William Francis Landers

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Embedded microstrip transmission line
- Patent number 12,166,260
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Isaac Lauer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Embedded microstrip transmission line
- Patent number 11,469,485
- Issue date Oct 11, 2022
- International Business Machines Corporation
- Isaac Lauer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Microfluidic chips with one or more vias
- Patent number 11,458,474
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Joshua T. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Three dimensional organic or glass interposer
- Patent number 9,490,197
- Issue date Nov 8, 2016
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for making crack stop for 3D integrated circuits
- Patent number 9,059,167
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for making crack stop for 3D integrated circuits
- Patent number 8,859,390
- Issue date Oct 14, 2014
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV pillar as an interconnecting structure
- Patent number 8,691,691
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment marks to enable 3D integration
- Patent number 8,546,961
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit design checking for three dimensional chip technology
- Patent number 8,386,977
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method to improve current-carrying capabilities of C4...
- Patent number 8,367,543
- Issue date Feb 5, 2013
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced electromigration resistance in TSV structure and design
- Patent number 8,288,270
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced electromigration resistance in TSV structure and design
- Patent number 8,237,288
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating last level copper-to-C4 connection with inte...
- Patent number 7,863,183
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for producing multiple size interconnections
- Patent number 7,714,452
- Issue date May 11, 2010
- International Business Machines Corporation
- Lawrence A. Clevenger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strengthening of a structure by infiltration
- Patent number 7,678,673
- Issue date Mar 16, 2010
- International Business Machines Corporation
- Elbert Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for ultra narrow crack stop for multilevel sem...
- Patent number 7,544,602
- Issue date Jun 9, 2009
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for producing multiple size interconnections
- Patent number 7,312,529
- Issue date Dec 25, 2007
- International Business Machines Corporation
- Lawrence Clevenger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a wire bond pad with Ni/Au metallization
- Patent number 7,294,565
- Issue date Nov 13, 2007
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-functional structure for enhanced chip manufacturibility and...
- Patent number 7,098,676
- Issue date Aug 29, 2006
- International Business Machines Corporation
- William F. Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-k interlevel dielectric layer (ILD)
- Patent number 7,009,280
- Issue date Mar 7, 2006
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Unique feature design enabling structural integrity for advanced lo...
- Patent number 6,815,346
- Issue date Nov 9, 2004
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unique feature design enabling structural integrity for advanced lo...
- Patent number 6,650,010
- Issue date Nov 18, 2003
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of removing CMP scratches by BPSG reflow and integrated cir...
- Patent number 6,413,870
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezo-actuated CMP carrier
- Patent number 6,325,696
- Issue date Dec 4, 2001
- International Business Machines Corporation
- Karl E. Boggs
- B24 - GRINDING POLISHING
Information Patent Grant
Regeneration of chemical mechanical polishing pads in-situ
- Patent number 6,296,717
- Issue date Oct 2, 2001
- International Business Machines Corporation
- Adam D. Ticknor
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for mapping scratches in an oxide film
- Patent number 6,291,833
- Issue date Sep 18, 2001
- International Business Machines Corporation
- William Francis Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined chemical mechanical polishing and reactive ion etching pro...
- Patent number 6,221,775
- Issue date Apr 24, 2001
- International Business Machines Corp.
- Thomas G. Ference
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling polishing of integrated circui...
- Patent number 6,102,776
- Issue date Aug 15, 2000
- International Business Machines Corporation
- Karl E. Boggs
- B24 - GRINDING POLISHING
Information Patent Grant
Method for mapping scratches in an oxide film
- Patent number 6,048,745
- Issue date Apr 11, 2000
- International Business Machines Corporation
- William Francis Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for preventing settlement of particles on a chemi...
- Patent number 5,968,841
- Issue date Oct 19, 1999
- International Business Machines Corporation
- William Francis Landers
