Wei-Lun Chu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with self-aligned conductive features
- Patent number 12,300,600
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,230,534
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid metal line structure
- Patent number 12,183,671
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having deep metal line and method for formi...
- Patent number 12,094,816
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of operating the same
- Patent number 12,058,852
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 12,002,709
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,860,550
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,764,106
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of operating the same
- Patent number 11,729,969
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Hybrid metal line structure
- Patent number 11,682,618
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-aligned patterning and dielectric with v...
- Patent number 11,422,475
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with self-aligned conductiv...
- Patent number 11,404,367
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer housings
- Patent number 11,259,423
- Issue date Feb 22, 2022
- Hewlett-Packard Development Company, L.P.
- Kuan-Ting Wu
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 11,183,422
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display screens
- Patent number 11,164,510
- Issue date Nov 2, 2021
- Hewlett-Packard Development Company, L.P.
- Wei Kuang Chu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,107,725
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of interconnection structure of semi...
- Patent number 11,088,020
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 10,991,618
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cloud over IP session layer network
- Patent number 10,986,133
- Issue date Apr 20, 2021
- Zentera Systems, Inc.
- Jaushin Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mounting apparatus and heat dissipating device using the same
- Patent number 10,966,344
- Issue date Mar 30, 2021
- NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
- Wei-Sin Chu
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Metal routing with flexible space formed using self-aligned spacer...
- Patent number 10,957,580
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible structures
- Patent number 10,871,803
- Issue date Dec 22, 2020
- Hewlett-Packard Development Company, L.P.
- Kuan-Ting Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming semiconductor device structure with graphene layer
- Patent number 10,818,596
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing the same
- Patent number 10,804,143
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal fill with self-align patterning
- Patent number 10,784,155
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chen Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 10,784,151
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal routing with flexible space formed using self-aligned spacer...
- Patent number 10,734,275
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server system
- Patent number RE48135
- Issue date Jul 28, 2020
- Quanta Computer Inc.
- Maw-Zan Jau
Information Patent Grant
Display control in display devices
- Patent number 10,712,628
- Issue date Jul 14, 2020
- Hewlett-Packard Development Company, L.P.
- Kuan-Ting Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Structure and formation method of semiconductor device with self-al...
- Patent number 10,714,421
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTION STRUCTURE HAVING AIR GAP
- Publication number 20250174492
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Yun KU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250149437
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250140683
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chuan-Pu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TWO-DIMENSIONAL MENTAL LINE PATTERNING
- Publication number 20250125148
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118598
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250112088
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250079295
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chen LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METAL LINE STRUCTURE
- Publication number 20250079298
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT
- Publication number 20250054811
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...
- Publication number 20240379537
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...
- Publication number 20240085803
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230369096
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230309296
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- G11 - INFORMATION STORAGE
Information Patent Application
HYBRID METAL LINE STRUCTURE
- Publication number 20230282571
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LINES OF HYBRID HEIGHTS
- Publication number 20230275018
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Tien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME
- Publication number 20230262968
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...
- Publication number 20230067527
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chen CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES
- Publication number 20220359380
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...
- Publication number 20220350262
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID METAL LINE STRUCTURE
- Publication number 20220310508
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Pokuan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210391211
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210242076
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER HOUSINGS
- Publication number 20210136938
- Publication date May 6, 2021
- Hewlett-Packard Development Company, L.P.
- Kuan-Ting WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY SCREENS
- Publication number 20210090487
- Publication date Mar 25, 2021
- Hewlett-Packard Development Company, L.P.
- Wei Kuang Chu
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20210066120
- Publication date Mar 4, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210035853
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20210005510
- Publication date Jan 7, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- HSIANG-WEI LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...
- Publication number 20200365449
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIV...
- Publication number 20200343180
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-I YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND HEAT DISSIPATING DEVICE USING THE SAME
- Publication number 20200205314
- Publication date Jun 25, 2020
- NANNING FUGUI PRECISION INDUSTRIAL CO., LTD.
- WEI-SIN CHU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Wei-Lun Chu

Person

Patents Grantslast 30 patents

Semiconductor device with self-aligned conductive features

Semiconductor device and method of manufacture

Hybrid metal line structure

Semiconductor structure having deep metal line and method for formi...

Semiconductor device and method of operating the same

Interconnect structure and manufacturing method for the same

Multi-metal fill with self-aligned patterning and dielectric with v...

Semiconductor device and method of manufacture

Semiconductor device and method of operating the same

Hybrid metal line structure

Multi-metal fill with self-aligned patterning and dielectric with v...

Method for forming semiconductor device with self-aligned conductiv...

Multilayer housings

Semiconductor structure and method for manufacturing the same

Display screens

Interconnect structure and manufacturing method for the same

Structure and formation method of interconnection structure of semi...

Semiconductor device and method of manufacture

Cloud over IP session layer network

Mounting apparatus and heat dissipating device using the same

Metal routing with flexible space formed using self-aligned spacer...

Flexible structures

Method for forming semiconductor device structure with graphene layer

Semiconductor structure and method for manufacturing the same

Multi-metal fill with self-align patterning

Interconnect structure and manufacturing method for the same

Metal routing with flexible space formed using self-aligned spacer...

Server system

Display control in display devices

Structure and formation method of semiconductor device with self-al...

Patents Applicationslast 30 patents

INTERCONNECTION STRUCTURE HAVING AIR GAP

INTERCONNECTION STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR TWO-DIMENSIONAL MENTAL LINE PATTERNING

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE

INTERCONNECTION STRUCTURE

HYBRID METAL LINE STRUCTURE

SEMICONDUCTOR STRUCTURE INCLUDING LINES OF DIFFERENT HEIGHT

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...

MULTI-METAL FILL WITH SELF-ALIGNED PATTERNING AND DIELECTRIC WITH V...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME

HYBRID METAL LINE STRUCTURE

METAL LINES OF HYBRID HEIGHTS

SEMICONDUCTOR DEVICE AND METHOD OF OPERATING THE SAME

SEMICONDUCTOR STRUCTURE HAVING DEEP METAL LINE AND METHOD FOR FORMI...

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIVE FEATURES

Multi-Metal Fill with Self-Aligned Patterning and Dielectric with V...

HYBRID METAL LINE STRUCTURE

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

MULTILAYER HOUSINGS

DISPLAY SCREENS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTERCONNECT STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

Metal Routing with Flexible Space Formed Using Self-Aligned Spacer...

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH SELF-ALIGNED CONDUCTIV...

MOUNTING APPARATUS AND HEAT DISSIPATING DEVICE USING THE SAME