Vivian Ryan

Person

Hampton, NJ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit with heat conducting structures for localized th...
- Patent number 8,664,759
- Issue date Mar 4, 2014
- Agere Systems LLC
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal monitoring and management of integrated circuits
- Patent number 7,973,544
- Issue date Jul 5, 2011
- Agere Systems Inc.
- Vance D. Archer, III
- G01 - MEASURING TESTING
Information Patent Grant
On-chip sensor array for temperature management in integrated circuits
- Patent number 7,800,879
- Issue date Sep 21, 2010
- Agere Systems Inc.
- Vivian Ryan
- G05 - CONTROLLING REGULATING
Information Patent Grant
Heat sink formed of multiple metal layers on backside of integrated...
- Patent number 7,745,927
- Issue date Jun 29, 2010
- Agere Systems Inc.
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for determining pad height for a wire-bonding...
- Patent number 7,705,473
- Issue date Apr 27, 2010
- Agere Systems Inc.
- Sean Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lateral double diffused MOS transistors
- Patent number 7,573,097
- Issue date Aug 11, 2009
- Agere Systems Inc.
- John C. Desko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having bond pad with improved thermal and mechan...
- Patent number 7,504,728
- Issue date Mar 17, 2009
- Agere Systems Inc.
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device incorporating metallurgical bond to enhan...
- Patent number 7,429,502
- Issue date Sep 30, 2008
- Agere Systems, INC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization performance in electronic devices
- Patent number 7,339,274
- Issue date Mar 4, 2008
- Agere Systems Inc.
- John C. Desko, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device incorporating metallurigical bond to enha...
- Patent number 7,327,029
- Issue date Feb 5, 2008
- Agere Systems, INC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dummy conductive via and a method of...
- Patent number 7,157,365
- Issue date Jan 2, 2007
- Agere Systems Inc.
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for determining pad height for a wire-bonding...
- Patent number 7,056,819
- Issue date Jun 6, 2006
- Agere Systems Inc.
- Sean Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for the detection of damaged regions on diele...
- Patent number 6,919,228
- Issue date Jul 19, 2005
- Agere Systems, INC
- Sean Lian
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit and a method of manufacturing an integrated circuit
- Patent number 6,833,557
- Issue date Dec 21, 2004
- Agere Systems Inc.
- Vivian Wanda Ryan
- G01 - MEASURING TESTING
Information Patent Grant
Stress migration test structure and method therefor
- Patent number 6,747,445
- Issue date Jun 8, 2004
- Agere Systems Inc.
- H. Scott Fetterman
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit having stress migration test structure and metho...
- Patent number 6,683,465
- Issue date Jan 27, 2004
- Agere Systems Inc.
- H. Scott Fetterman
- G01 - MEASURING TESTING
Information Patent Grant
Method of testing an integrated circuit
- Patent number 6,621,280
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Vivian Wanda Ryan
- G01 - MEASURING TESTING
Information Patent Grant
Interconnections to copper IC's
- Patent number 6,620,720
- Issue date Sep 16, 2003
- Agere Systems Inc.
- Ralph Salvatore Moyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating copper interconnect for ULSI integrated cir...
- Patent number 6,410,435
- Issue date Jun 25, 2002
- Agere Systems Guardian Corp.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad design for integrated circuits
- Patent number 6,207,547
- Issue date Mar 27, 2001
- Lucent Technologies Inc.
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad for a flip chip package, and method of forming the same
- Patent number 6,187,658
- Issue date Feb 13, 2001
- Lucent Technologies, Inc.
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad for a flip-chip package
- Patent number 6,087,732
- Issue date Jul 11, 2000
- Lucent Technologies, Inc.
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit processing
- Patent number 6,004,827
- Issue date Dec 21, 1999
- Lucent Technologies Inc.
- Vivian Wanda Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad design for integrated circuits
- Patent number 5,986,343
- Issue date Nov 16, 1999
- Lucent Technologies Inc.
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress migration evaluation method
- Patent number 5,930,587
- Issue date Jul 27, 1999
- Lucent Technologies
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive runner fabrication
- Patent number 5,599,737
- Issue date Feb 4, 1997
- Lucent Technologies Inc.
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS
- Publication number 20100045326
- Publication date Feb 25, 2010
- Agere Systems Inc.
- Vance D. Archer, III
- G01 - MEASURING TESTING
Information Patent Application
On-Chip Sensor Array for Temperature Management in Integrated Circuits
- Publication number 20080026503
- Publication date Jan 31, 2008
- Vivian Ryan
- G05 - CONTROLLING REGULATING
Information Patent Application
Integrated Circuit Device Incorporating Metallurgical Bond to Enhan...
- Publication number 20080026508
- Publication date Jan 31, 2008
- Agere Systems Inc.
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having bond pad with improved thermal and mechan...
- Publication number 20070134903
- Publication date Jun 14, 2007
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device incorporating metallurigacal bond to enha...
- Publication number 20070069368
- Publication date Mar 29, 2007
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with heat conducting structures for localized th...
- Publication number 20060289988
- Publication date Dec 28, 2006
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for determining pad height for a wire-bonding...
- Publication number 20060157871
- Publication date Jul 20, 2006
- Agere Systems Inc.
- Sean Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lateral double diffused MOS transistors
- Publication number 20060091480
- Publication date May 4, 2006
- John C. Desko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization performance in electronic devices
- Publication number 20060038294
- Publication date Feb 23, 2006
- John C. Desko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink formed of multiple metal layers on backside of integrated...
- Publication number 20050287952
- Publication date Dec 29, 2005
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a dummy conductive via and a method of...
- Publication number 20050248033
- Publication date Nov 10, 2005
- Agere Systems Inc.
- Vivian Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THE DETECTION OF DAMAGED REGIONS ON DIELE...
- Publication number 20050092987
- Publication date May 5, 2005
- Sean Lian
- G01 - MEASURING TESTING
Information Patent Application
Methods and apparatus for determining pad height for a wire-bonding...
- Publication number 20050067678
- Publication date Mar 31, 2005
- Sean Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit having stress migration test structure and metho...
- Publication number 20030080766
- Publication date May 1, 2003
- H. Scott Fetterman
- G01 - MEASURING TESTING
Information Patent Application
Stress migration test structure and method therefor
- Publication number 20030082836
- Publication date May 1, 2003
- H. Scott Fetterman
- G01 - MEASURING TESTING
Information Patent Application
Process for fabricating copper interconnect for ULSI integrated cir...
- Publication number 20020137330
- Publication date Sep 26, 2002
- Vivian W. Ryan
- H01 - BASIC ELECTRIC ELEMENTS

