Werner Pamler

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect arrangement and associated production methods
- Patent number 8,877,631
- Issue date Nov 4, 2014
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a layer arrangement and layer arrangement
- Patent number 7,807,563
- Issue date Oct 5, 2010
- Infineon Technologies AG
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma excited chemical vapor deposition method silicon/oxygen/nitr...
- Patent number 7,755,160
- Issue date Jul 13, 2010
- Infineon Technologies AG
- Zvonimir Gabric
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Layer arrangement
- Patent number 7,422,940
- Issue date Sep 9, 2008
- Infineon Technologies AG
- Gunther Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow structure in an integrated circuit and method for producing...
- Patent number 7,259,441
- Issue date Aug 21, 2007
- Infineon Technologies AG
- Werner Pamler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an electrode configuration and method of electr...
- Patent number 7,045,070
- Issue date May 16, 2006
- Infineon Technologies AG
- Volker Weinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strip conductor arrangement and method for producing a strip conduc...
- Patent number 7,033,926
- Issue date Apr 25, 2006
- Infineon Technologies, AG
- Günther Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement of microstructures
- Patent number 7,023,063
- Issue date Apr 4, 2006
- Infineon Technologies AG
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating microstructures and arrangement of microstru...
- Patent number 6,825,098
- Issue date Nov 30, 2004
- Infineon Technologies AG
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a component, and component having a metal la...
- Patent number 6,737,692
- Issue date May 18, 2004
- Infineon Technologies AG
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with at least two metal structures deposited thereon, and...
- Patent number 6,686,643
- Issue date Feb 3, 2004
- Infineon Technologies AG
- Siegfried Schwarzl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fastening a first substrate on a second substrate and em...
- Patent number 5,626,279
- Issue date May 6, 1997
- Siemens Aktiengesellschaft
- Werner Pamler
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Interconnect arrangement and associated production methods
- Publication number 20110217839
- Publication date Sep 8, 2011
- Manfred ENGELHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Excited Chemical Vapor Deposition Method Silicon/Oxygen/Nitr...
- Publication number 20080308898
- Publication date Dec 18, 2008
- Zvonimir Gabric
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing a layer arrangement and layer arrangement
- Publication number 20070246831
- Publication date Oct 25, 2007
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor track arrangement and associated production method
- Publication number 20070120263
- Publication date May 31, 2007
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect arrangement and associated production methods
- Publication number 20060199368
- Publication date Sep 7, 2006
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layer arrangement
- Publication number 20060022345
- Publication date Feb 2, 2006
- Infineon Technologies AG
- Gunther Schindler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating microstructures and arrangement of microstru...
- Publication number 20050054184
- Publication date Mar 10, 2005
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow structure in an integrated circuit and method for producing...
- Publication number 20040084749
- Publication date May 6, 2004
- Werner Pamler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating microstructures and arrangement of microstru...
- Publication number 20040033652
- Publication date Feb 19, 2004
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a component, and component having a metal la...
- Publication number 20030157798
- Publication date Aug 21, 2003
- Zvonimir Gabric
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with at least two metal structures disposed thereon, and...
- Publication number 20010002732
- Publication date Jun 7, 2001
- Siegfried Schwarzl
- H01 - BASIC ELECTRIC ELEMENTS

Werner Pamler

Person

Patents Grantslast 30 patents

Interconnect arrangement and associated production methods

Method for manufacturing a layer arrangement and layer arrangement

Plasma excited chemical vapor deposition method silicon/oxygen/nitr...

Layer arrangement

Hollow structure in an integrated circuit and method for producing...

Method of producing an electrode configuration and method of electr...

Strip conductor arrangement and method for producing a strip conduc...

Arrangement of microstructures

Method for fabricating microstructures and arrangement of microstru...

Method for fabricating a component, and component having a metal la...

Substrate with at least two metal structures deposited thereon, and...

Method for fastening a first substrate on a second substrate and em...

Patents Applicationslast 30 patents

Interconnect arrangement and associated production methods

Plasma Excited Chemical Vapor Deposition Method Silicon/Oxygen/Nitr...

Method for manufacturing a layer arrangement and layer arrangement

Conductor track arrangement and associated production method

Interconnect arrangement and associated production methods

Layer arrangement

Method for fabricating microstructures and arrangement of microstru...

Hollow structure in an integrated circuit and method for producing...

Method for fabricating microstructures and arrangement of microstru...

Method for fabricating a component, and component having a metal la...

Substrate with at least two metal structures disposed thereon, and...