Tzu-Fang Huang

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to increase tensile stress of silicon nitride films using a...
- Patent number 8,753,989
- Issue date Jun 17, 2014
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to increase tensile stress of silicon nitride films using a...
- Patent number 8,129,290
- Issue date Mar 6, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxide-like seasoning for dielectric low k films
- Patent number 7,700,486
- Issue date Apr 20, 2010
- Applied Materials, Inc.
- Sohyun Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi step ebeam process for modifying dielectric materials
- Patent number 7,588,803
- Issue date Sep 15, 2009
- Applied Materials, Inc.
- Alexandros T. Demos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion improvement for low k dielectrics
- Patent number 7,459,404
- Issue date Dec 2, 2008
- Applied Materials, Inc.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a low-K dual damascene interconnect structure
- Patent number 7,435,685
- Issue date Oct 14, 2008
- Applied Materials, Inc.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing low k films
- Patent number 7,160,821
- Issue date Jan 9, 2007
- Applied Materials, Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a low-K dual damascene interconnect structure
- Patent number 7,132,369
- Issue date Nov 7, 2006
- Applied Materials, Inc.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide-like seasoning for dielectric low k films
- Patent number 7,115,508
- Issue date Oct 3, 2006
- Applied Materials, Inc.
- Sohyun Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving stability in low k barrier layers
- Patent number 7,049,249
- Issue date May 23, 2006
- Applied Materials
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion improvement for low k dielectrics
- Patent number 7,030,041
- Issue date Apr 18, 2006
- Applied Materials Inc.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal bond pad for integrated circuits allowing improved probing ab...
- Patent number 6,952,053
- Issue date Oct 4, 2005
- Broadcom Corporation
- Tzu Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hardness improvement of silicon carboxy films
- Patent number 6,936,309
- Issue date Aug 30, 2005
- Applied Materials, Inc.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for curing low dielectric constant film using direct current...
- Patent number 6,914,014
- Issue date Jul 5, 2005
- Applied Materials, Inc.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of reducing plasma-induced damage for advanced plasma CVD d...
- Patent number 6,911,403
- Issue date Jun 28, 2005
- Applied Materials, Inc.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of cyclic siloxanes for hardness improvement of low k dielectri...
- Patent number 6,815,373
- Issue date Nov 9, 2004
- Applied Materials Inc.
- Vinita Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low K films
- Patent number 6,806,207
- Issue date Oct 19, 2004
- Applied Materials Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving stability in low k barrier layers
- Patent number 6,790,788
- Issue date Sep 14, 2004
- Applied Materials Inc.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a low k dielectric film (K>3.5) for h...
- Patent number 6,699,784
- Issue date Mar 2, 2004
- Applied Materials Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low dielectric constant carbon doped silicon o...
- Patent number 6,632,735
- Issue date Oct 14, 2003
- Applied Materials, Inc.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low k films using an oxidizing plasma
- Patent number 6,593,247
- Issue date Jul 15, 2003
- Applied Materials, Inc.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE
- Publication number 20240170311
- Publication date May 23, 2024
- Ralph P. ANTONIO
- G01 - MEASURING TESTING
Information Patent Application
METHOD TO INCREASE TENSILE STRESS OF SILICON NITRIDE FILMS USING A...
- Publication number 20120196452
- Publication date Aug 2, 2012
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integrated circuit having a thin passivation layer that facilitates...
- Publication number 20080308901
- Publication date Dec 18, 2008
- BROADCOM CORPORATION
- Tzu-Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A LOW-K DUAL DAMASCENE INTERCONNECT STRUCTURE
- Publication number 20080145998
- Publication date Jun 19, 2008
- Applied Materials, Inc.
- GERARDO A. DELGADINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to increase tensile stress of silicon nitride films using a...
- Publication number 20060269693
- Publication date Nov 30, 2006
- Applied Materials, Inc.
- Mihaela Balseanu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
OXIDE-LIKE SEASONING FOR DIELECTRIC LOW K FILMS
- Publication number 20060219175
- Publication date Oct 5, 2006
- Sohyun Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesion improvement for low k dielectrics
- Publication number 20060189162
- Publication date Aug 24, 2006
- APPLIED MATERIALS, INC.
- Lihua Li Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi step ebeam process for modifying dielectric materials
- Publication number 20060171653
- Publication date Aug 3, 2006
- Applied Materials, Inc.
- Alexandros T. Demos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal bond pad for integrated circuits allowing improved probing ab...
- Publication number 20060022225
- Publication date Feb 2, 2006
- BROADCOM CORPORATION
- Tzu Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing low k films
- Publication number 20050260864
- Publication date Nov 24, 2005
- APPLIED MATERIALS, INC.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oxide-like seasoning for dielectric low k films
- Publication number 20050227499
- Publication date Oct 13, 2005
- APPLIED MATERIALS, INC.
- Sohyun Park
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Adhesion improvement for low k dielectrics
- Publication number 20050202685
- Publication date Sep 15, 2005
- APPLIED MATERIALS, INC.
- Lihua Li Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of improving stability in low k barrier layers
- Publication number 20050042858
- Publication date Feb 24, 2005
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of reducing plasma-induced damage for advanced plasma CVD d...
- Publication number 20050042885
- Publication date Feb 24, 2005
- APPLIED MATERIALS, INC.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Use of cyclic siloxanes for hardness improvement
- Publication number 20040234688
- Publication date Nov 25, 2004
- Vinita Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of forming a low-K dual damascene interconnect structure
- Publication number 20040157453
- Publication date Aug 12, 2004
- APPLIED MATERIALS, INC.
- Gerardo A. Delgadino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus to improve cracking thresholds and mechanical...
- Publication number 20040137757
- Publication date Jul 15, 2004
- APPLIED MATERIALS, INC.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF IMPROVING STABILITY IN LOW K BARRIER LAYERS
- Publication number 20040137756
- Publication date Jul 15, 2004
- APPLIED MATERIALS, INC.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR CURING LOW DIELECTRIC CONSTANT FILM USING DIRECT CURRENT...
- Publication number 20040137758
- Publication date Jul 15, 2004
- Applied Materials,Inc
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for curing low dielectric constant film by electron beam
- Publication number 20040101632
- Publication date May 27, 2004
- APPLIED MATERIALS, INC.
- Wen H. Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal bond pad for integrated circuits allowing improved probing ab...
- Publication number 20040084693
- Publication date May 6, 2004
- Broadcom Corporation
- Tzu Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reacting an organosilicon compound with an oxidizing gas to form an...
- Publication number 20030211244
- Publication date Nov 13, 2003
- APPLIED MATERIALS, INC.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Use of cyclic siloxanes for hardness improvement
- Publication number 20030194880
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- Vinita Singh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Crosslink cyclo-siloxane compound with linear bridging group to for...
- Publication number 20030194495
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Hardness improvement of silicon carboxy films
- Publication number 20030186000
- Publication date Oct 2, 2003
- APPLIED MATERIALS, INC.
- Lihua Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low K films
- Publication number 20030162410
- Publication date Aug 28, 2003
- APPLIED MATERIALS, INC.
- Tzu-Fang Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for depositing a low k dielectric film (k<3.5) for hard mask...
- Publication number 20030113995
- Publication date Jun 19, 2003
- APPLIED MATERIALS, INC.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and method for a production testline to monitor CMOS SRAMs
- Publication number 20030034489
- Publication date Feb 20, 2003
- Broadcom Corporation
- Surya Bhattacharya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing low dielectric constant carbon doped silicon o...
- Publication number 20030032305
- Publication date Feb 13, 2003
- APPLIED MATERIALS, INC.
- Wai-Fan Yau
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Tzu-Fang Huang

