Wen Yu

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Monolithic segmented LED array architecture with islanded epitaxial...
- Patent number 11,961,875
- Issue date Apr 16, 2024
- Lumileds LLC
- Ashish Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic, segmented light emitting diode array
- Patent number 10,957,820
- Issue date Mar 23, 2021
- Lumileds LLC
- Luke Gordon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interconnects and method of manufacture
- Patent number 10,833,013
- Issue date Nov 10, 2020
- MONTEREY RESEARCH, LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interconnects and method of manufacture
- Patent number 10,833,009
- Issue date Nov 10, 2020
- MONTEREY RESEARCH, LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bond pad design to enable different electrical configurations
- Patent number 10,490,719
- Issue date Nov 26, 2019
- LUMILEDS HOLDING B.V.
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing copper using physical vapor deposition
- Patent number 9,728,414
- Issue date Aug 8, 2017
- Cypress Semiconductor Corporation
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium interconnect with high aspect ratio and method of fabrica...
- Patent number 9,299,643
- Issue date Mar 29, 2016
- Cypress Semiconductor Corporation
- Zheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing copper using physical vapor deposition
- Patent number 8,791,018
- Issue date Jul 29, 2014
- Spansion LLC
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device interconnects and method of manufacturing
- Patent number 8,669,597
- Issue date Mar 11, 2014
- Spansion LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming silicides of different thicknesses on different...
- Patent number 8,236,693
- Issue date Aug 7, 2012
- Advanced Micro Devices, Inc.
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact in a semiconductor device with engineer...
- Patent number 8,039,391
- Issue date Oct 18, 2011
- Spansion LLC
- Jinsong Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal-semiconductor films having different thicknesses with...
- Patent number 7,880,221
- Issue date Feb 1, 2011
- Spansion LLC
- Eunha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming metal-semiconductor films having different thicknesses with...
- Patent number 7,482,217
- Issue date Jan 27, 2009
- Spansion LLC
- Eunha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film germanium diode with low reverse breakdown
- Patent number 7,468,296
- Issue date Dec 23, 2008
- Spansion LLC
- Ercan Adem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having a contact structure and method of ma...
- Patent number 7,407,882
- Issue date Aug 5, 2008
- Spansion LLC
- Connie Pin-Chin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 7,319,065
- Issue date Jan 15, 2008
- Advanced Micro Devices, Inc.
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory cell and method of making the memory cell
- Patent number 7,306,988
- Issue date Dec 11, 2007
- Advanced Micro Devices, Inc.
- Steven C. Avanzino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact in a semiconductor device with formatio...
- Patent number 6,927,162
- Issue date Aug 9, 2005
- Advanced Micro Devices, Inc.
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Monolithic Segmented LED Array Architecture With Islanded Epitaxial...
- Publication number 20240194723
- Publication date Jun 13, 2024
- Lumileds LLC
- Ashish Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monolithic Segmented LED Array Architecture With Islanded Epitaxial...
- Publication number 20230154970
- Publication date May 18, 2023
- Lumileds LLC
- Ashish Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Device Interconnects and Method of Manufacture
- Publication number 20210134715
- Publication date May 6, 2021
- MONTEREY RESEARCH, LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Device Interconnects and Method of Manufacture
- Publication number 20200075477
- Publication date Mar 5, 2020
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SEGMENTED LED ARRAY ARCHITECTURE WITH ISLANDED EPITAXIAL...
- Publication number 20190198564
- Publication date Jun 27, 2019
- Lumileds LLC
- Ashish TANDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE ARRAY
- Publication number 20190198716
- Publication date Jun 27, 2019
- Lumileds LLC
- Luke GORDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC SEGMENTED LED ARRAY ARCHITECTURE WITH TRANSPARENT COMMON...
- Publication number 20190189682
- Publication date Jun 20, 2019
- Lumileds LLC
- Erik YOUNG
- F21 - LIGHTING
Information Patent Application
Memory Device Interconnects and Method of Manufacture
- Publication number 20190035723
- Publication date Jan 31, 2019
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BOND PAD DESIGN TO ENABLE DIFFERENT ELECTRICAL CONFIGURATIONS
- Publication number 20180337315
- Publication date Nov 22, 2018
- Lumileds Holding B.V.
- Wen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Device Interconnects and Method of Manufacture
- Publication number 20170092577
- Publication date Mar 30, 2017
- CYPRESS SEMICONDUCTOR CORPORATION
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION
- Publication number 20140377949
- Publication date Dec 25, 2014
- Wen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION
- Publication number 20140377948
- Publication date Dec 25, 2014
- Wen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Device Interconnects and Method of Manufacture
- Publication number 20140151887
- Publication date Jun 5, 2014
- SPANSION LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Device Interconnects and Method of Manufacture
- Publication number 20140145337
- Publication date May 29, 2014
- SPANSION LLC
- Shenqing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ruthenium interconnect with high aspect ratio and method of fabrica...
- Publication number 20100078815
- Publication date Apr 1, 2010
- Zheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE INTERCONNECTS AND METHOD OF MANUFACTURING
- Publication number 20090278173
- Publication date Nov 12, 2009
- Shenqing FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METAL-SEMICONDUCTOR FILMS HAVING DIFFERENT THICKNESSES WITH...
- Publication number 20090140325
- Publication date Jun 4, 2009
- SPANSION LLC
- Eunha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SILICIDES OF DIFFERENT THICKNESSES ON DIFFERENT...
- Publication number 20080286921
- Publication date Nov 20, 2008
- Advanced Micro Devices, Inc.
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of depositing copper using physical vapor deposition
- Publication number 20080146028
- Publication date Jun 19, 2008
- Wen Yu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Monolithic segmented LED array architecture with islanded epitaxial...

