Valery M. Dubin

Person

Portlan, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 10,249,588
- Issue date Apr 2, 2019
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer with gel-based biochips for electrochemical synthesis and ele...
- Patent number 10,035,147
- Issue date Jul 31, 2018
- Intel Corporation
- Valery M. Dubin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 9,543,261
- Issue date Jan 10, 2017
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having direct contact heat spreader and met...
- Patent number 9,508,675
- Issue date Nov 29, 2016
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making the light source structure in flexible substrate
- Patent number 9,391,054
- Issue date Jul 12, 2016
- Valery Dubin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus to fabricate polymer arrays on patterned wafer...
- Patent number 9,085,461
- Issue date Jul 21, 2015
- Intel Corporation
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Gel-based bio chip for electrochemical synthesis and electrical det...
- Patent number 8,940,143
- Issue date Jan 27, 2015
- Intel Corporation
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method, apparatus and system for providing light source structures...
- Patent number 8,933,473
- Issue date Jan 13, 2015
- Valery Dubin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for electroplating copper
- Patent number 8,911,609
- Issue date Dec 16, 2014
- Moses Lake Industries, Inc.
- Valery M. Dubin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 8,580,679
- Issue date Nov 12, 2013
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having direct contact heat spreader and met...
- Patent number 8,541,876
- Issue date Sep 24, 2013
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable gate electrode work function material for transistor applic...
- Patent number 8,319,287
- Issue date Nov 27, 2012
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to fabricate polymer arrays on patterned wafer...
- Patent number 8,278,121
- Issue date Oct 2, 2012
- Intel Corporation
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Forming a copper diffusion barrier
- Patent number 8,227,335
- Issue date Jul 24, 2012
- Intel Corporation
- Steven W. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to fabricate polymer arrays on patterned wafer...
- Patent number 8,053,774
- Issue date Nov 8, 2011
- Intel Corporation
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Nanotube growth and device formation
- Patent number 7,964,174
- Issue date Jun 21, 2011
- Intel Corporation
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Substrate holder and electroplating system
- Patent number 7,905,994
- Issue date Mar 15, 2011
- Moses Lake Industries, Inc.
- Valery M. Dubin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Packaging of integrated circuits with carbon nanotube arrays to enh...
- Patent number 7,847,394
- Issue date Dec 7, 2010
- Intel Corporation
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Forming self-aligned nano-electrodes
- Patent number 7,755,082
- Issue date Jul 13, 2010
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer memory with adhesion layer containing an immobilized metal
- Patent number 7,709,873
- Issue date May 4, 2010
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of integrated circuits with carbon nano-tube arrays to en...
- Patent number 7,704,791
- Issue date Apr 27, 2010
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable gate electrode work function material for transistor applic...
- Patent number 7,682,891
- Issue date Mar 23, 2010
- Intel Corporation
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite metal films and carbon nanotube fabrication
- Patent number 7,635,503
- Issue date Dec 22, 2009
- Intel Corporation
- Juan E. Dominguez
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method to assemble structures from nano-materials
- Patent number 7,633,080
- Issue date Dec 15, 2009
- Intel Corporation
- Valery M. Dubin
- G11 - INFORMATION STORAGE
Information Patent Grant
Conformal electroless deposition of barrier layer materials
- Patent number 7,629,252
- Issue date Dec 8, 2009
- Intel Corporation
- Kevin P. O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for an improved air gap interconnect structure
- Patent number 7,629,268
- Issue date Dec 8, 2009
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a carbon nanotube interconnect structures
- Patent number 7,625,817
- Issue date Dec 1, 2009
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating systems and methods
- Patent number 7,597,763
- Issue date Oct 6, 2009
- Intel Corporation
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for an improved air gap interconnect structure
- Patent number 7,586,196
- Issue date Sep 8, 2009
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20170084564
- Publication date Mar 23, 2017
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GEL-BASED BIO CHIP FOR ELECTROCHEMICAL SYNTHESIS AND ELECTRICAL DET...
- Publication number 20150231633
- Publication date Aug 20, 2015
- Intel Corporation
- Valery M. Dubin
- G01 - MEASURING TESTING
Information Patent Application
METHODS FOR ELECTROPLATING COPPER
- Publication number 20150096894
- Publication date Apr 9, 2015
- Moses Lake Industries, Inc.
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC PACKAGE HAVING DIRECT CONTACT HEAT SPREADER AND MET...
- Publication number 20130344659
- Publication date Dec 26, 2013
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO FABRICATE POLYMER ARRAYS ON PATTERNED WAFER...
- Publication number 20120225512
- Publication date Sep 6, 2012
- Valery M. Dubin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHODS FOR ELECTROPLATING COPPER
- Publication number 20120199491
- Publication date Aug 9, 2012
- MOSES LAKE INDUSTRIES
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS TO FABRICATE POLYMER ARRAYS ON PATTERNED WAFER...
- Publication number 20120070930
- Publication date Mar 22, 2012
- Intel Corporation
- Valery M. DuBin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20110084387
- Publication date Apr 14, 2011
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MEMORY AND METHOD OF ITS FABRICATION
- Publication number 20100195267
- Publication date Aug 5, 2010
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Application
TUNABLE GATE ELECTRODE WORK FUNCTION MATERIAL FOR TRANSISTOR APPLIC...
- Publication number 20100140717
- Publication date Jun 10, 2010
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE INTERCONNECT STRUCTURES
- Publication number 20100022083
- Publication date Jan 28, 2010
- Intel Corporation
- Florian Gstrein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO ASSEMBLE STRUCTURES FROM NANO-MATERIALS
- Publication number 20090278257
- Publication date Nov 12, 2009
- Valery M. Dubin
- G11 - INFORMATION STORAGE
Information Patent Application
Methods for electroplating copper
- Publication number 20090250352
- Publication date Oct 8, 2009
- eMat Technology, LLC
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods of fabricating a composite carbon nanotube thermal interfac...
- Publication number 20090224422
- Publication date Sep 10, 2009
- Valery M. Dubin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Methods of fabricating solar-cell structures and resulting solar-ce...
- Publication number 20090188553
- Publication date Jul 30, 2009
- eMat Technology, LLC
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Protection of seedlayer for electroplating
- Publication number 20090117733
- Publication date May 7, 2009
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate holder and electroplating system
- Publication number 20090090631
- Publication date Apr 9, 2009
- eMat Technology, LLC
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating aqueous solution and method of making and using same
- Publication number 20090038947
- Publication date Feb 12, 2009
- eMAT TECHNOLOGY, LLC.
- Valery M. Dubin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL SYNTHESIS AND ELECTRICAL DETECTION OF POLYMERS WITH...
- Publication number 20090000957
- Publication date Jan 1, 2009
- Valery M. Dubin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
NANOTUBE GROWTH AND DEVICE FORMATION
- Publication number 20080311400
- Publication date Dec 18, 2008
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper nucleation in interconnects having ruthenium layers
- Publication number 20080296768
- Publication date Dec 4, 2008
- Ramanan V. Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ALUMINUM DOPING OF COPPER INTERCONNECTS AND STRUCTURES FO...
- Publication number 20080241575
- Publication date Oct 2, 2008
- Adrein R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Designs and methods for conductive bumps
- Publication number 20080213996
- Publication date Sep 4, 2008
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tunable gate electrode work function material for transistor applic...
- Publication number 20080157212
- Publication date Jul 3, 2008
- Adrien R. Lavoie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming self-aligned nano-electrodes
- Publication number 20080116439
- Publication date May 22, 2008
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Application
MICROCIRCUIT FABRICATION AND INTERCONNECTION
- Publication number 20080119016
- Publication date May 22, 2008
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method of fabricating metal interconnects using a sacrificial layer...
- Publication number 20080113508
- Publication date May 15, 2008
- Rohan N. Akolkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for an improved air gap interconnect structure
- Publication number 20080044999
- Publication date Feb 21, 2008
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS

Valery M. Dubin

Person

Patents Grantslast 30 patents

Designs and methods for conductive bumps

Designs and methods for conductive bumps

Wafer with gel-based biochips for electrochemical synthesis and ele...

Designs and methods for conductive bumps

Microelectronic package having direct contact heat spreader and met...

Method of making the light source structure in flexible substrate

Method and apparatus to fabricate polymer arrays on patterned wafer...

Gel-based bio chip for electrochemical synthesis and electrical det...

Method, apparatus and system for providing light source structures...

Methods for electroplating copper

Designs and methods for conductive bumps

Microelectronic package having direct contact heat spreader and met...

Tunable gate electrode work function material for transistor applic...

Method and apparatus to fabricate polymer arrays on patterned wafer...

Forming a copper diffusion barrier

Method and apparatus to fabricate polymer arrays on patterned wafer...

Nanotube growth and device formation

Substrate holder and electroplating system

Packaging of integrated circuits with carbon nanotube arrays to enh...

Forming self-aligned nano-electrodes

Polymer memory with adhesion layer containing an immobilized metal

Packaging of integrated circuits with carbon nano-tube arrays to en...

Tunable gate electrode work function material for transistor applic...

Composite metal films and carbon nanotube fabrication

Method to assemble structures from nano-materials

Conformal electroless deposition of barrier layer materials

Method for an improved air gap interconnect structure

Method of fabricating a carbon nanotube interconnect structures

Electroless plating systems and methods

Apparatus for an improved air gap interconnect structure

Patents Applicationslast 30 patents

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

GEL-BASED BIO CHIP FOR ELECTROCHEMICAL SYNTHESIS AND ELECTRICAL DET...

METHODS FOR ELECTROPLATING COPPER

MICROELECTRONIC PACKAGE HAVING DIRECT CONTACT HEAT SPREADER AND MET...

METHOD AND APPARATUS TO FABRICATE POLYMER ARRAYS ON PATTERNED WAFER...

METHODS FOR ELECTROPLATING COPPER

METHOD AND APPARATUS TO FABRICATE POLYMER ARRAYS ON PATTERNED WAFER...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

POLYMER MEMORY AND METHOD OF ITS FABRICATION

TUNABLE GATE ELECTRODE WORK FUNCTION MATERIAL FOR TRANSISTOR APPLIC...

CARBON NANOTUBE INTERCONNECT STRUCTURES

METHOD TO ASSEMBLE STRUCTURES FROM NANO-MATERIALS

Methods for electroplating copper

Methods of fabricating a composite carbon nanotube thermal interfac...

Methods of fabricating solar-cell structures and resulting solar-ce...

Protection of seedlayer for electroplating

Substrate holder and electroplating system

Electroplating aqueous solution and method of making and using same

ELECTROCHEMICAL SYNTHESIS AND ELECTRICAL DETECTION OF POLYMERS WITH...

NANOTUBE GROWTH AND DEVICE FORMATION

Copper nucleation in interconnects having ruthenium layers

SELECTIVE ALUMINUM DOPING OF COPPER INTERCONNECTS AND STRUCTURES FO...

Designs and methods for conductive bumps

Tunable gate electrode work function material for transistor applic...

Forming self-aligned nano-electrodes

MICROCIRCUIT FABRICATION AND INTERCONNECTION

Method of fabricating metal interconnects using a sacrificial layer...

Method for an improved air gap interconnect structure