Wei-Chung Wu

Person

Taipei Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method and device for forming metal gate electrodes for transistors
- Patent number 12,205,819
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuits, memory devices, and methods for operating an e...
- Patent number 12,205,634
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Cheng Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Shared pad/bridge layout for a 3D IC
- Patent number 12,191,282
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via structure disposed on a conductive pillar of a semicond...
- Patent number 12,191,239
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,191,224
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Static random access memory with a supplementary driver circuit and...
- Patent number 12,176,026
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Yu Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,176,299
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,167,594
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Chin Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Anti-stiction process for MEMS device
- Patent number 12,157,667
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jui-Chun Weng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure
- Patent number 12,154,927
- Issue date Nov 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Ting Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite BSI structure and method of manufacturing the same
- Patent number 12,148,782
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical sensor and methods of making the same
- Patent number 12,148,236
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- You-Cheng Jhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC structure for high voltage device on a SOI substrate
- Patent number 12,136,627
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array boundary structure to reduce dishing
- Patent number 12,127,399
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric heating fragrance diffuser
- Patent number 12,115,291
- Issue date Oct 15, 2024
- Pro-Iroda Industries, Inc.
- Wei Cheng Wu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Metal rail conductors for non-planar semiconductor devices
- Patent number 12,113,132
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor feature and method for manufacturing the same
- Patent number 12,107,001
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multifunctional collimator for contact image sensors
- Patent number 12,092,839
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-type high voltage devices fabrication for embedded memory
- Patent number 12,096,621
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device having capacitor and manufacturing method thereof
- Patent number 12,087,809
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement and formation thereof
- Patent number 12,068,313
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dopant deactivation underneath gate
- Patent number 12,068,374
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dhanyakumar Mahaveer Sathaiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,058,856
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench gate high voltage transistor for embedded memory
- Patent number 12,048,163
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor imaging device having improved dark current performance
- Patent number 12,040,336
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Seiji Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing pattern loading in the etch-back of metal gate
- Patent number 12,034,059
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control circuit and method for use in stackable multiphase power co...
- Patent number 12,027,966
- Issue date Jul 2, 2024
- Richtek Technology Corporation
- Ta-Yung Yang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method of using high density plasma chemical vapor deposition chamber
- Patent number 12,020,905
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ching Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to embed planar FETs with finFETs
- Patent number 12,015,029
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a gate structure in high-κ metal gate technology
- Patent number 12,009,402
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORM...
- Publication number 20250031403
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20250024671
- Publication date Jan 16, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Hui Huang
- G11 - INFORMATION STORAGE
Information Patent Application
WIRELESS POWER TRANSMITTER CIRCUIT AND METHOD CAPABLE OF DETECTING...
- Publication number 20250015641
- Publication date Jan 9, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Wei-Shuo Wu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FOR...
- Publication number 20240421111
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES
- Publication number 20240421077
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE AND DIELECTRIC FIN
- Publication number 20240421004
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FEATURES FOR PARASITIC CAPACITANCE REDUCTION
- Publication number 20240413244
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413101
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
- Publication number 20240413102
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS and Via Rails for Source/Drain Metal Full Contact
- Publication number 20240405082
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIN JOG STRUCTURE AND METHODS OF MAKING SAME
- Publication number 20240405097
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED FIN HEIGHT FOR FINFET TRANSISTOR AND METHOD OF FABRICATIN...
- Publication number 20240405099
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hao WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND CIRCUIT WITH VOLTAGE SUPPRESSION
- Publication number 20240395316
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chen LIN
- G11 - INFORMATION STORAGE
Information Patent Application
OPTICAL ENGINE MODULE AND NEAR-EYE DISPLAY APPARATUS
- Publication number 20240385463
- Publication date Nov 21, 2024
- CORETRONIC CORPORATION
- Tzu-Hung Lin
- G02 - OPTICS
Information Patent Application
METHOD AND APPARATUS OF SENDING INFORMATION BITS TO LOW POWER WAKEU...
- Publication number 20240388479
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Chien-Chun Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379482
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Rail Conductors For Non-Planar Semiconductor Devices
- Publication number 20240379854
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240371681
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DOPANT DEACTIVATION UNDERNEATH GATE
- Publication number 20240371940
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Dhanyakumar Mahaveer SATHAIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TYPE HIGH VOLTAGE DEVICES FABRICATION FOR EMBEDDED MEMORY
- Publication number 20240373627
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Cheng Wu
- G11 - INFORMATION STORAGE
Information Patent Application
ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING
- Publication number 20240373626
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE
- Publication number 20240371884
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240371904
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Chuang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240365542
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS
- Publication number 20240361609
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROJECTION DEVICE
- Publication number 20240361681
- Publication date Oct 31, 2024
- CORETRONIC CORPORATION
- Wei-Ting Wu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240347579
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging of Dies Including TSVs using Sacrificial Carrier
- Publication number 20240339370
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Chien-Fu Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Wei-Chung Wu

