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Patents Grants
last 30 patents
Information
Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
Patent number
11,189,548
Issue date
Nov 30, 2021
Micron Technology, Inc.
Ai-Chie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
Patent number
9,721,874
Issue date
Aug 1, 2017
Micron Technology, Inc.
Ai Chie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic die packages with leadframes, including leadframe-b...
Patent number
8,525,320
Issue date
Sep 3, 2013
Micron Technology, Inc.
Meow Koon Eng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pre-encapsulated lead frames for microelectronic device packages, a...
Patent number
8,357,566
Issue date
Jan 22, 2013
Micron Technology, Inc.
Ai-Chie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for flip-chip packaging providing testing capability
Patent number
7,915,718
Issue date
Mar 29, 2011
Micron Technology, Inc.
Teck Kheng Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods relating to the reconstruction of semiconductor wafers for...
Patent number
7,820,459
Issue date
Oct 26, 2010
Micron Technology, Inc.
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for packaging microelectronic devices
Patent number
7,754,531
Issue date
Jul 13, 2010
Micron Technology, Inc.
Wuu Yean Tay
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus relating to the reconstruction of semiconductor wafers fo...
Patent number
7,573,006
Issue date
Aug 11, 2009
Micron Technology, Inc.
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods relating to the reconstruction of semiconductor wafers for...
Patent number
7,425,462
Issue date
Sep 16, 2008
Micron Technology, Inc.
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for designing carrier substrates with raised terminals
Patent number
7,368,391
Issue date
May 6, 2008
Micron Technology, Inc.
Cher Khng Victor Tan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit (IC) test assembly including phase change materi...
Patent number
7,285,971
Issue date
Oct 23, 2007
Micron Technology, Inc.
Pak Hong Yee
G01 - MEASURING TESTING
Information
Patent Grant
Reconstructed semiconductor wafers including alignment droplets con...
Patent number
7,190,074
Issue date
Mar 13, 2007
Micron Technology, Inc.
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for ball grid array chip packages having improved testing an...
Patent number
7,116,122
Issue date
Oct 3, 2006
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Methods relating to the reconstruction of semiconductor wafers for...
Patent number
7,071,012
Issue date
Jul 4, 2006
Micron Technology, Inc.
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder masks including dams for at least partially surrounding term...
Patent number
7,061,124
Issue date
Jun 13, 2006
Micron Technology, Inc.
Cher Khng Victor Tan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit (IC) test assembly including phase change materi...
Patent number
7,030,640
Issue date
Apr 18, 2006
Micron Technology, Inc.
Pak Hong Yee
G01 - MEASURING TESTING
Information
Patent Grant
Solder masks for use on carrier substrates, carrier substrates and...
Patent number
7,018,871
Issue date
Mar 28, 2006
Micron Technology, Inc.
Cher Khng Victor Tan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods and apparatus for testing and burn-in of semiconductor devices
Patent number
6,856,155
Issue date
Feb 15, 2005
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Method for ball grid array chip packages having improved testing an...
Patent number
6,847,220
Issue date
Jan 25, 2005
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Solder masks for use on carrier substrates, carrier substrates and...
Patent number
6,787,923
Issue date
Sep 7, 2004
Micron Technology, Inc.
Cher Khng Victor Tan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for ball grind array chip packages having improved testing a...
Patent number
6,740,983
Issue date
May 25, 2004
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Ball grid array chip packages having improved testing and stacking...
Patent number
6,740,984
Issue date
May 25, 2004
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Ball grid array chip packages having improved testing and stacking...
Patent number
6,693,363
Issue date
Feb 17, 2004
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Ball grid array chip packages having improved testing and stacking...
Patent number
6,674,175
Issue date
Jan 6, 2004
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Method for ball grid array chip packages having improved testing an...
Patent number
6,600,335
Issue date
Jul 29, 2003
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Ball grid array chip packages having improved testing and stacking...
Patent number
6,522,018
Issue date
Feb 18, 2003
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Ball grid array chip packages having improved testing and stacking...
Patent number
6,522,019
Issue date
Feb 18, 2003
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Ball grid array chip packages having improved testing and stacking...
