Wen-Chih Hu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package substrate structure and manufacturing method...
- Patent number 8,269,354
- Issue date Sep 18, 2012
- Unimicron Technology Corp.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board having electrically connecting structure and fabricat...
- Patent number 8,188,377
- Issue date May 29, 2012
- Unimicron Technology Corp.
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board surface structure
- Patent number 8,058,564
- Issue date Nov 15, 2011
- Unimicron Technology Corp.
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrate structure and manufacturing method...
- Patent number 7,847,400
- Issue date Dec 7, 2010
- Unimicron Technology Corp.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate
- Patent number 7,705,456
- Issue date Apr 27, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump structure of circuit board and method for forming t...
- Patent number 7,705,471
- Issue date Apr 27, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabrication of a conductive bump structure of a circuit...
- Patent number 7,674,362
- Issue date Mar 9, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structures for electrically conductive pads of circuit b...
- Patent number 7,659,193
- Issue date Feb 9, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector structure of circuit board and method for fabr...
- Patent number 7,608,929
- Issue date Oct 27, 2009
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating circuit board with conductive structure
- Patent number 7,350,298
- Issue date Apr 1, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating conductive bump of circuit board
- Patent number 7,341,934
- Issue date Mar 11, 2008
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating electrical connection structure of circuit b...
- Patent number 7,151,050
- Issue date Dec 19, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a scrubber
- Patent number 7,047,620
- Issue date May 23, 2006
- Mosel Vitelic, Inc.
- Hsiu-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a single-crystal silicon layer on a transparent...
- Patent number 7,045,441
- Issue date May 16, 2006
- Industrial Technology Research Institute
- Chich Shang Chang
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Assembly station for sputter shield assembly
- Patent number 6,751,850
- Issue date Jun 22, 2004
- Mosel Vitelic Inc
- Wen-Ken Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for assembling motor assembly to support wafer
- Patent number 6,658,716
- Issue date Dec 9, 2003
- Mosel Vitelic, Inc.
- Zhi-Zhao Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Auxiliary tool for assembling a scrubber
- Patent number 6,647,607
- Issue date Nov 18, 2003
- Mosel Vitelic, Inc.
- Hsiu-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WORKING FLUID AND MANUFACTURING METHOD OF METAL NANO-PARTICLES
- Publication number 20140353541
- Publication date Dec 4, 2014
- National Tsing-Hua University
- Yu-Lun CHUEH
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110056738
- Publication date Mar 10, 2011
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20110031617
- Publication date Feb 10, 2011
- UNIMICRON TECHONOLOGY COPR.
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE
- Publication number 20090134515
- Publication date May 28, 2009
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board having electrically connecting structure and fabricat...
- Publication number 20090050359
- Publication date Feb 26, 2009
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...
- Publication number 20080272501
- Publication date Nov 6, 2008
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of packaging substrate and method for making the same
- Publication number 20080265411
- Publication date Oct 30, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging substrate and method for manufacturing the same
- Publication number 20080257595
- Publication date Oct 23, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE
- Publication number 20080217047
- Publication date Sep 11, 2008
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATION OF A CONDUCTIVE BUMP STRUCTURE OF A CIRCUIT...
- Publication number 20080179190
- Publication date Jul 31, 2008
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive connection structure formed on the surface of circuit bo...
- Publication number 20080036079
- Publication date Feb 14, 2008
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chien-Chih Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Fabricating Circuit Board with Conductive Structure
- Publication number 20070186412
- Publication date Aug 16, 2007
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive structures for electrically conductive pads of circuit b...
- Publication number 20070161223
- Publication date Jul 12, 2007
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating electrically connecting structure of circuit...
- Publication number 20060252248
- Publication date Nov 9, 2006
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder ball pad surface finish structure of circuit board and fabri...
- Publication number 20060252249
- Publication date Nov 9, 2006
- Shih-Ping Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Processing apparatus for electroplating conductive bumps on organic...
- Publication number 20060252247
- Publication date Nov 9, 2006
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive bump structure of circuit board and method for forming t...
- Publication number 20060244140
- Publication date Nov 2, 2006
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive bump structure of circuit board and fabrication method t...
- Publication number 20060225917
- Publication date Oct 12, 2006
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication method of conductive bump structures of circuit board
- Publication number 20060219567
- Publication date Oct 5, 2006
- Wen-Hung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Fabricating process of an electrically conductive structure on a ci...
- Publication number 20060223299
- Publication date Oct 5, 2006
- Wen-Heng Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector structure of circuit board and method for fabr...
- Publication number 20060204650
- Publication date Sep 14, 2006
- Wen-Hung Hu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conductive bump structure of circuit board and method for fabricati...
- Publication number 20060202331
- Publication date Sep 14, 2006
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating electrical connection structure of circuit b...
- Publication number 20060079081
- Publication date Apr 13, 2006
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating conductive bump of circuit board
- Publication number 20060051952
- Publication date Mar 9, 2006
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for laminating a material layer onto a transparent substrate
- Publication number 20040178173
- Publication date Sep 16, 2004
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Chich Shang Chang
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for forming a single-crystal silicon layer on a transparent...
- Publication number 20040180518
- Publication date Sep 16, 2004
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Chich Shang Chang
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for assembling a scrubber
- Publication number 20040055141
- Publication date Mar 25, 2004
- MOSEL VITELIC, INC. A Taiwanese Corporation
- Hsiu-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Auxiliary tool and method for assembling motor assembly to support...
- Publication number 20020148098
- Publication date Oct 17, 2002
- MOSEL VITELIC, INC.
- Zhi-Zhao Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Auxiliary tool for assembling a scrubber
- Publication number 20020129487
- Publication date Sep 19, 2002
- MOSEL VITELIC, INC.
- Hsiu-Chieh Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assembly station for sputter shield assembly
- Publication number 20020108567
- Publication date Aug 15, 2002
- Mosel Vitelic Inc.
- Wen-Ken Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Wen-Chih Hu