Person

Patents Grantslast 30 patents

Method and device for forming metal gate electrodes for transistors

Electronic circuits, memory devices, and methods for operating an e...

Shared pad/bridge layout for a 3D IC

Stacked via structure disposed on a conductive pillar of a semicond...

Semiconductor package and manufacturing method thereof

Static random access memory with a supplementary driver circuit and...

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Anti-stiction process for MEMS device

Semiconductor structure

Composite BSI structure and method of manufacturing the same

Optical sensor and methods of making the same

3DIC structure for high voltage device on a SOI substrate

Array boundary structure to reduce dishing

Electric heating fragrance diffuser

Metal rail conductors for non-planar semiconductor devices

Semiconductor feature and method for manufacturing the same

Multifunctional collimator for contact image sensors

Multi-type high voltage devices fabrication for embedded memory

Semiconductor device having capacitor and manufacturing method thereof

Semiconductor arrangement and formation thereof

Method of dopant deactivation underneath gate

Semiconductor device and manufacturing method thereof

Trench gate high voltage transistor for embedded memory

Semiconductor imaging device having improved dark current performance

Reducing pattern loading in the etch-back of metal gate

Control circuit and method for use in stackable multiphase power co...

Method of using high density plasma chemical vapor deposition chamber

Method to embed planar FETs with finFETs

Method of forming a gate structure in high-κ metal gate technology

Patents Applicationslast 30 patents

CONTACT PLUG STRUCTURES OF SEMICONDUCTOR DEVICE AND METHODS OF FORM...

MEMORY DEVICE

WIRELESS POWER TRANSMITTER CIRCUIT AND METHOD CAPABLE OF DETECTING...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FOR...

DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES

METHODS OF FORMING SEMICONDUCTOR DEVICE AND DIELECTRIC FIN

DIELECTRIC FEATURES FOR PARASITIC CAPACITANCE REDUCTION

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD

FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF

VIAS and Via Rails for Source/Drain Metal Full Contact

FIN JOG STRUCTURE AND METHODS OF MAKING SAME

OPTIMIZED FIN HEIGHT FOR FINFET TRANSISTOR AND METHOD OF FABRICATIN...

DEVICE AND CIRCUIT WITH VOLTAGE SUPPRESSION

OPTICAL ENGINE MODULE AND NEAR-EYE DISPLAY APPARATUS

METHOD AND APPARATUS OF SENDING INFORMATION BITS TO LOW POWER WAKEU...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Metal Rail Conductors For Non-Planar Semiconductor Devices

SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING DOPANT DEACTIVATION UNDERNEATH GATE

MULTI-TYPE HIGH VOLTAGE DEVICES FABRICATION FOR EMBEDDED MEMORY

ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING

3DIC STRUCTURE FOR HIGH VOLTAGE DEVICE ON A SOI SUBSTRATE

COMPOSITE BSI STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTIFUNCTIONAL COLLIMATOR FOR CONTACT IMAGE SENSORS

PROJECTION DEVICE

SEMICONDUCTOR DEVICE HAVING CAPACITOR AND MANUFACTURING METHOD THEREOF

Packaging of Dies Including TSVs using Sacrificial Carrier