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED MICROSTRIP TRANSMISSION LINE
- Publication number 20220416392
- Publication date Dec 29, 2022
- International Business Machines Corporation
- Isaac Lauer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROFLUIDIC CHIPS WITH ONE OR MORE VIAS
- Publication number 20220362774
- Publication date Nov 17, 2022
- International Business Machines Corporation
- Joshua T. Smith
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED MICROSTRIP TRANSMISSION LINE
- Publication number 20220123449
- Publication date Apr 21, 2022
- International Business Machines Corporation
- Isaac Lauer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROFLUIDIC CHIPS WITH ONE OR MORE VIAS
- Publication number 20190224679
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Joshua T. Smith
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
THREE DIMENSIONAL ORGANIC OR GLASS INTERPOSER
- Publication number 20160141237
- Publication date May 19, 2016
- International Business Machines Corporation
- Mukta G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...
- Publication number 20150097274
- Publication date Apr 9, 2015
- International Business Machines Corporation
- Christopher Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...
- Publication number 20150069608
- Publication date Mar 12, 2015
- International Business Machines Corporation
- Christopher Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS
- Publication number 20140339703
- Publication date Nov 20, 2014
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TSV PILLAR AS AN INTERCONNECTING STRUCTURE
- Publication number 20130026606
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT DESIGN CHECKING FOR THREE DIMENSIONAL CHIP TECHNOLOGY
- Publication number 20120304138
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENHANCED ELECTROMIGRATION RESISTANCE IN TSV STRUCTURE AND DESIGN
- Publication number 20120199975
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED ELECTROMIGRATION RESISTANCE IN TSV STRUCTURE AND DESIGN
- Publication number 20120199983
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARKS TO ENABLE 3D INTEGRATION
- Publication number 20120175789
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS
- Publication number 20110193197
- Publication date Aug 11, 2011
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRENGTHENING OF A STRUCTURE BY INFILTRATION
- Publication number 20090035480
- Publication date Feb 5, 2009
- International Business Machines Corporation
- Elbert Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR ULTRA NARROW CRACK STOP FOR MULTILEVEL SEM...
- Publication number 20080237868
- Publication date Oct 2, 2008
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHIP TO PACKAGE INTERCONNECT
- Publication number 20080160752
- Publication date Jul 3, 2008
- International Business Machines Corporation
- Lawrence Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION
- Publication number 20080073790
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR PRODUCING MULTIPLE SIZE INTERCONNECTIONS
- Publication number 20070290345
- Publication date Dec 20, 2007
- Lawrence A. Clevenger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STRUCTURE AND METHOD TO IMPROVE CURRENT-CARRYING CAPABILITIES OF C4...
- Publication number 20070222073
- Publication date Sep 27, 2007
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING LAST LEVEL COPPER-TO-C4 CONNECTION WITH INTE...
- Publication number 20070166992
- Publication date Jul 19, 2007
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTORS AND METHODS OF MAKING
- Publication number 20070080455
- Publication date Apr 12, 2007
- International Business Machines Corporation
- Donna S. Zupanski-Nielsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR PRODUCING MULTIPLE SIZE INTERCONNECTIONS
- Publication number 20070007665
- Publication date Jan 11, 2007
- Interantional Business Machines Corporation
- Lawrence Clevenger
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LOW-K INTERLEVEL DIELECTRIC LAYER (ILD) AND METHOD
- Publication number 20050242414
- Publication date Nov 3, 2005
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Novel integration of wire bond pad with Ni/Au metallization
- Publication number 20050074959
- Publication date Apr 7, 2005
- International Business Machines Corporation
- Lloyd G. Burrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-functional structure for enhanced chip manufacturibility & re...
- Publication number 20040129938
- Publication date Jul 8, 2004
- International Business Machines Corporation
- William F. Landers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Unique feature design enabling structural integrity for advanced lo...
- Publication number 20030197280
- Publication date Oct 23, 2003
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIQUE FEATURE DESIGN ENABLING STRUCTURAL INTEGRITY FOR ADVANCED LO...
- Publication number 20030155642
- Publication date Aug 21, 2003
- International Business Machines Corporation
- Charles R. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MAPPING SCRATCHES IN AN OXIDE FILM
- Publication number 20010013606
- Publication date Aug 16, 2001
- WILLIAM FRANCIS LANDERS
- H01 - BASIC ELECTRIC ELEMENTS

