Weng F. Yap

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged pressure sensor device
- Patent number 11,427,464
- Issue date Aug 30, 2022
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged pressure sensor device
- Patent number 10,822,224
- Issue date Nov 3, 2020
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Antenna assembly for wafer level packaging
- Patent number 10,319,689
- Issue date Jun 11, 2019
- NXP USA, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 9,786,515
- Issue date Oct 10, 2017
- NXP USA, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-packages containing preassembled surface mount device mod...
- Patent number 9,780,077
- Issue date Oct 3, 2017
- NXP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based system-in-packages having sidewall-mounted surface...
- Patent number 9,761,569
- Issue date Sep 12, 2017
- NSP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic package and stacked assembly thereof
- Patent number 9,698,104
- Issue date Jul 4, 2017
- NXP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packages containing embedded ground plane inter...
- Patent number 9,607,918
- Issue date Mar 28, 2017
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic package assemblies and methods for the fabr...
- Patent number 9,595,509
- Issue date Mar 14, 2017
- NXP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency and electromagnetic interference shielding in wafer...
- Patent number 9,589,909
- Issue date Mar 7, 2017
- NXP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
- Patent number 9,524,950
- Issue date Dec 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages and methods for producing wafer level packages...
- Patent number 9,502,363
- Issue date Nov 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic package and method of fabrication
- Patent number 9,472,528
- Issue date Oct 18, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packages having non-wettable solder collars and methods...
- Patent number 9,401,339
- Issue date Jul 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level packaging method
- Patent number 9,396,999
- Issue date Jul 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded device packages having antennas and related fabrication me...
- Patent number 9,362,234
- Issue date Jun 7, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Eduard J. Pabst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having radio frequency stand-off layers
- Patent number 9,343,414
- Issue date May 17, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with thermal via and method for fabrication t...
- Patent number 9,312,206
- Issue date Apr 12, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and stacked microelectronic packages with package surface c...
- Patent number 9,305,911
- Issue date Apr 5, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic packages having sidewall conductors and met...
- Patent number 9,299,670
- Issue date Mar 29, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having texturized solder pads and methods...
- Patent number 9,281,286
- Issue date Mar 8, 2016
- Freescale Semiconductor Inc.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-packages having vertically-interconnected leaded componen...
- Patent number 9,281,284
- Issue date Mar 8, 2016
- Freescale Semiconductor Inc.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having layered interconnect structures and...
- Patent number 9,281,293
- Issue date Mar 8, 2016
- Freescale Semiconductor Inc.
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level packages containing embedded ground plane inter...
- Patent number 9,257,393
- Issue date Feb 9, 2016
- Freescale Semiconductor Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based system-in-packages having sidewall-mounted surface...
- Patent number 9,257,419
- Issue date Feb 9, 2016
- Freescale Semiconductor Inc.
- Weng F. Yap
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor grid array package
- Patent number 9,209,081
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Fui Yee Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for the production of microelectronic packages having radio...
- Patent number 9,129,981
- Issue date Sep 8, 2015
- Freescale Semiconductor Inc.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having frontside thermal contacts and meth...
- Patent number 9,123,685
- Issue date Sep 1, 2015
- Freescale Semiconductor Inc.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a high thermal conducting semiconductor device pa...
- Patent number 9,029,202
- Issue date May 12, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages containing opposing devices and methods fo...
- Patent number 9,024,429
- Issue date May 5, 2015
- Freescale Semiconductor Inc.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE
- Publication number 20210009405