Monolithic, segmented light emitting diode array

Memory device interconnects and method of manufacture

Memory device interconnects and method of manufacture

Die bond pad design to enable different electrical configurations

Method of depositing copper using physical vapor deposition

Ruthenium interconnect with high aspect ratio and method of fabrica...

Method of depositing copper using physical vapor deposition

Memory device interconnects and method of manufacturing

Methods of forming silicides of different thicknesses on different...

Method of forming a contact in a semiconductor device with engineer...

Forming metal-semiconductor films having different thicknesses with...

Forming metal-semiconductor films having different thicknesses with...

Thin film germanium diode with low reverse breakdown

Semiconductor component having a contact structure and method of ma...

Semiconductor component and method of manufacture

Memory cell and method of making the memory cell

Method of forming a contact in a semiconductor device with formatio...

Patents Applicationslast 30 patents

Monolithic Segmented LED Array Architecture With Islanded Epitaxial...

Monolithic Segmented LED Array Architecture With Islanded Epitaxial...

Memory Device Interconnects and Method of Manufacture

Memory Device Interconnects and Method of Manufacture

MONOLITHIC SEGMENTED LED ARRAY ARCHITECTURE WITH ISLANDED EPITAXIAL...

LIGHT EMITTING DIODE ARRAY

MONOLITHIC SEGMENTED LED ARRAY ARCHITECTURE WITH TRANSPARENT COMMON...

Memory Device Interconnects and Method of Manufacture

DIE BOND PAD DESIGN TO ENABLE DIFFERENT ELECTRICAL CONFIGURATIONS

Memory Device Interconnects and Method of Manufacture

METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION

METHOD OF DEPOSITING COPPER USING PHYSICAL VAPOR DEPOSITION

Memory Device Interconnects and Method of Manufacture

Memory Device Interconnects and Method of Manufacture

Ruthenium interconnect with high aspect ratio and method of fabrica...

MEMORY DEVICE INTERCONNECTS AND METHOD OF MANUFACTURING

FORMING METAL-SEMICONDUCTOR FILMS HAVING DIFFERENT THICKNESSES WITH...

METHODS OF FORMING SILICIDES OF DIFFERENT THICKNESSES ON DIFFERENT...

Method of depositing copper using physical vapor deposition