Varughese Mathew

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Surface finish for wirebonding
- Patent number 10,325,876
- Issue date Jun 18, 2019
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device attached to an exposed pad
- Patent number 10,217,713
- Issue date Feb 26, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with sacrificial anode and method for forming
- Patent number 10,199,339
- Issue date Feb 5, 2019
- NXP USA, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for semiconductor device packaging
- Patent number 10,147,697
- Issue date Dec 4, 2018
- NXP USA, INC.
- Rama I. Hegde
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method to minimize warpage of packaged semiconductor...
- Patent number 9,978,614
- Issue date May 22, 2018
- NXP USA, INC.
- Nishant Lakhera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with a lead frame and method for forming
- Patent number 9,640,466
- Issue date May 2, 2017
- NXP USA, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for stackable packaging
- Patent number 9,508,632
- Issue date Nov 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Navas Khan Oratti Kalandar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit carrier coating
- Patent number 9,431,313
- Issue date Aug 30, 2016
- Freescale Semiconductor, Inc.
- Varughese Mathew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for lead frame package degating
- Patent number 9,426,884
- Issue date Aug 23, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure with sacrificial anode and passivation laye...
- Patent number 9,412,709
- Issue date Aug 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant with corrosion inhibitor
- Patent number 9,117,756
- Issue date Aug 25, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 9,093,383
- Issue date Jul 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for treating a bond pad of a package substrate
- Patent number 9,012,263
- Issue date Apr 21, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold compound compatibility test system and methods thereof
- Patent number 8,955,388
- Issue date Feb 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- G01 - MEASURING TESTING
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 8,853,867
- Issue date Oct 7, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader for use within a packaged semiconductor device
- Patent number 8,836,110
- Issue date Sep 16, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulant for a semiconductor device
- Patent number 8,643,197
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
Information Patent Grant
Method to form a via
- Patent number 8,586,474
- Issue date Nov 19, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of improving adhesion of bond pad over pad metallization wit...
- Patent number 8,394,713
- Issue date Mar 12, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device including a bridgeable mate...
- Patent number 8,168,468
- Issue date May 1, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming interconnects for 3-D applications
- Patent number 8,003,517
- Issue date Aug 23, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a 3-D semiconductor die structure with an intermetallic for...
- Patent number 7,993,971
- Issue date Aug 9, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a via
- Patent number 7,932,175
- Issue date Apr 26, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micropad formation for a semiconductor
- Patent number 7,807,572
- Issue date Oct 5, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled electroless plating
- Patent number 7,717,060
- Issue date May 18, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Steven M. Hues
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Micropad for bonding and a method therefor
- Patent number 7,572,723
- Issue date Aug 11, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device having a diffusion barrier...
- Patent number 7,422,979
- Issue date Sep 9, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Lynne M. Michaelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning electroless process tank
- Patent number 7,410,544
- Issue date Aug 12, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Sam S. Garcia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Barrier for use in 3-D integration of circuits
- Patent number 7,378,339
- Issue date May 27, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive spacers in sidewall regions...
- Patent number 7,238,601
- Issue date Jul 3, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE WITH MOLD-EMBEDDED INDUCTOR AND METHOD OF FABRICATION THEREFOR
- Publication number 20240055415
- Publication date Feb 15, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD
- Publication number 20170098618
- Publication date Apr 6, 2017
- NXP USA, Inc.
- Sheila F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure With Sacrificial Anode and Method for Forming
- Publication number 20160329288
- Publication date Nov 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- SHEILA F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO MINIMIZE WARPAGE OF PACKAGED SEMICONDUCTOR...
- Publication number 20160307780
- Publication date Oct 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Nishant LAKHERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CARRIER COATING
- Publication number 20160247738
- Publication date Aug 25, 2016
- FREESCALE SEMICONDUCTOR, INC.
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD
- Publication number 20160071787
- Publication date Mar 10, 2016
- SHEILA F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD TO MINIMIZE WARPAGE OF PACKAGED SEMICONDUCTOR...
- Publication number 20160064299
- Publication date Mar 3, 2016
- NISHANT LAKHERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH FOR WIREBONDING
- Publication number 20150380376
- Publication date Dec 31, 2015
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE
- Publication number 20150118791
- Publication date Apr 30, 2015
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING
- Publication number 20150027767
- Publication date Jan 29, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED WIREBOND STRUCTURES
- Publication number 20140367859
- Publication date Dec 18, 2014
- Burton J. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING
- Publication number 20140346663
- Publication date Nov 27, 2014
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Bonding Semiconductor Devices
- Publication number 20140242777
- Publication date Aug 28, 2014
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULANT FOR A SEMICONDUCTOR DEVICE
- Publication number 20140145339
- Publication date May 29, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Sheila F. CHOPIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20140061894
- Publication date Mar 6, 2014
- Sheila F. Chopin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF
- Publication number 20130319129
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- G01 - MEASURING TESTING
Information Patent Application
ENCAPSULANT WITH COROSION INHIBITOR
- Publication number 20130193576
- Publication date Aug 1, 2013
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MULTIPLE LAYER OVER PAD METALLIZATION AND METHOD OF F...
- Publication number 20110198751
- Publication date Aug 18, 2011
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM A VIA
- Publication number 20110151663
- Publication date Jun 23, 2011
- Freescale Semiconductor Inc.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BRIDGE RANDOM ACCESS MEMORY DEVICE AND METHOD OF MAKING...
- Publication number 20090218567
- Publication date Sep 3, 2009
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPAD FORMATION FOR A SEMICONDUCTOR
- Publication number 20090176366
- Publication date Jul 9, 2009
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING A 3-D SEMICONDUCTOR DIE STRUCTURE WITH AN INTERMETALLIC FOR...
- Publication number 20090170246
- Publication date Jul 2, 2009
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming interconnects for 3-D applications
- Publication number 20080299762
- Publication date Dec 4, 2008
- Freescale Semiconductor, Inc.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to form a via
- Publication number 20080299759
- Publication date Dec 4, 2008
- Freescale Semiconductor, Inc.
- Ritwik Chatterjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS
- Publication number 20080197497
- Publication date Aug 21, 2008
- FREESCALE SEMICONDUCTOR, INC.
- SCOTT K. POZDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROPAD FOR BONDING AND A METHOD THEREFOR
- Publication number 20080099799
- Publication date May 1, 2008
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for cleaning electroless process tank
- Publication number 20070246075
- Publication date Oct 25, 2007
- Freescale Semiconductor, Inc.
- Sam S. Garcia
- B08 - CLEANING
Information Patent Application
BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS
- Publication number 20070231950
- Publication date Oct 4, 2007
- Scott K. Pozder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED ELECTROLESS PLATING
- Publication number 20070087566
- Publication date Apr 19, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Steven M. Hues
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming a capping layer on a semiconductor device
- Publication number 20070049008
- Publication date Mar 1, 2007
- Gerald A. Martin
- H01 - BASIC ELECTRIC ELEMENTS

