WEIMIN SHI

Follow

Person

ITHACA, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High density, high frequency memory chip modules having thermal man...
- Patent number 6,480,014
- Issue date Nov 12, 2002
- High Connection Density, Inc.
- Che-yu Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Wire segment based interposer for high frequency electrical connection
- Patent number 6,264,476
- Issue date Jul 24, 2001
- High Connection Density, Inc.
- Che-yu Li
- G01 - MEASURING TESTING
Information Patent Grant
High capacity memory module with built-in-high-speed bus terminations
- Patent number 6,172,895
- Issue date Jan 9, 2001
- High Connector Density, Inc.
- Dirk D. Brown
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY, HIGH FREQUENCY MEMORY CHIP MODULES HAVING THERMAL MAN...
- Publication number 20030068920
- Publication date Apr 10, 2003
- CHE-YU LI
- G11 - INFORMATION STORAGE