Voya Rista Markovich

Person

Endewell, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of making a circuitized substrate
- Patent number 9,756,724
- Issue date Sep 5, 2017
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive adhesive (ECA) for multilayer device interc...
- Patent number 9,451,693
- Issue date Sep 20, 2016
- i3 ELECTRONICS, INC.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless layer buildup structure with LGA and joining layer
- Patent number 9,351,408
- Issue date May 24, 2016
- i3 ELECTRONICS, INC.
- Voya Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conducting paste for device level interconnects
- Patent number 8,685,284
- Issue date Apr 1, 2014
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solder and electrically conductive adhesive based interconnection f...
- Patent number 8,592,299
- Issue date Nov 26, 2013
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with thermal interposer and method of making same
- Patent number 8,558,374
- Issue date Oct 15, 2013
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless layer buildup structure
- Patent number 8,541,687
- Issue date Sep 24, 2013
- Endicott Interconnect Technologies, Inc.
- Voya Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless layer buildup structure with LGA
- Patent number 8,536,459
- Issue date Sep 17, 2013
- Endicott Interconnect Technologies, Inc.
- Voya Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making halogen-free circuitized substrate with reduced th...
- Patent number 8,499,440
- Issue date Aug 6, 2013
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electrically conductive printed line
- Patent number 8,499,445
- Issue date Aug 6, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming multilayer capacitors in a printed circuit substrate
- Patent number 8,501,575
- Issue date Aug 6, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with low loss capacitive material and method...
- Patent number 8,446,707
- Issue date May 21, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package including high density interposer and circuitize...
- Patent number 8,405,229
- Issue date Mar 26, 2013
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuitized substrate with dielectric interposer assembly and method
- Patent number 8,299,371
- Issue date Oct 30, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-tamper microchip package based on thermal nanofluids or fluids
- Patent number 8,288,857
- Issue date Oct 16, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making high density interposer and electronic package uti...
- Patent number 8,245,392
- Issue date Aug 21, 2012
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuitized substrate with resistor including mate...
- Patent number 8,247,703
- Issue date Aug 21, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining a semiconductor device/chip to a printed wiring b...
- Patent number 8,240,031
- Issue date Aug 14, 2012
- Endicott International Technologies, Inc.
- Voya R. Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrates utilizing smooth-sided conductive layers as...
- Patent number 8,242,376
- Issue date Aug 14, 2012
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayered circuitized substrate with P-aramid dielectric layers...
- Patent number 8,211,790
- Issue date Jul 3, 2012
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semi-conductor chip with compressible contact structure and electro...
- Patent number 8,198,739
- Issue date Jun 12, 2012
- Endicott Interconnect Technologies, Inc.
- How Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitized substrate with continuous thermoplastic support film di...
- Patent number 8,084,863
- Issue date Dec 27, 2011
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrate with conductive paste, electrical assembly in...
- Patent number 8,063,315
- Issue date Nov 22, 2011
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layered interconnect structure using liquid crystalline polym...
- Patent number 7,981,245
- Issue date Jul 19, 2011
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making circuitized substrates having photo-imageable die...
- Patent number 7,977,034
- Issue date Jul 12, 2011
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric composition for use in circuitized substrates and circui...
- Patent number 7,931,830
- Issue date Apr 26, 2011
- Endicott Interconnect Technologies, Inc.
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive substrate
- Patent number 7,897,877
- Issue date Mar 1, 2011
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitized substrates utilizing smooth-sided conductive layers as...
- Patent number 7,838,776
- Issue date Nov 23, 2010
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for making circuitized substrates having photo-imageable...
- Patent number 7,827,682
- Issue date Nov 9, 2010
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making multilayered circuitized substrate assembly
- Patent number 7,823,274
- Issue date Nov 2, 2010
- Endicott Interconnect Technologies, Inc.
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...
- Publication number 20130033827
- Publication date Feb 7, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL SUBSTRATE
- Publication number 20130025839
- Publication date Jan 31, 2013
- Endicott Interconnect Technologies, Inc.
- Frank Egitto
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION
- Publication number 20120257343
- Publication date Oct 11, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM
- Publication number 20120260063
- Publication date Oct 11, 2012
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS LAYER LAMINATED CHIP CARRIER HAVING SYSTEM IN PACKAGE STRU...
- Publication number 20120247822
- Publication date Oct 4, 2012
- Endicott Interconnect Technologies, Inc.
- James W. Fuller, JR.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD...
- Publication number 20120228014
- Publication date Sep 13, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE
- Publication number 20120223047
- Publication date Sep 6, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME
- Publication number 20120201006
- Publication date Aug 9, 2012
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS LAYER BUILDUP STRUCTURE
- Publication number 20120160547
- Publication date Jun 28, 2012
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORELESS LAYER BUILDUP STRUCTURE WITH LGA
- Publication number 20120160544
- Publication date Jun 28, 2012
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MAKING SAME
- Publication number 20120162928
- Publication date Jun 28, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD
- Publication number 20120152605
- Publication date Jun 21, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE
- Publication number 20120112345
- Publication date May 10, 2012
- Endicott Interconnect Technologies, Inc.
- Kim J. Blackwell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS
- Publication number 20120069531
- Publication date Mar 22, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS
- Publication number 20120068326
- Publication date Mar 22, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRO...
- Publication number 20120038046
- Publication date Feb 16, 2012
- How Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER
- Publication number 20120031649
- Publication date Feb 9, 2012
- Endicott Interconnect Technologies, Inc.
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY IN...
- Publication number 20120017437
- Publication date Jan 26, 2012
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY DECAL AND METHOD FOR ATTACHING SAME
- Publication number 20120015532
- Publication date Jan 19, 2012
- Endicott Interconnect Technologies, Inc.
- Voya R. Markovich
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIE...
- Publication number 20110173809
- Publication date Jul 21, 2011
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making high density interposer and electronic package uti...
- Publication number 20110126408
- Publication date Jun 2, 2011
- Timothy Antesberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic package including high density interposer and circuitize...
- Publication number 20110127664
- Publication date Jun 2, 2011
- Timothy Antesberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH RESISTOR INCLUDING MATE...
- Publication number 20110043987
- Publication date Feb 24, 2011
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photosensitive dielectric film
- Publication number 20110017498
- Publication date Jan 27, 2011
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...
- Publication number 20100328868
- Publication date Dec 30, 2010
- Endicott Interconnect Technologies, Inc.
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...
- Publication number 20100218891
- Publication date Sep 2, 2010
- International Business Machines Corporation
- Frank D. Egitto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate with P-aramid dielectric layers and method of...
- Publication number 20090258161
- Publication date Oct 15, 2009
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuitized substrate and method of making same
- Publication number 20090241332
- Publication date Oct 1, 2009
- John M. Lauffer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capacitive substrate and method of making same
- Publication number 20090206051
- Publication date Aug 20, 2009
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Halogen-free circuitized substrate with reduced thermal expansion,...
- Publication number 20090175000
- Publication date Jul 9, 2009
- Robert M. Japp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Voya Rista Markovich