Person

Patents Grantslast 30 patents

Semiconductor package substrate structure and manufacturing method...

Circuit board having electrically connecting structure and fabricat...

Circuit board surface structure

Semiconductor package substrate structure and manufacturing method...

Semiconductor package substrate

Conductive bump structure of circuit board and method for forming t...

Method for fabrication of a conductive bump structure of a circuit...

Conductive structures for electrically conductive pads of circuit b...

Electrical connector structure of circuit board and method for fabr...

Method for fabricating circuit board with conductive structure

Method for fabricating conductive bump of circuit board

Method for fabricating electrical connection structure of circuit b...

Method for assembling a scrubber

Method for forming a single-crystal silicon layer on a transparent...

Assembly station for sputter shield assembly

Method for assembling motor assembly to support wafer

Auxiliary tool for assembling a scrubber

Patents Applicationslast 30 patents

WORKING FLUID AND MANUFACTURING METHOD OF METAL NANO-PARTICLES

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE SUBSTRATE

Circuit board having electrically connecting structure and fabricat...

SEMICONDUCTOR PACKAGE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD...

Structure of packaging substrate and method for making the same

Packaging substrate and method for manufacturing the same

CIRCUIT BOARD SURFACE STRUCTURE

METHOD FOR FABRICATION OF A CONDUCTIVE BUMP STRUCTURE OF A CIRCUIT...

Conductive connection structure formed on the surface of circuit bo...

Method for Fabricating Circuit Board with Conductive Structure

Conductive structures for electrically conductive pads of circuit b...

Method for fabricating electrically connecting structure of circuit...

Solder ball pad surface finish structure of circuit board and fabri...

Processing apparatus for electroplating conductive bumps on organic...

Conductive bump structure of circuit board and method for forming t...

Conductive bump structure of circuit board and fabrication method t...

Fabrication method of conductive bump structures of circuit board

Fabricating process of an electrically conductive structure on a ci...

Electrical connector structure of circuit board and method for fabr...

Conductive bump structure of circuit board and method for fabricati...

Method for fabricating electrical connection structure of circuit b...

Method for fabricating conductive bump of circuit board

Method for laminating a material layer onto a transparent substrate

Method for forming a single-crystal silicon layer on a transparent...

Method for assembling a scrubber

Auxiliary tool and method for assembling motor assembly to support...

Auxiliary tool for assembling a scrubber

Assembly station for sputter shield assembly