Vivian Ryan

Person

Patents Grantslast 30 patents

Integrated circuit with heat conducting structures for localized th...

Thermal monitoring and management of integrated circuits

On-chip sensor array for temperature management in integrated circuits

Heat sink formed of multiple metal layers on backside of integrated...

Methods and apparatus for determining pad height for a wire-bonding...

Lateral double diffused MOS transistors

Integrated circuit having bond pad with improved thermal and mechan...

Integrated circuit device incorporating metallurgical bond to enhan...

Metallization performance in electronic devices

Integrated circuit device incorporating metallurigical bond to enha...

Semiconductor device having a dummy conductive via and a method of...

Methods and apparatus for determining pad height for a wire-bonding...

Methods and apparatus for the detection of damaged regions on diele...

Integrated circuit and a method of manufacturing an integrated circuit

Stress migration test structure and method therefor

Integrated circuit having stress migration test structure and metho...

Method of testing an integrated circuit

Interconnections to copper IC&#x00027;s

Process for fabricating copper interconnect for ULSI integrated cir...

Bond pad design for integrated circuits

Bond pad for a flip chip package, and method of forming the same

Bond pad for a flip-chip package

Integrated circuit processing

Bond pad design for integrated circuits

Stress migration evaluation method

Conductive runner fabrication

Patents Applicationslast 30 patents

THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS

On-Chip Sensor Array for Temperature Management in Integrated Circuits

Integrated Circuit Device Incorporating Metallurgical Bond to Enhan...

Integrated circuit having bond pad with improved thermal and mechan...

Integrated circuit device incorporating metallurigacal bond to enha...

Integrated circuit with heat conducting structures for localized th...

Methods and apparatus for determining pad height for a wire-bonding...

Lateral double diffused MOS transistors

Metallization performance in electronic devices

Heat sink formed of multiple metal layers on backside of integrated...

Semiconductor device having a dummy conductive via and a method of...

METHODS AND APPARATUS FOR THE DETECTION OF DAMAGED REGIONS ON DIELE...

Methods and apparatus for determining pad height for a wire-bonding...

Integrated circuit having stress migration test structure and metho...

Stress migration test structure and method therefor

Process for fabricating copper interconnect for ULSI integrated cir...

Interconnections to copper IC's