- Publication date Jan 14, 2021
- NXP USA, Inc.
- Weng Foong YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED PRESSURE SENSOR DEVICE
- Publication number 20190112180
- Publication date Apr 18, 2019
- NXP USA, Inc.
- Weng Foong YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SOLDER BALLS ON TWO SIDES
- Publication number 20170345746
- Publication date Nov 30, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA ASSEMBLY FOR WAFER LEVEL PACKAGING
- Publication number 20170154859
- Publication date Jun 1, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Weng Foong Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGES CONTAINING PREASSEMBLED SURFACE MOUNT DEVICE MOD...
- Publication number 20170077072
- Publication date Mar 16, 2017
- Freescale Semiconductor Inc.
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC PACKAGE ASSEMBLIES AND METHODS FOR THE FABR...
- Publication number 20170069607
- Publication date Mar 9, 2017
- Freescale Semiconductor Inc.
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC PACKAGE AND STACKED ASSEMBLY THEREOF
- Publication number 20160293551
- Publication date Oct 6, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT WAFER LEVEL PACKAGES CONTAINING EMBEDDED GROUND PLANE INTER...
- Publication number 20160118313
- Publication date Apr 28, 2016
- Freescale Semiconductor Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE...
- Publication number 20160111403
- Publication date Apr 21, 2016
- Freescale Semiconductor Inc.
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING TEXTURIZED SOLDER PADS AND METHODS...
- Publication number 20160064341
- Publication date Mar 3, 2016
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING METHOD AND INTEGRATED ELECTRONIC PACKAGE
- Publication number 20160005628
- Publication date Jan 7, 2016
- FREESCAL SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN-PACKAGES HAVING VERTICALLY-INTERCONNECTED LEADED COMPONEN...
- Publication number 20150371960
- Publication date Dec 24, 2015
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION
- Publication number 20150357270
- Publication date Dec 10, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND...
- Publication number 20150348920
- Publication date Dec 3, 2015
- Freescale Semiconductor Inc.
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACAKGES HAVING NON-WETTABLE SOLDER COLLARS AND METHODS...
- Publication number 20150333028
- Publication date Nov 19, 2015
- WENG F. YAP
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...
- Publication number 20150270233
- Publication date Sep 24, 2015
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE...
- Publication number 20150262981
- Publication date Sep 17, 2015
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH THERMAL VIA AND METHOD FOR FABRICATION T...
- Publication number 20150255371
- Publication date Sep 10, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED DEVICE PACKAGES HAVING ANTENNAS AND RELATED FABRICATION ME...
- Publication number 20150194388
- Publication date Jul 9, 2015
- EDUARD J. PABST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR DISSIPATING HEAT FROM A DIE ASSEMBLY
- Publication number 20150187675
- Publication date Jul 2, 2015
- Jinbang TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE C...
- Publication number 20150162310
- Publication date Jun 11, 2015
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND...
- Publication number 20150145108
- Publication date May 28, 2015
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICALLY-MASKED MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRI...
- Publication number 20150137381
- Publication date May 21, 2015
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...
- Publication number 20150115454
- Publication date Apr 30, 2015
- Alan J. Magnus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE...
- Publication number 20150092377
- Publication date Apr 2, 2015
- JASON R. WRIGHT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM-IN-PACKAGES CONTAINING EMBEDDED SURFACE MOUNT DEVICES AND ME...
- Publication number 20150076700
- Publication date Mar 19, 2015
- WENG FOONG YAP
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONIC PACKAGES CONTAINING OPPOSING DEVICES AND METHODS FO...
- Publication number 20150061139
- Publication date Mar 5, 2015
- WENG F. YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRICATION THEREOF
- Publication number 20150014855
- Publication date Jan 15, 2015
- WENG FOONG YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGES HAVING FRONTSIDE THERMAL CONTACTS AND METH...
- Publication number 20150014838
- Publication date Jan 15, 2015
- WENG FOONG YAP
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A HIGH THERMAL CONDUCTING SEMICONDUCTOR DEVICE PA...
- Publication number 20140353816
- Publication date Dec 4, 2014
- Weng Foong YAP
- H01 - BASIC ELECTRIC ELEMENTS

