Wolfgang Hetzel

Person

Nattheim, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame-based semiconductor package
- Patent number 11,469,161
- Issue date Oct 11, 2022
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component comprising an interposer substrate
- Patent number 8,624,372
- Issue date Jan 7, 2014
- Infineon Technologies AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of attaching semiconductor dies to...
- Patent number 8,592,258
- Issue date Nov 26, 2013
- United Test and Assembly Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with plastic package molding compound, semicon...
- Patent number 8,072,085
- Issue date Dec 6, 2011
- Qimonda AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip ball grid array package and method of manufacture
- Patent number 7,851,899
- Issue date Dec 14, 2010
- UTAC - United Test and Assembly Test Center Ltd.
- Fung Leng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip device and method for producing a multi-chip device
- Patent number 7,402,911
- Issue date Jul 22, 2008
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable single package and stacked multi-chip assembly
- Patent number 7,265,441
- Issue date Sep 4, 2007
- Infineon Technologies AG
- Werner Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a stack arrangement of a memory module
- Patent number 7,198,979
- Issue date Apr 3, 2007
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component having stacked semiconductor chips in parallel...
- Patent number 6,977,427
- Issue date Dec 20, 2005
- Infineon Technologies AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack arrangement of a memory module
- Patent number 6,927,484
- Issue date Aug 9, 2005
- Infineon Technologies AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a stack of semiconductor chips and method...
- Patent number 6,894,381
- Issue date May 17, 2005
- Infineon Technologies AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device in a semiconductor manufacturing installation in particular...
- Patent number 6,075,358
- Issue date Jun 13, 2000
- Siemens Aktiengesellschaft
- Wolfgang Hetzel
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME-BASED SEMICONDUCTOR PACKAGE
- Publication number 20220068773
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20120034738
- Publication date Feb 9, 2012
- QIMONDA AG
- Denver Paul C. CASTILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE
- Publication number 20110162204
- Publication date Jul 7, 2011
- QIMONDA AG
- Werner Reiss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE WITH PLASTIC PACKAGE MOLDING COMPOUND, SEMICON...
- Publication number 20100032817
- Publication date Feb 11, 2010
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...
- Publication number 20090194871
- Publication date Aug 6, 2009
- UTAC - United Test and Assembly Test Center, Ltd.
- Denver Paul C. Castillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT
- Publication number 20080203581
- Publication date Aug 28, 2008
- QIMONDA AG
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE
- Publication number 20080064232
- Publication date Mar 13, 2008
- QIMONDA AG
- Werner Reiss
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multi-chip ball grid array package and method of manufacture
- Publication number 20070158815
- Publication date Jul 12, 2007
- Fung Leng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated chip device in a package
- Publication number 20070090527
- Publication date Apr 26, 2007
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component comprising an interposer substrate and meth...
- Publication number 20070040261
- Publication date Feb 22, 2007
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable single package and stacked multi-chip assembly
- Publication number 20070035006
- Publication date Feb 15, 2007
- Werner Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chip device and method for producing a multi-chip device
- Publication number 20060290005
- Publication date Dec 28, 2006
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device having a stack of semiconductor chips and method...
- Publication number 20040159954
- Publication date Aug 19, 2004
- Infineon Technologies AG
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a stack arrangement of a memory module
- Publication number 20040126910
- Publication date Jul 1, 2004
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack arrangement of a memory module
- Publication number 20040113256
- Publication date Jun 17, 2004
- Jochen Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component having stacked semiconductor chips in parallel...
- Publication number 20040108585
- Publication date Jun 10, 2004
- Wolfgang Hetzel
- H01 - BASIC ELECTRIC ELEMENTS

Wolfgang Hetzel

Person

Patents Grantslast 30 patents

Lead frame-based semiconductor package

Semiconductor component comprising an interposer substrate

Semiconductor package and method of attaching semiconductor dies to...

Semiconductor device with plastic package molding compound, semicon...

Multi-chip ball grid array package and method of manufacture

Multi-chip device and method for producing a multi-chip device

Stackable single package and stacked multi-chip assembly

Method for manufacturing a stack arrangement of a memory module

Electronic component having stacked semiconductor chips in parallel...

Stack arrangement of a memory module

Electronic device having a stack of semiconductor chips and method...

Device in a semiconductor manufacturing installation in particular...

Patents Applicationslast 30 patents

LEAD FRAME-BASED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...

INTEGRATED DEVICE

SEMICONDUCTOR DEVICE WITH PLASTIC PACKAGE MOLDING COMPOUND, SEMICON...

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO...

INTEGRATED CIRCUIT

INTEGRATED DEVICE

Multi-chip ball grid array package and method of manufacture

Integrated chip device in a package

Semiconductor component comprising an interposer substrate and meth...

Stackable single package and stacked multi-chip assembly

Multi-chip device and method for producing a multi-chip device

Electronic device having a stack of semiconductor chips and method...

Method for manufacturing a stack arrangement of a memory module

Stack arrangement of a memory module

Electronic component having stacked semiconductor chips in parallel...