advanc...
- Patent number 11,908,678
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of mirror grounding in LCoS devices
- Patent number 11,880,052
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of advanced LCoS back-plane having highly refl...
- Patent number 11,881,539
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge protection on semiconductor substrates
- Patent number 11,830,824
- Issue date Nov 28, 2023
- Applied Materials, Inc.
- Amirhasan Nourbakhsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device structures and methods of making
- Patent number 11,769,665
- Issue date Sep 26, 2023
- Applied Materials, Inc.
- Amirhasan Nourbakhsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graded doping in power devices
- Patent number 11,705,490
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Ashish Pal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming doped silicide power devices
- Patent number 11,605,741
- Issue date Mar 14, 2023
- Applied Materials, Inc.
- Joshua S. Holt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of advanced LCoS back-plane having robust pixe...
- Patent number 11,586,067
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Lan Yu
- G02 - OPTICS
Information Patent Grant
Method for LCoS DBR multilayer stack protection via sacrificial har...
- Patent number 11,573,452
- Issue date Feb 7, 2023
- Applied Materials, Inc.
- Lan Yu
- G02 - OPTICS
Information Patent Grant
Deep trench integration processes and devices
- Patent number 11,456,171
- Issue date Sep 27, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench integration processes and devices
- Patent number 11,410,873
- Issue date Aug 9, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION
- Publication number 20240321636
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SUPER JUNCTION STRUCTURES FOR INCREASED VOLTAGE
- Publication number 20240282809
- Publication date Aug 22, 2024
- Applied Materials, Inc.
- Amirhasan NOURBAKHSH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELAXATION TRENCHES FOR GALLIUM NITRIDE MICROLED LAYERS ON S...
- Publication number 20230369532
- Publication date Nov 16, 2023
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE STRUCTURES AND METHODS OF MAKING
- Publication number 20230223256
- Publication date Jul 13, 2023
- Applied Materials, Inc.
- Amirhasan Nourbakhsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL
- Publication number 20230066610
- Publication date Mar 2, 2023
- Applied Materials, Inc.
- Tyler Sherwood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE PROTECTION ON SEMICONDUCTOR SUBSTRATES
- Publication number 20220310531
- Publication date Sep 29, 2022
- Applied Materials, Inc.
- Amirhasan Nourbakhsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADED DOPING IN POWER DEVICES
- Publication number 20220254886
- Publication date Aug 11, 2022
- Applied Materials, Inc.
- Ashish Pal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CMP INTEGRATION FOR IMPROVED OPTICAL UNIFORMITY IN ADVANC...
- Publication number 20220223402
- Publication date Jul 14, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF ADVANCED LCOS BACK-PLANE HAVING HIGHLY REFL...
- Publication number 20220165912
- Publication date May 26, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF MIRROR GROUNDING IN LCOS DEVICES
- Publication number 20220163707
- Publication date May 26, 2022
- Applied Materials, Inc.
- Lan Yu
- G02 - OPTICS
Information Patent Application
STRUCTURE AND METHOD OF BI-LAYER PIXEL ISOLATION IN ADVANCED LCOS B...
- Publication number 20220163834
- Publication date May 26, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF ADVANCED LCOS BACK-PLANE HAVING ROBUST PIXE...
- Publication number 20220163845
- Publication date May 26, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING DOPED SILICIDE POWER DEVICES
- Publication number 20220165574
- Publication date May 26, 2022
- Applied Materials, Inc.
- Joshua S. Holt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH INTEGRATION PROCESSES AND DEVICES
- Publication number 20220165610
- Publication date May 26, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LCOS DBR MULTILAYER STACK PROTECTION VIA SACRIFICIAL HAR...
- Publication number 20220163846
- Publication date May 26, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH INTEGRATION PROCESSES AND DEVICES
- Publication number 20220165564
- Publication date May 26, 2022
- Applied Materials, Inc.
- Lan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN STRUCTURES OF FINFET DEVICES
- Publication number 20210091222
- Publication date Mar 25, 2021
- GLOBALFOUNDRIES U.S. Inc.
- TAO CHU
- H01 - BASIC ELECTRIC ELEMENTS

TYLER JAMES SHERWOOD

Person

Patents Grantslast 30 patents

Structure and method of bi-layer pixel isolation in advanced LCOS b...

Chemical mechanical polishing for copper dishing control

Method of CMP integration for improved optical uniformity in advanc...

Structure and method of mirror grounding in LCoS devices

Structure and method of advanced LCoS back-plane having highly refl...

Edge protection on semiconductor substrates

Power device structures and methods of making

Graded doping in power devices

Methods of forming doped silicide power devices

Structure and method of advanced LCoS back-plane having robust pixe...

Method for LCoS DBR multilayer stack protection via sacrificial har...

Deep trench integration processes and devices

Deep trench integration processes and devices

Patents Applicationslast 30 patents

METHOD TO IMPROVE INTERCONNECT COEFFICIENT OF THERMAL EXPANSION

SILICON SUPER JUNCTION STRUCTURES FOR INCREASED VOLTAGE

STRESS RELAXATION TRENCHES FOR GALLIUM NITRIDE MICROLED LAYERS ON S...

POWER DEVICE STRUCTURES AND METHODS OF MAKING

CHEMICAL MECHANICAL POLISHING FOR COPPER DISHING CONTROL

EDGE PROTECTION ON SEMICONDUCTOR SUBSTRATES

GRADED DOPING IN POWER DEVICES

METHOD OF CMP INTEGRATION FOR IMPROVED OPTICAL UNIFORMITY IN ADVANC...

STRUCTURE AND METHOD OF ADVANCED LCOS BACK-PLANE HAVING HIGHLY REFL...

STRUCTURE AND METHOD OF MIRROR GROUNDING IN LCOS DEVICES

STRUCTURE AND METHOD OF BI-LAYER PIXEL ISOLATION IN ADVANCED LCOS B...

STRUCTURE AND METHOD OF ADVANCED LCOS BACK-PLANE HAVING ROBUST PIXE...

METHODS OF FORMING DOPED SILICIDE POWER DEVICES

DEEP TRENCH INTEGRATION PROCESSES AND DEVICES

METHOD FOR LCOS DBR MULTILAYER STACK PROTECTION VIA SACRIFICIAL HAR...

DEEP TRENCH INTEGRATION PROCESSES AND DEVICES

FIN STRUCTURES OF FINFET DEVICES