Patent number
6,448,664
Issue date
Sep 10, 2002
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Grant
Ball grid array chip packages having improved testing and stacking...
Patent number
6,420,789
Issue date
Jul 16, 2002
Micron Technology, Inc.
Wuu Yean Tay
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, A...
Publication number
20170288177
Publication date
Oct 5, 2017
Micron Technology, Inc.
Ai Chie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRE-ENCAPSULATED LEAD FRAMES FOR MICROELECTRONIC DEVICE PACKAGES, A...
Publication number
20130127027
Publication date
May 23, 2013
Micron Technology, Inc.
Ai Chie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS RELATING TO THE RECONSTRUCTION OF SEMICONDUCTOR WAFERS FOR...
Publication number
20080311685
Publication date
Dec 18, 2008
Micron Technology, Inc.
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Pre-encapsulated lead frames for microelectronic device packages, a...
Publication number
20080048301
Publication date
Feb 28, 2008
Micron Technology, Inc.
Ai-Chie Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods relating to the reconstruction of semiconductor wafers for...
Publication number
20060240582
Publication date
Oct 26, 2006
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method and apparatus for flip-chip packaging providing testing capa...
Publication number
20060240595
Publication date
Oct 26, 2006
Teck Kheng Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods for designing carrier substrates with raised terminals
Publication number
20050287702
Publication date
Dec 29, 2005
Cher Khng Victor Tan
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Reconstructed semiconductor wafers
Publication number
20050275116
Publication date
Dec 15, 2005
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit (IC) test assembly including phase change materi...
Publication number
20050270051
Publication date
Dec 8, 2005
Pak Hong Yee
G01 - MEASURING TESTING
Information
Patent Application
Apparatus relating to the reconstruction of semiconductor wafers fo...
Publication number
20050263517
Publication date
Dec 1, 2005
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit (IC) test assembly including phase change materi...
Publication number
20050200376
Publication date
Sep 15, 2005
Pak Hong Yee
G01 - MEASURING TESTING
Information
Patent Application
Method for ball grid array chip packages having improved testing an...
Publication number
20050127531
Publication date
Jun 16, 2005
Wuu Yean Tay
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Solder masks including dams for at least partially surrounding term...
Publication number
20050029676
Publication date
Feb 10, 2005
Cher Khng Victor Tan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Apparatus, systems and methods relating to the reconstruction of se...
Publication number
20050003575
Publication date
Jan 6, 2005
Yong Kian Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Solder masks for use on carrier substrates, carrier substrates and...
Publication number
20040077109
Publication date
Apr 22, 2004
Cher Khng Victor Tan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods and apparatus for testing and burn-in of semiconductor devices
Publication number
20040032273
Publication date
Feb 19, 2004
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Application
Method for ball grid array chip packages having improved testing an...
Publication number
20040021477
Publication date
Feb 5, 2004
Wuu Yean Tay
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Solder masks for use on carrier substrates, carrier substrates and...
Publication number
20030193092
Publication date
Oct 16, 2003
Cher Khng Victor Tan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method and apparatus for flip-chip packaging providing testing capa...
Publication number
20030164551
Publication date
Sep 4, 2003
Teck Kheng Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Ball grid array chip packages having improved testing and stacking...
Publication number
20030112614
Publication date
Jun 19, 2003
Wuu Yean Tay
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
Ball grid array chip packages having improved testing and stacking...
Publication number
20030001288
Publication date
Jan 2, 2003
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Application
Ball grid array chip packages having improved testing and stacking...
Publication number
20020195614
Publication date
Dec 26, 2002
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Application
Ball grid array chip packages having improved testing and stacking...
Publication number
20020153602
Publication date
Oct 24, 2002
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Application
Ball grid array chip packages having improved testing and stacking...
Publication number
20020130413
Publication date
Sep 19, 2002
Wuu Yean Tay
G01 - MEASURING TESTING
Information
Patent Application
Ball grid array chip packages having improved testing and stacking...
Publication number
20020043986
Publication date
Apr 18, 2002
Wuu Yean Tay
G01 - MEASURING TESTING