Urmi Ray

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) package comprising electrostatic discharge...
- Patent number 9,853,446
- Issue date Dec 26, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Integrated device comprising flexible connector between integrated...
- Patent number 9,633,977
- Issue date Apr 25, 2017
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising stacked dies on redistribution layers
- Patent number 9,583,460
- Issue date Feb 28, 2017
- QUALCOMM Incorporated
- Urmi Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interposer with embedded active devices
- Patent number 9,510,454
- Issue date Nov 29, 2016
- QUALCOMM Incorporated
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Toroid inductor in redistribution layers (RDL) of an integrated device
- Patent number 9,209,131
- Issue date Dec 8, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with interposer pitch adapter
- Patent number 9,087,765
- Issue date Jul 21, 2015
- QUALCOMM Incorporated
- Dexter Tamio Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling semiconductor die warpage
- Patent number 8,710,629
- Issue date Apr 29, 2014
- QUALCOMM Incorporated
- Xue Bai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING ELECTROSTATIC DISCHARGE...
- Publication number 20170063079
- Publication date Mar 2, 2017
- QUALCOMM Incorporated
- Shiqun Gu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MECHANICAL HANDLING SUPPORT FOR THIN CORES USING PHOTO-PATTERNABLE...
- Publication number 20160315024
- Publication date Oct 27, 2016
- QUALCOMM Incorporated
- Kwan-yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF ELECTRONIC ELEMENTS ON THE BACKSIDE OF A SEMICONDUCT...
- Publication number 20160095221
- Publication date Mar 31, 2016
- QUALCOMM Incorporated
- Vidhya RAMACHANDRAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRESS SENSOR FOR A SEMICONDUCTOR DEVICE
- Publication number 20160049340
- Publication date Feb 18, 2016
- QUALCOMM Incorporated
- Vidhya Ramachandran
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED INTERPOSER WITH EMBEDDED ACTIVE DEVICES
- Publication number 20150250058
- Publication date Sep 3, 2015
- QUALCOMM Incorporated
- Vidhya RAMACHANDRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING STACKED DIES ON REDISTRIBUTION LAYERS
- Publication number 20150235988
- Publication date Aug 20, 2015
- QUALCOMM Incorporated
- Urmi Ray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOROID INDUCTOR IN REDISTRIBUTION LAYERS (RDL) OF AN INTEGRATED DEVICE
- Publication number 20150206837
- Publication date Jul 23, 2015
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH ELECTROSTATIC DISCHARGE PROTECTION
- Publication number 20150048497
- Publication date Feb 19, 2015
- QUALCOMM Incorporated
- Brian Matthew Henderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST INTERPOSER COMPRISING AN OXIDATION LAYER
- Publication number 20140306349
- Publication date Oct 16, 2014
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGE WITH INTERPOSER PITCH ADAPTER
- Publication number 20140264836
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Dexter Tamio Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA FABRICATION WITH ETCH STOP FILM
- Publication number 20110227230
- Publication date Sep 22, 2011
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Preparation of Die for Improved Bonding Strength
- Publication number 20110193211
- Publication date Aug 11, 2011
- QUALCOMM Incorporated
- Arvind Chandrasekaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods Providing Arrangements of Vias
- Publication number 20110193212
- Publication date Aug 11, 2011
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Controlling Semiconductor Die Warpage
- Publication number 20110147895
- Publication date Jun 23, 2011
- QUALCOMM Incorporated
- Xue Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Layer On Polymer Passivation For Integrated Circuit Packaging
- Publication number 20110012239
- Publication date Jan 20, 2011
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Balance Layer on Semiconductor Wafer Backside
- Publication number 20100314725
- Publication date Dec 16, 2010
- QUALCOMM Incorporated
- Shiqun Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Through Silicon Stack 3-D Die In A Package Substrate
- Publication number 20100155931
- Publication date Jun 24, 2010
- QUALCOMM Incorporated
- Urmi Ray
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit (IC) package comprising electrostatic discharge...

Integrated device comprising flexible connector between integrated...

Integrated device comprising stacked dies on redistribution layers

Integrated interposer with embedded active devices

Toroid inductor in redistribution layers (RDL) of an integrated device

System-in-package with interposer pitch adapter

Apparatus and method for controlling semiconductor die warpage

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) PACKAGE COMPRISING ELECTROSTATIC DISCHARGE...

MECHANICAL HANDLING SUPPORT FOR THIN CORES USING PHOTO-PATTERNABLE...

INTEGRATION OF ELECTRONIC ELEMENTS ON THE BACKSIDE OF A SEMICONDUCT...

STRESS SENSOR FOR A SEMICONDUCTOR DEVICE

INTEGRATED INTERPOSER WITH EMBEDDED ACTIVE DEVICES

INTEGRATED DEVICE COMPRISING STACKED DIES ON REDISTRIBUTION LAYERS

TOROID INDUCTOR IN REDISTRIBUTION LAYERS (RDL) OF AN INTEGRATED DEVICE

INTERPOSER WITH ELECTROSTATIC DISCHARGE PROTECTION

LOW COST INTERPOSER COMPRISING AN OXIDATION LAYER

SYSTEM-IN-PACKAGE WITH INTERPOSER PITCH ADAPTER

THROUGH-SILICON VIA FABRICATION WITH ETCH STOP FILM

Surface Preparation of Die for Improved Bonding Strength

Systems and Methods Providing Arrangements of Vias

Apparatus and Method for Controlling Semiconductor Die Warpage

Barrier Layer On Polymer Passivation For Integrated Circuit Packaging

Stress Balance Layer on Semiconductor Wafer Backside

Embedded Through Silicon Stack 3-D Die In A Package Substrate