William Mark Hiatt

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microfeature workpieces and methods for forming interconnects in mi...
- Patent number 12,014,958
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfeature workpieces and methods for forming interconnects in mi...
- Patent number 11,476,160
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for filling vias in microelectr...
- Patent number 11,177,175
- Issue date Nov 16, 2021
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising nickel— and copper—containing inte...
- Patent number 10,446,440
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Salman Akram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor devices comprising nickel- and copper-containing inte...
- Patent number 10,062,608
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for forming apertures in microfeature workpieces
- Patent number 10,010,977
- Issue date Jul 3, 2018
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 9,737,947
- Issue date Aug 22, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices and methods for filling vias in microelectr...
- Patent number 9,653,420
- Issue date May 16, 2017
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnects and semiconductor structures
- Patent number 9,640,433
- Issue date May 2, 2017
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Disabling electrical connections using pass-through 3D interconnect...
- Patent number 9,607,930
- Issue date Mar 28, 2017
- Micron Technologies, Inc.
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for forming apertures in microfeature workpieces
- Patent number 9,452,492
- Issue date Sep 27, 2016
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disabling electrical connections using pass-through 3D interconnect...
- Patent number 9,343,368
- Issue date May 17, 2016
- Micron Technology, Inc.
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-component integrated circuit contacts
- Patent number 9,337,162
- Issue date May 10, 2016
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaged microelectronic imagers having interconnects f...
- Patent number 8,816,463
- Issue date Aug 26, 2014
- Round Rock Research, LLC
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Disabling electrical connections using pass-through 3D interconnect...
- Patent number 8,772,086
- Issue date Jul 8, 2014
- Micron Technology, Inc.
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and methods for filing vias in microelectro...
- Patent number 8,748,311
- Issue date Jun 10, 2014
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged microelectronic imagers and methods of packaging microelec...
- Patent number 8,703,518
- Issue date Apr 22, 2014
- Micron Technology, Inc.
- Kyle K. Kirby
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System and methods for forming apertures in microfeature workpieces
- Patent number 8,686,313
- Issue date Apr 1, 2014
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,669,179
- Issue date Mar 11, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for forming apertures in microfeature workpieces
- Patent number 8,664,562
- Issue date Mar 4, 2014
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming interconnects in a semiconductor structure
- Patent number 8,647,982
- Issue date Feb 11, 2014
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 8,637,994
- Issue date Jan 28, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic devices with improved heat dissipation and methods...
- Patent number 8,592,254
- Issue date Nov 26, 2013
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor components having conductive interconnects
- Patent number 8,546,931
- Issue date Oct 1, 2013
- Micron Technology, Inc.
- Alan G. Wood
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Systems and methods for forming apertures in microfeature workpieces
- Patent number 8,536,485
- Issue date Sep 17, 2013
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,502,353
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disabling electrical connections using pass-through 3D interconnect...
- Patent number 8,404,521
- Issue date Mar 26, 2013
- Micron Technology, Inc.
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive vias
- Patent number 8,324,100
- Issue date Dec 4, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfeature workpieces having alloyed conductive structures, and a...
- Patent number 8,308,053
- Issue date Nov 13, 2012
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for fabricating and filling conductive vias and conductive...
- Patent number 8,294,273
- Issue date Oct 23, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MI...
- Publication number 20240339360
- Publication date Oct 10, 2024
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MI...
- Publication number 20230106554
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MI...
- Publication number 20210005514
- Publication date Jan 7, 2021
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTER...
- Publication number 20180358263
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTR...
- Publication number 20180342477
- Publication date Nov 29, 2018
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES
- Publication number 20180304411
- Publication date Oct 25, 2018
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MI...
- Publication number 20170323828
- Publication date Nov 9, 2017
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20170320154
- Publication date Nov 9, 2017
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTR...
- Publication number 20170301639
- Publication date Oct 19, 2017
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES
- Publication number 20170283954
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES
- Publication number 20170008129
- Publication date Jan 12, 2017
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...
- Publication number 20160247747
- Publication date Aug 25, 2016
- Micron Technology, Inc.
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...
- Publication number 20140319697
- Publication date Oct 30, 2014
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTR...
- Publication number 20140284796
- Publication date Sep 25, 2014
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20140284375
- Publication date Sep 25, 2014
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES
- Publication number 20140209582
- Publication date Jul 31, 2014
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES
- Publication number 20140154879
- Publication date Jun 5, 2014
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES
- Publication number 20140014635
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20130295766
- Publication date Nov 7, 2013
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...
- Publication number 20130214421
- Publication date Aug 22, 2013
- Micron Technology, Inc.
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS
- Publication number 20130001780
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...
- Publication number 20130004792
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- Warren M. Farnworth
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...
- Publication number 20130003303
- Publication date Jan 3, 2013
- Micron Technology, Inc.
- Joseph T. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...
- Publication number 20120309128
- Publication date Dec 6, 2012
- Micron Technology, Inc.
- Jeffery W. Janzen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL APERTURES AND APPLICATIONS THEREOF
- Publication number 20120154945
- Publication date Jun 21, 2012
- William Mark Hiatt
- G02 - OPTICS
Information Patent Application
WAFER-LEVEL PACKAGED MICROELECTRONIC IMAGERS AND PROCESSES FOR WAFE...
- Publication number 20120104528
- Publication date May 3, 2012
- ROUND ROCK RESEARCH, LLC
- Salman Akram
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTRONIC DEVICES AND METHODS FOR FILING VIAS IN MICROELECTRO...
- Publication number 20120094482
- Publication date Apr 19, 2012
- Micron Technology, Inc.
- William M. Hiatt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC IMAGERS AND METHODS OF PACKAGING MICROELEC...
- Publication number 20120009717
- Publication date Jan 12, 2012
- Kyle K. Kirby
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Stacked Semiconductor Components Having Conductive Interconnects
- Publication number 20110175223
- Publication date Jul 21, 2011
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONDUCTIVE VIAS
- Publication number 20110136336
- Publication date Jun 9, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS

