Venkateshwaran Vaiyapuri

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor/printed circuit board assembly, and computer system
- Patent number 7,427,535
- Issue date Sep 23, 2008
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS heat pumps for integrated circuit heat dissipation
- Patent number 7,107,777
- Issue date Sep 19, 2006
- Micro Technology, Inc.
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
MEMS heat pumps for integrated circuit heat dissipation
- Patent number 7,084,004
- Issue date Aug 1, 2006
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Semiconductor/printed circuit board assembly, and computer system
- Patent number 6,869,827
- Issue date Mar 22, 2005
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die support structure
- Patent number 6,844,217
- Issue date Jan 18, 2005
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die support structure
- Patent number 6,798,055
- Issue date Sep 28, 2004
- Micron Technology
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating dual loc semiconductor die assembly employi...
- Patent number 6,762,079
- Issue date Jul 13, 2004
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS heat pumps for integrated circuit heat dissipation
- Patent number 6,629,425
- Issue date Oct 7, 2003
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Dual LOC semiconductor assembly employing floating lead finger stru...
- Patent number 6,541,846
- Issue date Apr 1, 2003
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor/printed circuit board assembly
- Patent number 6,507,107
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die support structure
- Patent number 6,469,376
- Issue date Oct 22, 2002
- Micron Technology Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip semiconductor assembly
- Patent number 6,388,336
- Issue date May 14, 2002
- Texas Instruments Incorporated
- Vaiyapuri Venkateshwaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked flip-chip integrated circuit assemblage
- Patent number 6,339,254
- Issue date Jan 15, 2002
- Texas Instruments Incorporated
- Vaiyapuri Venkateshwaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip assembly semiconductor
- Patent number 6,316,822
- Issue date Nov 13, 2001
- Texas Instruments Incorporated
- Vaiyapuri Venkateshwaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module with stacked dice
- Patent number 6,274,930
- Issue date Aug 14, 2001
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module with stacked dice
- Patent number 6,207,467
- Issue date Mar 27, 2001
- Micron Technology, Inc.
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMS heat pumps for integrated circuit heat dissipation
- Publication number 20060236710
- Publication date Oct 26, 2006
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
MEMS heat pumps for integrated circuit heat dissipation
- Publication number 20060236711
- Publication date Oct 26, 2006
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
MEMS heat pumps for integrated circuit heat dissipation
- Publication number 20060189022
- Publication date Aug 24, 2006
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Semiconductor/printed circuit board assembly, and computer system
- Publication number 20050106780
- Publication date May 19, 2005
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS heat pumps for integrated circuit heat dissipation
- Publication number 20040031281
- Publication date Feb 19, 2004
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
MEMS heat pumps for integrated circuit heat dissipation
- Publication number 20040031594
- Publication date Feb 19, 2004
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Semiconductor/printed circuit board assembly, and computer system
- Publication number 20030006496
- Publication date Jan 9, 2003
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS heat pumps for integrated circuit heat dissipation
- Publication number 20020184907
- Publication date Dec 12, 2002
- Venkateshwaran Vaiyapuri
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Die support structure
- Publication number 20020153604
- Publication date Oct 24, 2002
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor/printed circuit board assembly, and computer system
- Publication number 20020130422
- Publication date Sep 19, 2002
- Vaiyapuri Venkateshwaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die support structure
- Publication number 20020125567
- Publication date Sep 12, 2002
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUPPORT STRUCTURE
- Publication number 20020127770
- Publication date Sep 12, 2002
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual LOC semiconductor assembly employing floating lead finger stru...
- Publication number 20020081775
- Publication date Jun 27, 2002
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual LOC semiconductor assembly employing floating lead finger stru...
- Publication number 20020027271
- Publication date Mar 7, 2002
- Venkateshwaran Vaiyapuri
- H01 - BASIC ELECTRIC ELEMENTS

Venkateshwaran Vaiyapuri

Person

Patents Grantslast 30 patents

Semiconductor/printed circuit board assembly, and computer system

MEMS heat pumps for integrated circuit heat dissipation

MEMS heat pumps for integrated circuit heat dissipation

Semiconductor/printed circuit board assembly, and computer system

Die support structure

Die support structure

Methods for fabricating dual loc semiconductor die assembly employi...

MEMS heat pumps for integrated circuit heat dissipation

Dual LOC semiconductor assembly employing floating lead finger stru...

Semiconductor/printed circuit board assembly

Die support structure

Multichip semiconductor assembly

Stacked flip-chip integrated circuit assemblage

Multichip assembly semiconductor

Multi-chip module with stacked dice

Multi-chip module with stacked dice

Patents Applicationslast 30 patents

MEMS heat pumps for integrated circuit heat dissipation

MEMS heat pumps for integrated circuit heat dissipation

MEMS heat pumps for integrated circuit heat dissipation

Semiconductor/printed circuit board assembly, and computer system

MEMS heat pumps for integrated circuit heat dissipation

MEMS heat pumps for integrated circuit heat dissipation

Semiconductor/printed circuit board assembly, and computer system

MEMS heat pumps for integrated circuit heat dissipation

Die support structure

Semiconductor/printed circuit board assembly, and computer system

Die support structure

DIE SUPPORT STRUCTURE

Dual LOC semiconductor assembly employing floating lead finger stru...

Dual LOC semiconductor assembly employing floating lead finger stru...