Varughese Mathew

Person

Patents Grantslast 30 patents

Surface finish for wirebonding

Semiconductor device attached to an exposed pad

Semiconductor structure with sacrificial anode and method for forming

Bond pad structure for semiconductor device packaging

Structure and method to minimize warpage of packaged semiconductor...

Packaged semiconductor device with a lead frame and method for forming

Apparatus and methods for stackable packaging

Integrated circuit carrier coating

System and method for lead frame package degating

Semiconductor structure with sacrificial anode and passivation laye...

Encapsulant with corrosion inhibitor

Encapsulant for a semiconductor device

Method for treating a bond pad of a package substrate

Mold compound compatibility test system and methods thereof

Encapsulant for a semiconductor device

Heat spreader for use within a packaged semiconductor device

Encapsulant for a semiconductor device

Method to form a via

Method of improving adhesion of bond pad over pad metallization wit...

Method of making a semiconductor device including a bridgeable mate...

Method for forming interconnects for 3-D applications

Forming a 3-D semiconductor die structure with an intermetallic for...

Method to form a via

Micropad formation for a semiconductor

Controlled electroless plating

Micropad for bonding and a method therefor

Method of forming a semiconductor device having a diffusion barrier...

Method for cleaning electroless process tank

Barrier for use in 3-D integration of circuits

Semiconductor device having conductive spacers in sidewall regions...

Patents Applicationslast 30 patents

PACKAGE WITH MOLD-EMBEDDED INDUCTOR AND METHOD OF FABRICATION THEREFOR

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

Semiconductor Structure With Sacrificial Anode and Method for Forming

STRUCTURE AND METHOD TO MINIMIZE WARPAGE OF PACKAGED SEMICONDUCTOR...

INTEGRATED CIRCUIT CARRIER COATING

SEMICONDUCTOR DEVICE ATTACHED TO AN EXPOSED PAD

STRUCTURE AND METHOD TO MINIMIZE WARPAGE OF PACKAGED SEMICONDUCTOR...

SURFACE FINISH FOR WIREBONDING

METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE

SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING

TIN-BASED WIREBOND STRUCTURES

SEMICONDUCTOR STRUCTURE WITH SACRIFICIAL ANODE AND METHOD FOR FORMING

Method for Bonding Semiconductor Devices

ENCAPSULANT FOR A SEMICONDUCTOR DEVICE

HEAT SPREADER FOR USE WITHIN A PACKAGED SEMICONDUCTOR DEVICE

MOLD COMPOUND COMPATIBILITY TEST SYSTEM AND METHODS THEREOF

ENCAPSULANT WITH COROSION INHIBITOR

BOND PAD WITH MULTIPLE LAYER OVER PAD METALLIZATION AND METHOD OF F...

METHOD TO FORM A VIA

CONDUCTIVE BRIDGE RANDOM ACCESS MEMORY DEVICE AND METHOD OF MAKING...

MICROPAD FORMATION FOR A SEMICONDUCTOR

FORMING A 3-D SEMICONDUCTOR DIE STRUCTURE WITH AN INTERMETALLIC FOR...

Method for forming interconnects for 3-D applications

Method to form a via

BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS

MICROPAD FOR BONDING AND A METHOD THEREFOR

Method for cleaning electroless process tank

BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS

CONTROLLED ELECTROLESS PLATING

Method for forming a capping layer on a semiconductor device