Wei Tang

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gap fill using carbon-based films
- Patent number 11,049,716
- Issue date Jun 29, 2021
- Lam Research Corporation
- Wei Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inhibitor plasma mediated atomic layer deposition for seamless feat...
- Patent number 9,966,299
- Issue date May 8, 2018
- Lam Research Corporation
- Wei Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of densifying films in semiconductor device
- Patent number 9,966,255
- Issue date May 8, 2018
- Lam Research Corporation
- Bart J. van Schravendijk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of densifying films in semiconductor device
- Patent number 9,786,496
- Issue date Oct 10, 2017
- Lam Research Corporation
- Bart van Schravendijk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Inhibitor plasma mediated atomic layer deposition for seamless feat...
- Patent number 9,425,078
- Issue date Aug 23, 2016
- Lam Research Corporation
- Wei Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for eliminating seams in atomic layer depositio...
- Patent number 9,406,544
- Issue date Aug 2, 2016
- Lam Research Corporation
- Wei Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GAP FILL USING CARBON-BASED FILMS
- Publication number 20190181004
- Publication date Jun 13, 2019
- LAM RESEARCH CORPORATION
- Wei Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DENSIFYING FILMS IN SEMICONDUCTOR DEVICE
- Publication number 20180308690
- Publication date Oct 25, 2018
- LAM RESEARCH CORPORATION
- Bart J. van Schravendijk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DENSIFYING FILMS IN SEMICONDUCTOR DEVICE
- Publication number 20170372895
- Publication date Dec 28, 2017
- LAM RESEARCH CORPORATION
- Bart J. van Schravendijk
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DENSIFYING FILMS IN SEMICONDUCTOR DEVICE
- Publication number 20170053799
- Publication date Feb 23, 2017
- LAM RESEARCH CORPORATION
- Bart van Schravendijk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITOR PLASMA MEDIATED ATOMIC LAYER DEPOSITION FOR SEAMLESS FEAT...
- Publication number 20160329238
- Publication date Nov 10, 2016
- LAM RESEARCH CORPORATION
- Wei Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGHLY SELECTIVE DEPOSITION OF AMORPHOUS CARBON AS A METAL DIFFUSIO...
- Publication number 20160329213
- Publication date Nov 10, 2016
- LAM RESEARCH CORPORATION
- Wei Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILL USING CARBON-BASED FILMS
- Publication number 20160314964
- Publication date Oct 27, 2016
- LAM RESEARCH CORPORATION
- Wei Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INHIBITOR PLASMA MEDIATED ATOMIC LAYER DEPOSITION FOR SEAMLESS FEAT...
- Publication number 20150243545
- Publication date Aug 27, 2015
- LAM RESEARCH CORPORATION
- Wei Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Gap fill using carbon-based films

Inhibitor plasma mediated atomic layer deposition for seamless feat...

Method of densifying films in semiconductor device

Method of densifying films in semiconductor device

Inhibitor plasma mediated atomic layer deposition for seamless feat...

Systems and methods for eliminating seams in atomic layer depositio...

Patents Applicationslast 30 patents

GAP FILL USING CARBON-BASED FILMS

DENSIFYING FILMS IN SEMICONDUCTOR DEVICE

METHOD OF DENSIFYING FILMS IN SEMICONDUCTOR DEVICE

METHOD OF DENSIFYING FILMS IN SEMICONDUCTOR DEVICE

INHIBITOR PLASMA MEDIATED ATOMIC LAYER DEPOSITION FOR SEAMLESS FEAT...

HIGHLY SELECTIVE DEPOSITION OF AMORPHOUS CARBON AS A METAL DIFFUSIO...

GAP FILL USING CARBON-BASED FILMS

INHIBITOR PLASMA MEDIATED ATOMIC LAYER DEPOSITION FOR SEAMLESS FEAT...