Person

Patents Grantslast 30 patents

Method to increase tensile stress of silicon nitride films using a...

Method to increase tensile stress of silicon nitride films using a...

Oxide-like seasoning for dielectric low k films

Multi step ebeam process for modifying dielectric materials

Adhesion improvement for low k dielectrics

Method of forming a low-K dual damascene interconnect structure

Method of depositing low k films

Method of forming a low-K dual damascene interconnect structure

Oxide-like seasoning for dielectric low k films

Method of improving stability in low k barrier layers

Adhesion improvement for low k dielectrics

Metal bond pad for integrated circuits allowing improved probing ab...

Hardness improvement of silicon carboxy films

Method for curing low dielectric constant film using direct current...

Methods of reducing plasma-induced damage for advanced plasma CVD d...

Use of cyclic siloxanes for hardness improvement of low k dielectri...

Method of depositing low K films

Method of improving stability in low k barrier layers

Method for depositing a low k dielectric film (K&#x0003E;3.5) for h...

Method of depositing low dielectric constant carbon doped silicon o...

Method of depositing low k films using an oxidizing plasma

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

METHOD TO INCREASE TENSILE STRESS OF SILICON NITRIDE FILMS USING A...

Integrated circuit having a thin passivation layer that facilitates...

METHOD OF FORMING A LOW-K DUAL DAMASCENE INTERCONNECT STRUCTURE

Method to increase tensile stress of silicon nitride films using a...

OXIDE-LIKE SEASONING FOR DIELECTRIC LOW K FILMS

Adhesion improvement for low k dielectrics

Multi step ebeam process for modifying dielectric materials

Metal bond pad for integrated circuits allowing improved probing ab...

Method of depositing low k films

Oxide-like seasoning for dielectric low k films

Adhesion improvement for low k dielectrics

Method of improving stability in low k barrier layers

Methods of reducing plasma-induced damage for advanced plasma CVD d...

Use of cyclic siloxanes for hardness improvement

Method of forming a low-K dual damascene interconnect structure

Method and apparatus to improve cracking thresholds and mechanical...

METHOD OF IMPROVING STABILITY IN LOW K BARRIER LAYERS

METHOD FOR CURING LOW DIELECTRIC CONSTANT FILM USING DIRECT CURRENT...

Method for curing low dielectric constant film by electron beam

Metal bond pad for integrated circuits allowing improved probing ab...

Reacting an organosilicon compound with an oxidizing gas to form an...

Use of cyclic siloxanes for hardness improvement

Crosslink cyclo-siloxane compound with linear bridging group to for...

Hardness improvement of silicon carboxy films

Method of depositing low K films

Method for depositing a low k dielectric film (k<3.5) for hard mask...

Apparatus and method for a production testline to monitor CMOS SRAMs

Method of depositing low dielectric constant carbon doped silicon o...

Method for depositing a low k dielectric film (K>3.5) for h...