Wen How Sim

Follow

Person

Singapore, SG

People

Patents Applicationslast 30 patents

Information Patent Application
CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER
- Publication number 20240222183
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Ankur Harish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING DIE SLIP DURING GROUP BONDING
- Publication number 20240079358
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Siva Sai Kishore Palli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH SPACERS, INCLUDING SUBSTRATES WITH SOLDER RESIST SP...
- Publication number 20240071975
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...
- Publication number 20230395419
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Ankur Harish Shah
- H01 - BASIC ELECTRIC ELEMENTS