Victor Lim

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Copper metal structure for the reduction of intra-metal capacitance
- Patent number 6,815,823
- Issue date Nov 9, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Young-Way Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Linear polishing for improving substrate uniformity
- Patent number 6,726,545
- Issue date Apr 27, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- B24 - GRINDING POLISHING
Information Patent Grant
STI scheme to prevent fox recess during pre-CMP HF dip
- Patent number 6,673,695
- Issue date Jan 6, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple step CMP polishing
- Patent number 6,663,472
- Issue date Dec 16, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- B24 - GRINDING POLISHING
Information Patent Grant
Copper metal structure for the reduction of intra-metal capacitance
- Patent number 6,649,517
- Issue date Nov 18, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Young-Way Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate dish-free copper interconnects
- Patent number 6,531,386
- Issue date Mar 11, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assorted aluminum wiring design to enhance chip-level performance f...
- Patent number 6,472,697
- Issue date Oct 29, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an air gap shallow trench isolation (STI) st...
- Patent number 6,406,975
- Issue date Jun 18, 2002
- Chartered Semiconductor Manufacturing Inc.
- Victor Seng Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to achieve STI planarization
- Patent number 6,403,484
- Issue date Jun 11, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assorted aluminum wiring design to enhance chip-level performance f...
- Patent number 6,399,471
- Issue date Jun 4, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Yeow Kheng Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to prevent CU dishing during damascene formation
- Patent number 6,376,376
- Issue date Apr 23, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Elevated bond-pad structure for high-density flip-clip packaging an...
- Publication number 20060166402
- Publication date Jul 27, 2006
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel copper metal structure for the reduction of intra-metal capac...
- Publication number 20040065956
- Publication date Apr 8, 2004
- Chartered Semiconductor Manufacturing Ltd.
- Young-Way Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Linear polishing for improving substrate uniformity
- Publication number 20030203710
- Publication date Oct 30, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Subramanian Balakumar
- B24 - GRINDING POLISHING
Information Patent Application
Multiple step CMP polishing
- Publication number 20030148712
- Publication date Aug 7, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng-Keong Lim
- B24 - GRINDING POLISHING
Information Patent Application
Extended poly buffer STI scheme
- Publication number 20020094648
- Publication date Jul 18, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Victor Seng Keong Lim
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Copper metal structure for the reduction of intra-metal capacitance

Linear polishing for improving substrate uniformity

STI scheme to prevent fox recess during pre-CMP HF dip

Multiple step CMP polishing

Copper metal structure for the reduction of intra-metal capacitance

Method to fabricate dish-free copper interconnects

Assorted aluminum wiring design to enhance chip-level performance f...

Method for fabricating an air gap shallow trench isolation (STI) st...

Method to achieve STI planarization

Assorted aluminum wiring design to enhance chip-level performance f...

Method to prevent CU dishing during damascene formation

Patents Applicationslast 30 patents

Elevated bond-pad structure for high-density flip-clip packaging an...

Novel copper metal structure for the reduction of intra-metal capac...

Linear polishing for improving substrate uniformity

Multiple step CMP polishing

Extended poly buffer STI scheme