Weng F. Yap

Person

Patents Grantslast 30 patents

Packaged pressure sensor device

Packaged pressure sensor device

Antenna assembly for wafer level packaging

Semiconductor device package and methods of manufacture thereof

System-in-packages containing preassembled surface mount device mod...

Leadframe-based system-in-packages having sidewall-mounted surface...

Integrated electronic package and stacked assembly thereof

Fan-out wafer level packages containing embedded ground plane inter...

Stacked microelectronic package assemblies and methods for the fabr...

Radio frequency and electromagnetic interference shielding in wafer...

Stacked microelectronic packages having sidewall conductors and met...

Wafer level packages and methods for producing wafer level packages...

Integrated electronic package and method of fabrication

Wafer level packages having non-wettable solder collars and methods...

Wafer level packaging method

Shielded device packages having antennas and related fabrication me...

Microelectronic packages having radio frequency stand-off layers

Semiconductor package with thermal via and method for fabrication t...

Devices and stacked microelectronic packages with package surface c...

Stacked microelectronic packages having sidewall conductors and met...

Microelectronic packages having texturized solder pads and methods...

System-in-packages having vertically-interconnected leaded componen...

Microelectronic packages having layered interconnect structures and...

Fan-out wafer level packages containing embedded ground plane inter...

Leadframe-based system-in-packages having sidewall-mounted surface...

Semiconductor grid array package

Methods for the production of microelectronic packages having radio...

Microelectronic packages having frontside thermal contacts and meth...

Method of forming a high thermal conducting semiconductor device pa...

Microelectronic packages containing opposing devices and methods fo...

Patents Applicationslast 30 patents

PACKAGED PRESSURE SENSOR DEVICE

PACKAGED PRESSURE SENSOR DEVICE

INTEGRATED CIRCUIT PACKAGE WITH SOLDER BALLS ON TWO SIDES

ANTENNA ASSEMBLY FOR WAFER LEVEL PACKAGING

SYSTEM-IN-PACKAGES CONTAINING PREASSEMBLED SURFACE MOUNT DEVICE MOD...

STACKED MICROELECTRONIC PACKAGE ASSEMBLIES AND METHODS FOR THE FABR...

INTEGRATED ELECTRONIC PACKAGE AND STACKED ASSEMBLY THEREOF

FAN-OUT WAFER LEVEL PACKAGES CONTAINING EMBEDDED GROUND PLANE INTER...

LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE...

MICROELECTRONIC PACKAGES HAVING TEXTURIZED SOLDER PADS AND METHODS...

WAFER LEVEL PACKAGING METHOD AND INTEGRATED ELECTRONIC PACKAGE

SYSTEM-IN-PACKAGES HAVING VERTICALLY-INTERCONNECTED LEADED COMPONEN...

INTEGRATED ELECTRONIC PACKAGE AND METHOD OF FABRICATION

MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND...

WAFER LEVEL PACAKGES HAVING NON-WETTABLE SOLDER COLLARS AND METHODS...

WAFER LEVEL PACKAGES AND METHODS FOR PRODUCING WAFER LEVEL PACKAGES...

LEADFRAME-BASED SYSTEM-IN-PACKAGES HAVING SIDEWALL-MOUNTED SURFACE...

SEMICONDUCTOR PACKAGE WITH THERMAL VIA AND METHOD FOR FABRICATION T...

SHIELDED DEVICE PACKAGES HAVING ANTENNAS AND RELATED FABRICATION ME...

METHODS AND APPARATUS FOR DISSIPATING HEAT FROM A DIE ASSEMBLY

DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH PACKAGE SURFACE C...

MICROELECTRONIC PACKAGES HAVING RADIOFREQUENCY STAND-OFF LAYERS AND...

OPTICALLY-MASKED MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRI...

MICROELECTRONIC PACKAGES HAVING LAYERED INTERCONNECT STRUCTURES AND...

DEVICES AND STACKED MICROELECTRONIC PACKAGES WITH IN-TRENCH PACKAGE...

SYSTEM-IN-PACKAGES CONTAINING EMBEDDED SURFACE MOUNT DEVICES AND ME...

MICROELECTRONIC PACKAGES CONTAINING OPPOSING DEVICES AND METHODS FO...

MICROELECTRONIC PACKAGES AND METHODS FOR THE FABRICATION THEREOF

MICROELECTRONIC PACKAGES HAVING FRONTSIDE THERMAL CONTACTS AND METH...

METHOD OF FORMING A HIGH THERMAL CONDUCTING SEMICONDUCTOR DEVICE PA...