Person

Patents Grantslast 30 patents

Method of making a circuitized substrate

Electrically conductive adhesive (ECA) for multilayer device interc...

Coreless layer buildup structure with LGA and joining layer

Conducting paste for device level interconnects

Solder and electrically conductive adhesive based interconnection f...

Electronic package with thermal interposer and method of making same

Coreless layer buildup structure

Coreless layer buildup structure with LGA

Method of making halogen-free circuitized substrate with reduced th...

Method of forming an electrically conductive printed line

Method of forming multilayer capacitors in a printed circuit substrate

Circuitized substrate with low loss capacitive material and method...

Electronic package including high density interposer and circuitize...

Circuitized substrate with dielectric interposer assembly and method

Anti-tamper microchip package based on thermal nanofluids or fluids

Method of making high density interposer and electronic package uti...

Method of making circuitized substrate with resistor including mate...

Method of joining a semiconductor device/chip to a printed wiring b...

Circuitized substrates utilizing smooth-sided conductive layers as...

Multilayered circuitized substrate with P-aramid dielectric layers...

Semi-conductor chip with compressible contact structure and electro...

Circuitized substrate with continuous thermoplastic support film di...

Circuitized substrate with conductive paste, electrical assembly in...

Multi-layered interconnect structure using liquid crystalline polym...

Method for making circuitized substrates having photo-imageable die...

Dielectric composition for use in circuitized substrates and circui...

Capacitive substrate

Circuitized substrates utilizing smooth-sided conductive layers as...

Apparatus for making circuitized substrates having photo-imageable...

Method of making multilayered circuitized substrate assembly

Patents Applicationslast 30 patents

ELECTRICALLY CONDUCTIVE ADHESIVE (ECA) FOR MULTILAYER DEVICE INTERC...

THERMAL SUBSTRATE

CONDUCTIVE METAL MICRO-PILLARS FOR ENHANCED ELECTRICAL INTERCONNECTION

MODULAR, DETACHABLE COMPUTE LEAF FOR USE WITH COMPUTING SYSTEM

CORELESS LAYER LAMINATED CHIP CARRIER HAVING SYSTEM IN PACKAGE STRU...

CIRCUITIZED SUBSTRATE WITH INTERNAL THIN FILM CAPACITOR AND METHOD...

METHOD OF FORMING MULTILAYER CAPACITORS IN A PRINTED CIRCUIT SUBSTRATE

ELECTRONIC PACKAGE WITH THERMAL INTERPOSER AND METHOD OF MAKING SAME

CORELESS LAYER BUILDUP STRUCTURE

CORELESS LAYER BUILDUP STRUCTURE WITH LGA

ELECTRONIC PACKAGE AND METHOD OF MAKING SAME

CIRCUITIZED SUBSTRATE WITH DIELECTRIC INTERPOSER ASSEMBLY AND METHOD

HIGH BANDWIDTH SEMICONDUCTOR BALL GRID ARRAY PACKAGE

CONDUCTING PASTE FOR DEVICE LEVEL INTERCONNECTS

ANTI-TAMPER MICROCHIP PACKAGE BASED ON THERMAL NANOFLUIDS OR FLUIDS

SEMI-CONDUCTOR CHIP WITH COMPRESSIBLE CONTACT STRUCTURE AND ELECTRO...

CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER

CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY IN...

HIGH DENSITY DECAL AND METHOD FOR ATTACHING SAME

METHOD FOR MAKING CIRCUITIZED SUBSTRATES HAVING PHOTO-IMAGEABLE DIE...

Method of making high density interposer and electronic package uti...

Electronic package including high density interposer and circuitize...

METHOD OF MAKING CIRCUITIZED SUBSTRATE WITH RESISTOR INCLUDING MATE...

Photosensitive dielectric film

CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS...

MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYM...

Circuitized substrate with P-aramid dielectric layers and method of...

Circuitized substrate and method of making same

Capacitive substrate and method of making same

Halogen-free circuitized substrate with reduced thermal expansion,...