William H. Speece

Person

Palm Bay, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonded substrate for an integrated circuit containing a planar intr...
- Patent number 7,052,973
- Issue date May 30, 2006
- Intersil Americas Inc.
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded substrate for an integrated circuit containing a planar intr...
- Patent number 6,825,532
- Issue date Nov 30, 2004
- Intersil Americas Inc.
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a bonded substrate containing a planar intrinsic...
- Patent number 6,255,195
- Issue date Jul 3, 2001
- Intersil Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing
- Patent number 5,728,624
- Issue date Mar 17, 1998
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing
- Patent number 5,517,047
- Issue date May 14, 1996
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI CMOS device having body extension for providing sidewall channe...
- Patent number H1435
- Issue date May 2, 1995
- Richard D. Cherne
- 257 - Active solid-state devices
Information Patent Grant
Selective recrystallization to reduce P-channel transistor leakage...
- Patent number 5,391,903
- Issue date Feb 21, 1995
- Harris Corporation
- Kurt Strater
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing
- Patent number 5,362,667
- Issue date Nov 8, 1994
- Harris Corporation
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective recrystallization to reduce P-channel transistor leakage...
- Patent number 5,298,434
- Issue date Mar 29, 1994
- Harris Corporation
- Kurt Strater
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOT CMOS device having differentially doped body extension for prov...
- Patent number 5,293,052
- Issue date Mar 8, 1994
- Harris Corporation
- Richard D. Cherne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bonded substrate for an integrated circuit containing a planar intr...
- Publication number 20040180512
- Publication date Sep 16, 2004
- INTERSIL AMERICAS INC.
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a bonded substrate containing a planar intrinsic...
- Publication number 20010016399
- Publication date Aug 23, 2001
- HARRIS CORPORATION
- Jack H. Linn
- H01 - BASIC ELECTRIC ELEMENTS

William H. Speece

Person

Patents Grantslast 30 patents

Bonded substrate for an integrated circuit containing a planar intr...

Bonded substrate for an integrated circuit containing a planar intr...

Method for forming a bonded substrate containing a planar intrinsic...

Bonded wafer processing

Bonded wafer processing

SOI CMOS device having body extension for providing sidewall channe...

Selective recrystallization to reduce P-channel transistor leakage...

Bonded wafer processing

Selective recrystallization to reduce P-channel transistor leakage...

SOT CMOS device having differentially doped body extension for prov...

Patents Applicationslast 30 patents

Bonded substrate for an integrated circuit containing a planar intr...

Method for forming a bonded substrate containing a planar intrinsic...