Willmar Subido

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,559,537
- Issue date Feb 11, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded wire bond wires
- Patent number 10,490,528
- Issue date Nov 26, 2019
- Invensas Corporation
- Ashok S. Prabhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 10,115,678
- Issue date Oct 30, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 10,008,469
- Issue date Jun 26, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 9,812,402
- Issue date Nov 7, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bonding metal wire bond wires to metal pads
- Patent number 9,761,554
- Issue date Sep 12, 2017
- Invensas Corporation
- Willmar Subido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupling of side surface contacts to a circuit platform
- Patent number 9,530,749
- Issue date Dec 27, 2016
- Invensas Corporation
- Reynaldo Co
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 9,502,372
- Issue date Nov 22, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 9,490,222
- Issue date Nov 8, 2016
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for laser assisted wirebonding
- Patent number 7,476,597
- Issue date Jan 13, 2009
- Texas Instruments Incorporated
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vibration-assisted method for underfilling flip-chip electronic dev...
- Patent number 6,855,578
- Issue date Feb 15, 2005
- Texas Instruments Incorporated
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding process for copper-metallized integrated circuits
- Patent number 6,800,555
- Issue date Oct 5, 2004
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaging semiconductor IC devices for failure analysis
- Patent number 6,521,479
- Issue date Feb 18, 2003
- Texas Instruments Incorporated
- Ray D. Harrison
- G01 - MEASURING TESTING
Information Patent Grant
Bonding pads for integrated circuits having copper interconnect met...
- Patent number 6,329,722
- Issue date Dec 11, 2001
- Texas Instruments Incorporated
- Wei-Yan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded flip-chip assembly of semiconductor devices
- Patent number 6,268,662
- Issue date Jul 31, 2001
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Angled transducer-dual head bonder for optimum ultrasonic power app...
- Patent number 6,182,882
- Issue date Feb 6, 2001
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Balancing of x and y axis bonding by 45 degree capillary positioning
- Patent number 6,131,792
- Issue date Oct 17, 2000
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Angled transducer-dual head bonder for optimum ultrasonic power app...
- Patent number 6,112,973
- Issue date Sep 5, 2000
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Balancing of x and y axis bonding by 45 degree capillary positioning
- Patent number 6,089,443
- Issue date Jul 18, 2000
- Texas Instruments Incorporated
- Edgardo R. Hortaleza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20200118939
- Publication date Apr 16, 2020
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20190027444
- Publication date Jan 24, 2019
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bond Wires for Interference Shielding
- Publication number 20180061774
- Publication date Mar 1, 2018
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20170117231
- Publication date Apr 27, 2017
- Invensas Corporation
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded wire bond wires
- Publication number 20170103968
- Publication date Apr 13, 2017
- Invensas Corporation
- Ashok S. PRABHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20170069591
- Publication date Mar 9, 2017
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL BONDING METAL WIRE BOND WIRES TO METAL PADS
- Publication number 20160329294
- Publication date Nov 10, 2016
- Invensas Corporation
- Willmar SUBIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COUPLING OF SIDE SURFACE CONTACTS TO A CIRCUIT PLATFORM
- Publication number 20160322325
- Publication date Nov 3, 2016
- Invensas Corporation
- Reynaldo CO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20160322326
- Publication date Nov 3, 2016
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING
- Publication number 20090029542
- Publication date Jan 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Willmar E. SUBIDO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Systems for Laser Assisted Wirebonding
- Publication number 20080009129
- Publication date Jan 10, 2008
- Willmar E. Subido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vibration-Assisted Method for Underfilling Flip-Chip Electronic Dev...
- Publication number 20080003721
- Publication date Jan 3, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibration-assisted method for underfilling flip-chip electronic dev...
- Publication number 20050253281
- Publication date Nov 17, 2005
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding process for copper-metallized integrated circuits
- Publication number 20050106851
- Publication date May 19, 2005
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vibration-assisted method for underfilling flip-chip electronic dev...
- Publication number 20040033643
- Publication date Feb 19, 2004
- Charles A. Odegard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding process for copper-metallized integrated circuits
- Publication number 20010035452
- Publication date Nov 1, 2001
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS

Willmar Subido

Person

Patents Grantslast 30 patents

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Wire bond wires for interference shielding

Embedded wire bond wires

Wire bond wires for interference shielding

Wafer-level packaging using wire bond wires in place of a redistrib...

Wire bond wires for interference shielding

Ball bonding metal wire bond wires to metal pads

Coupling of side surface contacts to a circuit platform

Wafer-level packaging using wire bond wires in place of a redistrib...

Wire bond wires for interference shielding

Methods and systems for laser assisted wirebonding

Vibration-assisted method for underfilling flip-chip electronic dev...

Wire bonding process for copper-metallized integrated circuits

Repackaging semiconductor IC devices for failure analysis

Bonding pads for integrated circuits having copper interconnect met...

Wire bonded flip-chip assembly of semiconductor devices

Angled transducer-dual head bonder for optimum ultrasonic power app...

Balancing of x and y axis bonding by 45 degree capillary positioning

Angled transducer-dual head bonder for optimum ultrasonic power app...

Balancing of x and y axis bonding by 45 degree capillary positioning

Patents Applicationslast 30 patents

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Wire Bond Wires for Interference Shielding

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

Embedded wire bond wires

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...

BALL BONDING METAL WIRE BOND WIRES TO METAL PADS

COUPLING OF SIDE SURFACE CONTACTS TO A CIRCUIT PLATFORM

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

Methods and Systems for Laser Assisted Wirebonding

Vibration-Assisted Method for Underfilling Flip-Chip Electronic Dev...

Vibration-assisted method for underfilling flip-chip electronic dev...

Wire bonding process for copper-metallized integrated circuits

Vibration-assisted method for underfilling flip-chip electronic dev...

Wire bonding process for copper-metallized integrated circuits