William Francis Landers

Person

Patents Grantslast 30 patents

Embedded microstrip transmission line

Embedded microstrip transmission line

Microfluidic chips with one or more vias

Three dimensional organic or glass interposer

Structure and method for making crack stop for 3D integrated circuits

Structure and method for making crack stop for 3D integrated circuits

TSV pillar as an interconnecting structure

Alignment marks to enable 3D integration

Circuit design checking for three dimensional chip technology

Structure and method to improve current-carrying capabilities of C4...

Enhanced electromigration resistance in TSV structure and design

Enhanced electromigration resistance in TSV structure and design

Method for fabricating last level copper-to-C4 connection with inte...

Structure and method for producing multiple size interconnections

Strengthening of a structure by infiltration

Method and structure for ultra narrow crack stop for multilevel sem...

Structure and method for producing multiple size interconnections

Method of fabricating a wire bond pad with Ni/Au metallization

Multi-functional structure for enhanced chip manufacturibility and...

Low-k interlevel dielectric layer (ILD)

Unique feature design enabling structural integrity for advanced lo...

Unique feature design enabling structural integrity for advanced lo...

Process of removing CMP scratches by BPSG reflow and integrated cir...

Piezo-actuated CMP carrier

Regeneration of chemical mechanical polishing pads in-situ

Apparatus for mapping scratches in an oxide film

Combined chemical mechanical polishing and reactive ion etching pro...

Apparatus and method for controlling polishing of integrated circui...

Method for mapping scratches in an oxide film

Device and method for preventing settlement of particles on a chemi...

Patents Applicationslast 30 patents

EMBEDDED MICROSTRIP TRANSMISSION LINE

MICROFLUIDIC CHIPS WITH ONE OR MORE VIAS

EMBEDDED MICROSTRIP TRANSMISSION LINE

MICROFLUIDIC CHIPS WITH ONE OR MORE VIAS

THREE DIMENSIONAL ORGANIC OR GLASS INTERPOSER

THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...

THROUGH-SILICON VIA STRUCTURE AND METHOD FOR IMPROVING BEOL DIELECT...

STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS

TSV PILLAR AS AN INTERCONNECTING STRUCTURE

CIRCUIT DESIGN CHECKING FOR THREE DIMENSIONAL CHIP TECHNOLOGY

ENHANCED ELECTROMIGRATION RESISTANCE IN TSV STRUCTURE AND DESIGN

ENHANCED ELECTROMIGRATION RESISTANCE IN TSV STRUCTURE AND DESIGN

ALIGNMENT MARKS TO ENABLE 3D INTEGRATION

STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS

STRENGTHENING OF A STRUCTURE BY INFILTRATION

METHOD AND STRUCTURE FOR ULTRA NARROW CRACK STOP FOR MULTILEVEL SEM...

METHOD FOR CHIP TO PACKAGE INTERCONNECT

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

STRUCTURE AND METHOD FOR PRODUCING MULTIPLE SIZE INTERCONNECTIONS

STRUCTURE AND METHOD TO IMPROVE CURRENT-CARRYING CAPABILITIES OF C4...

METHOD FOR FABRICATING LAST LEVEL COPPER-TO-C4 CONNECTION WITH INTE...

SEMICONDUCTORS AND METHODS OF MAKING

STRUCTURE AND METHOD FOR PRODUCING MULTIPLE SIZE INTERCONNECTIONS

LOW-K INTERLEVEL DIELECTRIC LAYER (ILD) AND METHOD

Novel integration of wire bond pad with Ni/Au metallization

Multi-functional structure for enhanced chip manufacturibility & re...

Unique feature design enabling structural integrity for advanced lo...

UNIQUE FEATURE DESIGN ENABLING STRUCTURAL INTEGRITY FOR ADVANCED LO...

APPARATUS FOR MAPPING SCRATCHES IN AN OXIDE FILM