WILFRED GOMES

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layered optical integrated circuit assembly with a monocrysta...
- Patent number 12,197,007
- Issue date Jan 14, 2025
- Intel Corporation
- Abhishek A. Sharma
- G02 - OPTICS
Information Patent Grant
Three-dimensional capacitors with double metal electrodes
- Patent number 12,176,147
- Issue date Dec 24, 2024
- Intel Corporation
- James D. Waldemer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrating photonic and electronic compon...
- Patent number 12,147,083
- Issue date Nov 19, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrays of double-sided dram cells including capacitors on the front...
- Patent number 12,120,865
- Issue date Oct 15, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory arrays with layer selector transistors
- Patent number 12,114,479
- Issue date Oct 8, 2024
- Intel Corporation
- Wilfred Gomes
- G11 - INFORMATION STORAGE
Information Patent Grant
Hyperchip
- Patent number 12,074,138
- Issue date Aug 27, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional nanoribbon-based dynamic random-access memory
- Patent number 12,058,849
- Issue date Aug 6, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 11,984,430
- Issue date May 14, 2024
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on active silicon semiconductor packages
- Patent number 11,978,727
- Issue date May 7, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with three-dimensional (3D) monolithic memo...
- Patent number 11,901,347
- Issue date Feb 13, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed semiconductor die and package architecture
- Patent number 11,894,359
- Issue date Feb 6, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing inductor structures
- Patent number 11,830,829
- Issue date Nov 28, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hyperchip
- Patent number 11,824,041
- Issue date Nov 21, 2023
- Intel Corporation
- Mark T. Bohr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing for integrated circuit devices and assemblies
- Patent number 11,817,442
- Issue date Nov 14, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid manufacturing of microeletronic assemblies with first and se...
- Patent number 11,756,886
- Issue date Sep 12, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, method and system for providing a stacked arrangement of in...
- Patent number 11,749,663
- Issue date Sep 5, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor based memory cells on both sides of a layer of...
- Patent number 11,690,211
- Issue date Jun 27, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die interconnection scheme for providing a high yielding process fo...
- Patent number 11,652,060
- Issue date May 16, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bridge hub tiling architecture
- Patent number 11,569,173
- Issue date Jan 31, 2023
- Intel Corporation
- Andrew P. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing inductor structures
- Patent number 11,387,198
- Issue date Jul 12, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, method and system for providing a stacked arrangement of in...
- Patent number 11,373,987
- Issue date Jun 28, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with back-side contacts to create three dimensional mem...
- Patent number 11,335,686
- Issue date May 17, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed semiconductor die and package architecture
- Patent number 11,257,804
- Issue date Feb 22, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional nanoribbon-based dynamic random-access memory
- Patent number 11,257,822
- Issue date Feb 22, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor based memory cells on both sides of a layer of...
- Patent number 11,239,238
- Issue date Feb 1, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory arrays with layer selector transistors
- Patent number 11,139,300
- Issue date Oct 5, 2021
- Intel Corporation
- Wilfred Gomes
- G11 - INFORMATION STORAGE
Information Patent Grant
Functionally redundant semiconductor dies and package
- Patent number 11,127,712
- Issue date Sep 21, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional nanoribbon-based static random-access memory
- Patent number 11,087,832
- Issue date Aug 10, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID MANUFACTURING FOR INTEGRATING PHOTONIC AND ELECTRONIC COMPON...
- Publication number 20250020873
- Publication date Jan 16, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL FLOATING BODY MEMORY
- Publication number 20250008723
- Publication date Jan 2, 2025
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL WITH TRANSISTOR HAVING INCREASED LEAKAGE CURRENT
- Publication number 20240431092
- Publication date Dec 26, 2024
- Intel Corporation
- Abhishek A. Sharma
Information Patent Application
MEMORY WITH ONE ACCESS TRANSISTOR COUPLED TO MULTIPLE CAPACITORS
- Publication number 20240431117
- Publication date Dec 26, 2024
- Intel Corporation
- Abhishek A. Sharma
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH CONDUCTIVE LINES EXTENDING OVER SCR...
- Publication number 20240429162
- Publication date Dec 26, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS
- Publication number 20240389300
- Publication date Nov 21, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPERCHIP
- Publication number 20240243099
- Publication date Jul 18, 2024
- Intel Corporation
- Mark T. BOHR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REG...
- Publication number 20240222321
- Publication date Jul 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REG...
- Publication number 20240222326
- Publication date Jul 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR INCLUDING WIDE BAND GAP MATERIALS
- Publication number 20240222438
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR IN A SILICON CARBIDE LAYER AND A TRANSISTOR IN A GALLIUM...
- Publication number 20240222469
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING ROUTING ACROSS LAYERS OF CHANN...
- Publication number 20240222271
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL SHARED GATE HIGH-DRIV...
- Publication number 20240222520
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING A LAYER OF SILICON CARBIDE WITH AN ADJACENT LAYER
- Publication number 20240222435
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING TWO-TRANSISTOR GAIN CELL
- Publication number 20240221821
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- G11 - INFORMATION STORAGE
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING TWO-LEVEL MEMORY
- Publication number 20240224488
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE INTERCONNECTS FOR STITCHED DIES
- Publication number 20240222272
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS
- Publication number 20240222276
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REG...
- Publication number 20240222328
- Publication date Jul 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20240222347
- Publication date Jul 4, 2024
- Intel Corporation
- Sagar Suthram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM-ACCESS MEMORY USING WIDE BAND GAP MATERIALS
- Publication number 20240224504
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING BIT-COST SCALING WITH RELAXED...
- Publication number 20240224508
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR S...
- Publication number 20240224536
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
Information Patent Application
DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIU...
- Publication number 20240222228
- Publication date Jul 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE POWER DELIVERY AND SI...
- Publication number 20240215222
- Publication date Jun 27, 2024
- Intel Corporation
- Abhishek Anil SHARMA
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS
- Publication number 20240215256
- Publication date Jun 27, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN SEMI-METALS FOR LOW TEMPERATURE CONDUCTION
- Publication number 20240113025
- Publication date Apr 4, 2024
- Intel Corporation
- Abhishek Anil SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIM PATTERNING FOR FORMING ANGLED TRANSISTORS
- Publication number 20240105798
- Publication date Mar 28, 2024
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS
- Publication number 20240105860
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...
- Publication number 20240105584
- Publication date Mar 28, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS

WILFRED GOMES

Person

Patents Grantslast 30 patents

Multi-layered optical integrated circuit assembly with a monocrysta...

Three-dimensional capacitors with double metal electrodes

Integrated circuit assemblies with direct chip attach to circuit bo...

Hybrid manufacturing for integrating photonic and electronic compon...

Gallium nitride (GAN) three-dimensional integrated circuit technology

Arrays of double-sided dram cells including capacitors on the front...

Three-dimensional memory arrays with layer selector transistors

Hyperchip

Three-dimensional nanoribbon-based dynamic random-access memory

Hyperchip

Package on active silicon semiconductor packages

Microelectronic package with three-dimensional (3D) monolithic memo...

Distributed semiconductor die and package architecture

Device, system and method for providing inductor structures

Hyperchip

Hybrid manufacturing for integrated circuit devices and assemblies

Hybrid manufacturing of microeletronic assemblies with first and se...

Device, method and system for providing a stacked arrangement of in...

Thin film transistor based memory cells on both sides of a layer of...

Die interconnection scheme for providing a high yielding process fo...

Bridge hub tiling architecture

Device, system and method for providing inductor structures

Device, method and system for providing a stacked arrangement of in...

Transistors with back-side contacts to create three dimensional mem...

Distributed semiconductor die and package architecture

Three-dimensional nanoribbon-based dynamic random-access memory

Thin film transistor based memory cells on both sides of a layer of...

Three-dimensional memory arrays with layer selector transistors

Functionally redundant semiconductor dies and package

Three-dimensional nanoribbon-based static random-access memory

Patents Applicationslast 30 patents

HYBRID MANUFACTURING FOR INTEGRATING PHOTONIC AND ELECTRONIC COMPON...

THREE-DIMENSIONAL FLOATING BODY MEMORY

MEMORY CELL WITH TRANSISTOR HAVING INCREASED LEAKAGE CURRENT

MEMORY WITH ONE ACCESS TRANSISTOR COUPLED TO MULTIPLE CAPACITORS

INTEGRATED CIRCUIT DEVICES WITH CONDUCTIVE LINES EXTENDING OVER SCR...

THREE-DIMENSIONAL MEMORY ARRAYS WITH LAYER SELECTOR TRANSISTORS

HYPERCHIP

PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REG...

PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REG...

TRANSISTOR INCLUDING WIDE BAND GAP MATERIALS

TRANSISTOR IN A SILICON CARBIDE LAYER AND A TRANSISTOR IN A GALLIUM...

INTEGRATED CIRCUIT STRUCTURES HAVING ROUTING ACROSS LAYERS OF CHANN...

INTEGRATED CIRCUIT STRUCTURES HAVING VERTICAL SHARED GATE HIGH-DRIV...

COUPLING A LAYER OF SILICON CARBIDE WITH AN ADJACENT LAYER

INTEGRATED CIRCUIT STRUCTURES HAVING TWO-TRANSISTOR GAIN CELL

INTEGRATED CIRCUIT STRUCTURES HAVING TWO-LEVEL MEMORY

DOUBLE INTERCONNECTS FOR STITCHED DIES

INTEGRATED CIRCUIT STRUCTURES HAVING LOOKUP TABLE DECODERS FOR FPGAS

PACKAGE ARCHITECTURE WITH MEMORY CHIPS HAVING DIFFERENT PROCESS REG...

MODULAR MEMORY BLOCKS FOR INTEGRATED CIRCUIT DEVICES

DYNAMIC RANDOM-ACCESS MEMORY USING WIDE BAND GAP MATERIALS

INTEGRATED CIRCUIT STRUCTURES HAVING BIT-COST SCALING WITH RELAXED...

INTEGRATED CIRCUIT STRUCTURES HAVING LAYER SELECT TRANSISTORS FOR S...

DEVICES IN A SILICON CARBIDE LAYER COUPLED WITH DEVICES IN A GALLIU...

INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE POWER DELIVERY AND SI...

INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE CAPACITORS

ULTRA-THIN SEMI-METALS FOR LOW TEMPERATURE CONDUCTION

TRIM PATTERNING FOR FORMING ANGLED TRANSISTORS

LOW TEMPERATURE VARACTORS USING VARIABLE CAPACITANCE MATERIALS

BURIED VIA THROUGH FRONT-SIDE AND BACK-SIDE METALLIZATION LAYERS WI...