William Mark Hiatt

Person

Patents Grantslast 30 patents

Microfeature workpieces and methods for forming interconnects in mi...

Microfeature workpieces and methods for forming interconnects in mi...

Microelectronic devices and methods for filling vias in microelectr...

Semiconductor devices comprising nickel— and copper—containing inte...

Semiconductor devices comprising nickel- and copper-containing inte...

Systems and methods for forming apertures in microfeature workpieces

Microfeature workpieces having alloyed conductive structures, and a...

Microelectronic devices and methods for filling vias in microelectr...

Methods of forming interconnects and semiconductor structures

Disabling electrical connections using pass-through 3D interconnect...

Systems and methods for forming apertures in microfeature workpieces

Disabling electrical connections using pass-through 3D interconnect...

Multi-component integrated circuit contacts

Wafer-level packaged microelectronic imagers having interconnects f...

Disabling electrical connections using pass-through 3D interconnect...

Microelectronic devices and methods for filing vias in microelectro...

Packaged microelectronic imagers and methods of packaging microelec...

System and methods for forming apertures in microfeature workpieces

Through-wafer interconnects for photoimager and memory wafers

Systems and methods for forming apertures in microfeature workpieces

Methods of forming interconnects in a semiconductor structure

Microfeature workpieces having alloyed conductive structures, and a...

Microelectronic devices with improved heat dissipation and methods...

Stacked semiconductor components having conductive interconnects

Systems and methods for forming apertures in microfeature workpieces

Through-wafer interconnects for photoimager and memory wafers

Disabling electrical connections using pass-through 3D interconnect...

Methods of forming conductive vias

Microfeature workpieces having alloyed conductive structures, and a...

Methods for fabricating and filling conductive vias and conductive...

Patents Applicationslast 30 patents

MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MI...

MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MI...

MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MI...

SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTER...

MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTR...

SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES

MICROFEATURE WORKPIECES AND METHODS FOR FORMING INTERCONNECTS IN MI...

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTR...

METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES

SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES

DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...

DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...

MICROELECTRONIC DEVICES AND METHODS FOR FILLING VIAS IN MICROELECTR...

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES

METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES

SYSTEM AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...

MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS

MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND A...

MICROELECTRONIC DEVICES WITH IMPROVED HEAT DISSIPATION AND METHODS...

DISABLING ELECTRICAL CONNECTIONS USING PASS-THROUGH 3D INTERCONNECT...

OPTICAL APERTURES AND APPLICATIONS THEREOF

WAFER-LEVEL PACKAGED MICROELECTRONIC IMAGERS AND PROCESSES FOR WAFE...

MICROELECTRONIC DEVICES AND METHODS FOR FILING VIAS IN MICROELECTRO...

PACKAGED MICROELECTRONIC IMAGERS AND METHODS OF PACKAGING MICROELEC...

Stacked Semiconductor Components Having Conductive Interconnects

METHODS OF FORMING CONDUCTIVE VIAS