Will Kiang WONG

Person

Daly City, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optoelectronic package
- Patent number 9,899,794
- Issue date Feb 20, 2018
- Texas Instruments Incorporated
- Will Kiang Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin foil semiconductor package
- Patent number 8,857,047
- Issue date Oct 14, 2014
- Texas Instruments Incorporated
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil plating for semiconductor packaging
- Patent number 8,747,640
- Issue date Jun 10, 2014
- Texas Instruments Incorporated
- Jaime Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Micro surface mount device packaging
- Patent number 8,450,151
- Issue date May 28, 2013
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil plating for semiconductor packaging
- Patent number 8,377,267
- Issue date Feb 19, 2013
- National Semiconductor Corporation
- Jaime A. Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of making foil based semiconductor package
- Patent number 8,375,577
- Issue date Feb 19, 2013
- National Semiconductor Corporation
- Will Wong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin foil semiconductor package
- Patent number 8,341,828
- Issue date Jan 1, 2013
- National Semiconductor Corporation
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and leadframe for packaging integrated circuits
- Patent number 8,298,871
- Issue date Oct 30, 2012
- National Semiconductor Corporation
- Will K. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil based semiconductor package
- Patent number 8,101,470
- Issue date Jan 24, 2012
- National Semiconductor Corporation
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin foil semiconductor package
- Patent number 7,836,586
- Issue date Nov 23, 2010
- National Semiconductor Corporation
- Jaime A. Bayan
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Duty cycle correction circuit with small duty error and wide freque...
- Patent number 7,705,649
- Issue date Apr 27, 2010
- National Semiconductor Corporation
- Hao Yu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Fast settling reference voltage buffer with wide reference range
- Patent number 7,639,059
- Issue date Dec 29, 2009
- National Semiconductor Corporation
- Hao Yu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Pipeline ADC using multiplying DAC and analog delay circuits
- Patent number 7,187,318
- Issue date Mar 6, 2007
- National Semiconductor Corporation
- Bumha Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Algorithmic analog-to-digital converter with reduced differential n...
- Patent number 6,097,326
- Issue date Aug 1, 2000
- National Semiconductor Corporation
- Ion E. Opris
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Split capacitor array for digital-to-analog signal conversion
- Patent number 5,889,486
- Issue date Mar 30, 1999
- National Semiconductor Corporation
- Ion E. Opris
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Efficient architecture for correcting component mismatches and circ...
- Patent number 5,638,071
- Issue date Jun 10, 1997
- National Semiconductor Corporation
- Peter D. Capofreddi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High-sensitivity high-resolution comparator
- Patent number 5,416,369
- Issue date May 16, 1995
- National Semiconductor Corporation
- Edison Fong
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC PACKAGE
- Publication number 20150380895
- Publication date Dec 31, 2015
- TEXAS INSTRUMENTS INCORPORATED
- WILL KIANG WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO SURFACE MOUNT DEVICE PACKAGING
- Publication number 20130127043
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO SURFACE MOUNT DEVICE PACKAGING
- Publication number 20130127044
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Foil Plating for Semiconductor Packaging
- Publication number 20130026043
- Publication date Jan 31, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jaime Bayan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Thin Foil Semiconductor Package
- Publication number 20130019469
- Publication date Jan 24, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE PACKAGE AND METHOD
- Publication number 20120326300
- Publication date Dec 27, 2012
- National Semiconductor Corporation
- Tao FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS
- Publication number 20120074561
- Publication date Mar 29, 2012
- National Semiconductor Corporation
- Nghia T. TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS
- Publication number 20110269269
- Publication date Nov 3, 2011
- National Semiconductor Corporation
- Nghia T. TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20110104854
- Publication date May 5, 2011
- National Semiconductor Corporation
- Will K. Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL BASED SEMICONDUCTOR PACKAGE
- Publication number 20110074003
- Publication date Mar 31, 2011
- National Semiconductor Corporation
- Anindya PODDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL PLATING FOR SEMICONDUCTOR PACKAGING
- Publication number 20110073481
- Publication date Mar 31, 2011
- National Semiconductor Corporation
- Jaime A. BAYAN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN FOIL SEMICONDUCTOR PACKAGE
- Publication number 20110023293
- Publication date Feb 3, 2011
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS
- Publication number 20100084748
- Publication date Apr 8, 2010
- National Semiconductor Corporation
- Anindya PODDAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FOIL SEMICONDUCTOR PACKAGE
- Publication number 20100046188
- Publication date Feb 25, 2010
- National Semiconductor Corporation
- Jaime A. BAYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOIL BASED SEMICONDUCTOR PACKAGE
- Publication number 20090305076
- Publication date Dec 10, 2009
- National Semiconductor Corporation
- Will Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20090160039
- Publication date Jun 25, 2009
- National Semiconductor Corporation
- Will K. WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING INTEGRATED CIRCUITS
- Publication number 20080290482
- Publication date Nov 27, 2008
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GANG FLIPPING FOR FLIP-CHIP PACKAGING
- Publication number 20080241991
- Publication date Oct 2, 2008
- National Semiconductor Corporation
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Will Kiang WONG

Person

Patents Grantslast 30 patents

Optoelectronic package

Thin foil semiconductor package

Foil plating for semiconductor packaging

Micro surface mount device packaging

Foil plating for semiconductor packaging

Method of making foil based semiconductor package

Thin foil semiconductor package

Method and leadframe for packaging integrated circuits

Foil based semiconductor package

Thin foil semiconductor package

Duty cycle correction circuit with small duty error and wide freque...

Fast settling reference voltage buffer with wide reference range

Pipeline ADC using multiplying DAC and analog delay circuits

Algorithmic analog-to-digital converter with reduced differential n...

Split capacitor array for digital-to-analog signal conversion

Efficient architecture for correcting component mismatches and circ...

High-sensitivity high-resolution comparator

Patents Applicationslast 30 patents

OPTOELECTRONIC PACKAGE

MICRO SURFACE MOUNT DEVICE PACKAGING

MICRO SURFACE MOUNT DEVICE PACKAGING

Foil Plating for Semiconductor Packaging

Thin Foil Semiconductor Package

LOW PROFILE PACKAGE AND METHOD

BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS

LASER ABLATION ALTERNATIVE TO LOW COST LEADFRAME PROCESS

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

FOIL BASED SEMICONDUCTOR PACKAGE

FOIL PLATING FOR SEMICONDUCTOR PACKAGING

THIN FOIL SEMICONDUCTOR PACKAGE

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

THIN FOIL SEMICONDUCTOR PACKAGE

FOIL BASED SEMICONDUCTOR PACKAGE

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

METHOD OF PACKAGING INTEGRATED CIRCUITS

GANG FLIPPING FOR FLIP-CHIP PACKAGING